Chip-on-leads or leads-on-chip techniques

Industry

CPC
H01L23/4951

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4951Chip-on-leads or leads-on-chip techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
- Patent number 11,973,011
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor products, corresponding subst...
- Patent number 11,967,544
- Issue date Apr 23, 2024
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including capacitor having segmented bottom plate
- Patent number 11,961,879
- Issue date Apr 16, 2024
- Texas Instruments Incorporated
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,961,790
- Issue date Apr 16, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact leadframe package
- Patent number 11,948,868
- Issue date Apr 2, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,948,869
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Naoki Okawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-shaped firing material and film-shaped firing material with a...
- Patent number 11,948,865
- Issue date Apr 2, 2024
- Lintec Corporation
- Takeshi Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge semiconductor device
- Patent number 11,942,401
- Issue date Mar 26, 2024
- Nexperia B.V.
- Dilder Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead package with wettable flanges
- Patent number 11,935,821
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of the same
- Patent number 11,935,844
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated semiconductor package with HV isolator on block
- Patent number 11,929,311
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Vivek K Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising first and second lead frames
- Patent number 11,929,306
- Issue date Mar 12, 2024
- Kabushiki Kaisha Toshiba
- Kakeru Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames for cooling a power device
- Patent number 11,929,307
- Issue date Mar 12, 2024
- Hitachi Astemo, Ltd.
- Yusuke Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency packages containing substrates with coefficient of...
- Patent number 11,929,310
- Issue date Mar 12, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame assembly, semiconductor package and methods for improved...
- Patent number 11,923,275
- Issue date Mar 5, 2024
- NXP USA, INC.
- Allen Marfil Descartin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal die attach to substrate with multi-...
- Patent number 11,908,776
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 11,901,253
- Issue date Feb 13, 2024
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,901,316
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kentaro Chikamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,894,280
- Issue date Feb 6, 2024
- Fuji Electric Co., Ltd.
- Yoshiaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
- Publication number 20240145429
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Riccardo VILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145349
- Publication date May 2, 2024
- DENSO CORPORATION
- TAKAHIRO HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145350
- Publication date May 2, 2024
- MEDIATEK INC.
- Pu-Shan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240145356
- Publication date May 2, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT
- Publication number 20240145348
- Publication date May 2, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240136256
- Publication date Apr 25, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPOSITION FOR BONDING, BONDING STRUCTURE USING SAME, A...
- Publication number 20240116104
- Publication date Apr 11, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi KONNO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INSULATION MODULE
- Publication number 20240113093
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Masahiko ARIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS
- Publication number 20240113064
- Publication date Apr 4, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112988
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Kaori UEBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY
- Publication number 20240112977
- Publication date Apr 4, 2024
- LITTELFUSE, INC.
- Rhodri Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20240112995
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Moe YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105558
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Eitaro MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240105559
- Publication date Mar 28, 2024
- KOA Corporation
- Hirofumi KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...
- Publication number 20240105544
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Shih Kien LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105562
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Taira Tabakoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...
- Publication number 20240096767
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hank Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE
- Publication number 20240096768
- Publication date Mar 21, 2024
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
- Publication number 20240096759
- Publication date Mar 21, 2024
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...
- Publication number 20240096761
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- BARRY JON MALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR
- Publication number 20240096763
- Publication date Mar 21, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087996
- Publication date Mar 14, 2024
- ROHM CO., LTD.
- Kazuki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088086
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Masatoshi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...
- Publication number 20240087993
- Publication date Mar 14, 2024
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS

Chip-on-leads or leads-on-chip techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module

Stud bump for wirebonding high voltage isolation barrier connection

Semiconductor device

Semiconductor device and method for manufacturing the same

Method of manufacturing semiconductor products, corresponding subst...

IC including capacitor having segmented bottom plate

Semiconductor module

Compact leadframe package

Semiconductor device and method for manufacturing the same

Process for thin film capacitor integration

Film-shaped firing material and film-shaped firing material with a...

Electronic devices in semiconductor package cavities

Half-bridge semiconductor device

Quad flat no-lead package with wettable flanges

Semiconductor device and method of the same

Circuit module having a plurality of lead frames connected to a sub...

Method for manufacturing leadless semiconductor package with wettab...

Isolated semiconductor package with HV isolator on block

Semiconductor device comprising first and second lead frames

Plurality of lead frames for cooling a power device

Radio frequency packages containing substrates with coefficient of...

Lead-frame assembly, semiconductor package and methods for improved...

Power semiconductor device with dual heat dissipation structures

Semiconductor package with plurality of leads and sealing resin

Semiconductor package with solder standoff

Semiconductor device with metal die attach to substrate with multi-...

Electronic device and method for manufacturing same

Semiconductor device

Discontinuous patterned bonds for semiconductor devices and associa...

Semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LEAD FRAME AND MANUFACTURING METHOD THEREOF

CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

CONDUCTIVE COMPOSITION FOR BONDING, BONDING STRUCTURE USING SAME, A...

INSULATION MODULE

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS

SEMICONDUCTOR DEVICE

ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY

SEMICONDUCTOR EQUIPMENT

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...

SEMICONDUCTOR DEVICE

VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...

SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE

SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION

SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...

PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR DEVICE

MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...

Two-In-One Lead Frame Package