Chromium [Cr] as principal constituent

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CPC
H01L2224/05671

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05671Chromium [Cr] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
- Patent number 11,764,752
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Masatoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 11,735,699
- Issue date Aug 22, 2023
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having exposed redistribution layer features...
- Patent number 11,600,523
- Issue date Mar 7, 2023
- Microchip Technology Incorporated
- ManKit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,557,641
- Issue date Jan 17, 2023
- Samsung Display Co., Ltd.
- Byeong Beom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip fabrication and packaging methods thereof
- Patent number 11,335,648
- Issue date May 17, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Hui Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 11,257,996
- Issue date Feb 22, 2022
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 11,205,608
- Issue date Dec 21, 2021
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-pinning metal pads for electronic components
- Patent number 11,166,381
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 11,152,319
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electroplating compositions and methods of electroplating co...
- Patent number 10,927,468
- Issue date Feb 23, 2021
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method for semiconductor device...
- Patent number 10,727,166
- Issue date Jul 28, 2020
- ADVANCED INTERCONNECT SYSTEMS LIMITED
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 10,651,142
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,615,137
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper electroplating compositions and methods of electroplating co...
- Patent number 10,533,259
- Issue date Jan 14, 2020
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...
- Publication number 20240395747
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240393653
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20240297086
- Publication date Sep 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS AND METHOD OF MANUFAC...
- Publication number 20240063186
- Publication date Feb 22, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- SEYONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
- Publication number 20230420437
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRIC P...
- Publication number 20230197649
- Publication date Jun 22, 2023
- Mitsubishi Electric Corporation
- Yuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backlight Unit and Display Device Including the Same
- Publication number 20230170342
- Publication date Jun 1, 2023
- LG Display Co., Ltd.
- ChangKyeong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...
- Publication number 20230113637
- Publication date Apr 13, 2023
- KYOCERA CORPORATION
- Takanori WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20220140212
- Publication date May 5, 2022
- Nichia Corporation.
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20220115296
- Publication date Apr 14, 2022
- Advanced Interconnect Systems Limited
- Haruki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210265446
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byeong Beom KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...
- Publication number 20200357724
- Publication date Nov 12, 2020
- Advanced Interconnect Systems Limited
- Haruki Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273827
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP FABRICATION AND PACKAGING METHODS THEREOF
- Publication number 20200098704
- Publication date Mar 26, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Hui LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190259719
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20190259724
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190206841
- Publication date Jul 4, 2019
- SAMSUNG ELECTRONICS CO., LTD.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip, Method for Producing a Power Semiconducto...
- Publication number 20190148318
- Publication date May 16, 2019
- SEMIKRON Elektronik GmbH & Co., KG
- Wolfgang-Michael SCHULZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139917
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Chromium [Cr] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor product with interlocking metal-to-metal bonds and me...

Fingerprint sensor and manufacturing method thereof

Display device

Methods of manufacturing a semiconductor device including a joint a...

Elastic wave device

Light emitting apparatus and method for producing the same

Protective surface layer on under bump metallurgy for solder joining

Power semiconductor chip, method for producing a power semiconducto...

Semiconductor package having exposed redistribution layer features...

Display device

Fingerprint sensor and manufacturing method thereof

Semiconductor chip fabrication and packaging methods thereof

Interconnect crack arrestor structure and methods

Light emitting apparatus and method for producing the same

Semiconductor device, manufacturing method for semiconductor device...

Solder-pinning metal pads for electronic components

Micro-connection structure and manufacturing method thereof

Semiconductor product with interlocking metal-to-metal bonds and me...

Interconnection structure including a metal post encapsulated by a...

Copper electroplating compositions and methods of electroplating co...

Metal bonding pads for packaging applications

Dummy flip chip bumps for reducing stress

Bump bonded cryogenic chip carrier

Semiconductor device, manufacturing method for semiconductor device...

Bump bonded cryogenic chip carrier

Method of making fully molded peripheral package on package device

Micro-connection structure and manufacturing method thereof

Packaging devices and methods of manufacture thereof

Corrosion resistant aluminum bond pad structure

Copper electroplating compositions and methods of electroplating co...

Patents Applicationslast 30 patents

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS AND METHOD OF MANUFAC...

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRIC P...

Backlight Unit and Display Device Including the Same

LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...

DISPLAY DEVICE

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE...

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP FABRICATION AND PACKAGING METHODS THEREOF

Interconnect Crack Arrestor Structure and Methods

METAL BONDING PADS FOR PACKAGING APPLICATIONS

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

Dummy Flip Chip Bumps for Reducing Stress

SEMICONDUCTOR PACKAGE

Power Semiconductor Chip, Method for Producing a Power Semiconducto...

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF