Circuit made after mounting or encapsulation of the components

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CPC
H05K2203/1469

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1469Circuit made after mounting or encapsulation of the components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,812,556
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component package and printed circuit board for the same
- Patent number 11,638,346
- Issue date Apr 25, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 11,570,904
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and method for manufacturing display panel
- Patent number 11,532,602
- Issue date Dec 20, 2022
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Chao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device
- Patent number 11,327,468
- Issue date May 10, 2022
- Omron Corporation
- Wakahiro Kawai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Mechanically robust component carrier with rigid and flexible portions
- Patent number 11,324,126
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having image sensor with metal wire electrically conn...
- Patent number 11,228,698
- Issue date Jan 18, 2022
- TDK TAIWAN CORP.
- Chao-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,096,286
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,058,012
- Issue date Jul 6, 2021
- Unimicron Technology Corp.
- Chien-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic layer as carrier for component embedded in cavity of compo...
- Patent number 11,058,004
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with two component carrier portions and a compone...
- Patent number 11,058,007
- Issue date Jul 6, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board incorporating electronic component and manufacturing...
- Patent number 10,917,974
- Issue date Feb 9, 2021
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a first electronic component and a second...
- Patent number 10,890,813
- Issue date Jan 12, 2021
- Omron Corporation
- Wakahiro Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a printed circuit board including an embed...
- Patent number 10,887,995
- Issue date Jan 5, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding a component in a printed circuit board
- Patent number 10,779,413
- Issue date Sep 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module
- Patent number 10,694,086
- Issue date Jun 23, 2020
- TDK TAIWAN CORP.
- Chao-Chang Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods and devices for improved space utilization in wafer based m...
- Patent number 10,681,821
- Issue date Jun 9, 2020
- The Charles Stark Draper Laboratory, Inc.
- Maurice S. Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 10,674,608
- Issue date Jun 2, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,645,819
- Issue date May 5, 2020
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 10,645,816
- Issue date May 5, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,643,949
- Issue date May 5, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery embedded architecture for supplying appropriate voltage
- Patent number 10,637,105
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 10,631,411
- Issue date Apr 21, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 10,631,415
- Issue date Apr 21, 2020
- Omron Corporation
- Wakahiro Kawai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with embedded electronic component
- Patent number 10,568,210
- Issue date Feb 18, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Galler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for strain sensing using aerosol jet printing o...
- Patent number 10,512,162
- Issue date Dec 17, 2019
- Boise State University
- David Estrada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186261
- Publication date Jun 6, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...
- Publication number 20230292446
- Publication date Sep 14, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- LAN-TING CHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PACKAGE AND PRINTED CIRCUIT BOARD FOR THE SAME
- Publication number 20220053631
- Publication date Feb 17, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Component in Component Carrier by Component Fixation Stru...
- Publication number 20220053633
- Publication date Feb 17, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE
- Publication number 20210298184
- Publication date Sep 23, 2021
- Unimicron Technology Corp.
- Chien-Chen LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210014975
- Publication date Jan 14, 2021
- Unimicron Technology Corp.
- Chien-Chen LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mechanically Robust Component Carrier With Rigid and Flexible Portions
- Publication number 20200367370
- Publication date Nov 19, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND METHOD FOR MANUFACTURING DISPLAY PANEL
- Publication number 20200312820
- Publication date Oct 1, 2020
- BOE TECHNOLOGY GROUP CO., LTD.
- Chao LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Contacting and Rewiring an Electronic Component Embedded...
- Publication number 20200305286
- Publication date Sep 24, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20200280658
- Publication date Sep 3, 2020
- TDK TAIWAN CORP.
- Chao-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200100368
- Publication date Mar 26, 2020
- Omron Corporation
- Wakahiro KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mechanically Robust Component Carrier With Rigid and Flexible Portions
- Publication number 20200053887
- Publication date Feb 13, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contacting Embedded Electronic Component Via Wiring Structure in a...
- Publication number 20190393155
- Publication date Dec 26, 2019
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Burned-in Component Assembly
- Publication number 20190174630
- Publication date Jun 6, 2019
- VNS Portfolio LLC
- Joseph Charles Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20180352658
- Publication date Dec 6, 2018
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20180324952
- Publication date Nov 8, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jung Hyun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND M...
- Publication number 20180279478
- Publication date Sep 27, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device With Embedded Electronic Component
- Publication number 20180279479
- Publication date Sep 27, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Galler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY METHOD
- Publication number 20180263117
- Publication date Sep 13, 2018
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20180092215
- Publication date Mar 29, 2018
- Omron Corporation
- Wakahiro KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE INTEGRATED CIRCUIT THAT INCLUDES AN ANTENNA
- Publication number 20180049326
- Publication date Feb 15, 2018
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT
- Publication number 20170352471
- Publication date Dec 7, 2017
- IBIDEN CO., LTD.
- Yasuhiko Mano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contacting Embedded Electronic Component Via Wiring Structure in a...
- Publication number 20170330837
- Publication date Nov 16, 2017
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE FABRICATION TECHNIQUES AND CIRCUIT PACKAGING DEVICES
- Publication number 20160330837
- Publication date Nov 10, 2016
- The Regents of the University of California
- Todd Prentice Coleman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CON...
- Publication number 20160143153
- Publication date May 19, 2016
- 3M Innovative Properties Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING AN ELECTRICAL DEVICE PACKAGE STRUCTURE
- Publication number 20160007472
- Publication date Jan 7, 2016
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20150271924
- Publication date Sep 24, 2015
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140353017
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Kota NODA
- H01 - BASIC ELECTRIC ELEMENTS

Circuit made after mounting or encapsulation of the components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedding component in component carrier by component fixation stru...

Printed circuit board and manufacturing method thereof

Component package and printed circuit board for the same

Method for contacting and rewiring an electronic component embedded...

Display panel and method for manufacturing display panel

Control device

Mechanically robust component carrier with rigid and flexible portions

Camera module having image sensor with metal wire electrically conn...

Printed circuit board and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Metallic layer as carrier for component embedded in cavity of compo...

Component carrier with two component carrier portions and a compone...

Circuit board incorporating electronic component and manufacturing...

Electronic device having a first electronic component and a second...

Method for manufacturing a printed circuit board including an embed...

Electronic device

Method of manufacturing a component embedded package carrier

Method of embedding a component in a printed circuit board

Camera module

Methods and devices for improved space utilization in wafer based m...

Printed circuit board and manufacturing method thereof

Printed wiring board

Method for contacting and rewiring an electronic component embedded...

Component carrier and method for manufacturing the same

Battery embedded architecture for supplying appropriate voltage

Printed circuit board and manufacturing method thereof

Electronic device and manufacturing method thereof

Electronic device

Electronic device with embedded electronic component

Systems and methods for strain sensing using aerosol jet printing o...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...

COMPONENT PACKAGE AND PRINTED CIRCUIT BOARD FOR THE SAME

Embedding Component in Component Carrier by Component Fixation Stru...

METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Mechanically Robust Component Carrier With Rigid and Flexible Portions

DISPLAY PANEL AND METHOD FOR MANUFACTURING DISPLAY PANEL

Method for Contacting and Rewiring an Electronic Component Embedded...

CAMERA MODULE

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Mechanically Robust Component Carrier With Rigid and Flexible Portions

Contacting Embedded Electronic Component Via Wiring Structure in a...

Burned-in Component Assembly

COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND M...

Electronic Device With Embedded Electronic Component

FLEXIBLE ELECTRONIC ASSEMBLY METHOD

CIRCUIT STRUCTURE

FLEXIBLE INTEGRATED CIRCUIT THAT INCLUDES AN ANTENNA

INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT

Contacting Embedded Electronic Component Via Wiring Structure in a...

SCALABLE FABRICATION TECHNIQUES AND CIRCUIT PACKAGING DEVICES

BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CON...

METHOD OF FABRICATING AN ELECTRICAL DEVICE PACKAGE STRUCTURE

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME