Chip-on-leads or leads-on-chip techniques

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H01L23/4951

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4951Chip-on-leads or leads-on-chip techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low cost embedded integrated circuit dies
- Patent number 12,368,089
- Issue date Jul 22, 2025
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) and electronic apparatus
- Patent number 12,362,265
- Issue date Jul 15, 2025
- Nuvoton Technology Corporation
- Uri Trichter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,362,264
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMDs integration on QFN by 3D stacked solution
- Patent number 12,354,932
- Issue date Jul 8, 2025
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tip connection portion of terminal member and associated semiconduc...
- Patent number 12,347,750
- Issue date Jul 1, 2025
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leaded semiconductor device package having leads with different widths
- Patent number 12,334,417
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 12,334,414
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a lead and a sealing resin
- Patent number 12,327,780
- Issue date Jun 10, 2025
- Rohm Co., Ltd.
- Tomonori Tanioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mask for thermal pad of a printed circuit board to provide r...
- Patent number 12,322,692
- Issue date Jun 3, 2025
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 12,293,960
- Issue date May 6, 2025
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, article comprising the same and manufacturing metho...
- Patent number 12,288,736
- Issue date Apr 29, 2025
- Prevayl Innovations Limited
- Michael John Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,272,627
- Issue date Apr 8, 2025
- Kabushiki Kaisha Toshiba
- Hiroshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal clip and related methods of ma...
- Patent number 12,266,628
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 12,261,145
- Issue date Mar 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,249,560
- Issue date Mar 11, 2025
- Rohm Co., Ltd
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250239505
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH DIE AND COPPER POSTS
- Publication number 20250239507
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226276
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...
- Publication number 20250226353
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Chin Yong Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR PACKAGE
- Publication number 20250226295
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
- Publication number 20250226298
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210578
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE
- Publication number 20250210471
- Publication date Jun 26, 2025
- NXP B.V.
- Chanon SUWANKASAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250210474
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Yoshiki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210475
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250201676
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201673
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuki MATSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201678
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20250192093
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20250183132
- Publication date Jun 5, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250183125
- Publication date Jun 5, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT
- Publication number 20250183124
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183099
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Yi-Hung HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for Large Area Attaches for Semiconductor Packages
- Publication number 20250183119
- Publication date Jun 5, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250157897
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP
- Publication number 20250157893
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...
- Publication number 20250149506
- Publication date May 8, 2025
- Kirill Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149411
- Publication date May 8, 2025
- FUJI ELECTRIC CO., LTD.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS

Chip-on-leads or leads-on-chip techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost embedded integrated circuit dies

Integrated circuit (IC) and electronic apparatus

Semiconductor device

SMDs integration on QFN by 3D stacked solution

Semiconductor device and a method of manufacture

Tip connection portion of terminal member and associated semiconduc...

Inverted leads for packaged isolation devices

Leaded semiconductor device package having leads with different widths

Power semiconductor device with dual heat dissipation structures

Semiconductor device including a lead and a sealing resin

Solder mask for thermal pad of a printed circuit board to provide r...

Semiconductor device package

Semiconductor device having wire pieces in bonding member

Semiconductor apparatus

Side-solderable leadless package

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor device and method for manufacturing the same

Sensor package, article comprising the same and manufacturing metho...

Semiconductor device

Leadless current sensor package with high isolation

Semiconductor package having a metal clip and related methods of ma...

Semiconductor device and methods of manufacturing semiconductor dev...

Semiconductor package having wettable lead flanks and tie bars and...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device and method for manufacturing the same

Semiconductor manufacturing apparatus and method of manufacturing s...

Electronic devices in semiconductor package cavities

Electronic device with multi-layer contact and system

Electronic device and method for manufacturing electronic device

Lead frame and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

IC PACKAGE WITH DIE AND COPPER POSTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...

MULTI-DIE SEMICONDUCTOR PACKAGE

EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Underfill for Large Area Attaches for Semiconductor Packages

LEAD FRAME AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE

DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP

POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...