Chemical vapour deposition [CVD]

Industry

CPC
H01L2224/11827

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11827Chemical vapour deposition [CVD]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 9,735,123
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to prevent solder extrusion
- Patent number 9,613,921
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,368,390
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a conductive pillar bump with non-metal sidewall p...
- Patent number 9,287,171
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing semiconductor die having hydrophobic coatings, an...
- Patent number 9,220,183
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Daniel J. Buvid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 9,136,167
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,941,238
- Issue date Jan 27, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Nobuo Aoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,841,766
- Issue date Sep 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Copper pillar bump with non-metal sidewall protection structure and...
- Patent number 8,823,167
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming copper pillar bumps
- Patent number 8,659,155
- Issue date Feb 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride passivation layer for covering high aspect ratio fe...
- Patent number 8,563,095
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,441,124
- Issue date May 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including a metal alloy between a first con...
- Patent number 8,378,490
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming metal pillar
- Patent number 8,242,011
- Issue date Aug 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nano-coatings for improved adhesion between firs...
- Patent number 7,781,260
- Issue date Aug 24, 2010
- Intel Corporation
- Sandeep Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrostatic discharge protection using a...
- Patent number 7,629,202
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making microelectronic spring contact elements
- Patent number 6,184,053
- Issue date Feb 6, 2001
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20150325546
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...
- Publication number 20140335687
- Publication date Nov 13, 2014
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130140696
- Publication date Jun 6, 2013
- PANASONIC CORPORATION
- Nobuo AOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20130130496
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND...
- Publication number 20120280388
- Publication date Nov 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20120235301
- Publication date Sep 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING METAL PILLAR
- Publication number 20120178251
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120018880
- Publication date Jan 26, 2012
- Kun-Tai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110266667
- Publication date Nov 3, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110233761
- Publication date Sep 29, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE DIRECT METAL-METAL BONDING
- Publication number 20110226841
- Publication date Sep 22, 2011
- Jun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE PASSIVATION LAYER FOR COVERING HIGH ASPECT RATIO FE...
- Publication number 20110223765
- Publication date Sep 15, 2011
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MECHANISMS FOR FORMING COPPER PILLAR BUMPS
- Publication number 20110101527
- Publication date May 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR BUMP WITH BARRIER LAYER
- Publication number 20110101523
- Publication date May 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming nano-coatings for improved adhesion between firs...
- Publication number 20090065932
- Publication date Mar 12, 2009
- Sandeep Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20090001544
- Publication date Jan 1, 2009
- Chung Kyung Jung
- H01 - BASIC ELECTRIC ELEMENTS

Chemical vapour deposition [CVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Semiconductor package and method for manufacturing the same

Method of making a pillar structure having a non-metal sidewall pro...

Method of producing a hybridized device including microelectronic c...

Semiconductor device structure and manufacturing method

Structure to prevent solder extrusion

Semiconductor apparatus

Method of making a conductive pillar bump with non-metal sidewall p...

Devices employing semiconductor die having hydrophobic coatings, an...

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor device

Cu pillar bump with non-metal sidewall protection structure

Copper pillar bump with non-metal sidewall protection structure and...

Mechanisms for forming copper pillar bumps

Silicon nitride passivation layer for covering high aspect ratio fe...

Cu pillar bump with non-metal sidewall protection structure

Semiconductor apparatus including a metal alloy between a first con...

Method of forming metal pillar

Doping minor elements into metal bumps

Methods of forming nano-coatings for improved adhesion between firs...

Method and apparatus for electrostatic discharge protection using a...

Method of making microelectronic spring contact elements

Patents Applicationslast 30 patents

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS

Doping Minor Elements into Metal Bumps

COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND...

SEMICONDUCTOR APPARATUS

METHOD OF FORMING METAL PILLAR

Doping Minor Elements into Metal Bumps

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE

CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

SILICON NITRIDE PASSIVATION LAYER FOR COVERING HIGH ASPECT RATIO FE...

MECHANISMS FOR FORMING COPPER PILLAR BUMPS

PILLAR BUMP WITH BARRIER LAYER

METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...

Methods of forming nano-coatings for improved adhesion between firs...

CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME