Circuits for electrically characterising or monitoring manufacturing processes

Industry

CPC
H01L22/34

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/34Circuits for electrically characterising or monitoring manufacturing processes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,967,624
- Issue date Apr 23, 2024
- Hitachi, Ltd.
- Naoki Tega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HVMOS reliability evaluation using bulk resistances as indices
- Patent number 11,955,389
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method for tolerance against the hot carrier effect
- Patent number 11,953,542
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yifei Pan
- G11 - INFORMATION STORAGE
Information Patent Grant
Transmission-based temperature measurement of a workpiece in a ther...
- Patent number 11,955,388
- Issue date Apr 9, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Michael Storek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for measuring device inside through-silicon via s...
- Patent number 11,955,392
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density low power interconnect using 3D die stacking
- Patent number 11,942,409
- Issue date Mar 26, 2024
- MARVELL ASIA PTE. LTD.
- Ferran Martorell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and testing method thereof
- Patent number 11,942,380
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Shiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave plasma source, microwave plasma processing apparatus and...
- Patent number 11,942,308
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Yasuaki Taniike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 11,935,798
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analysis method and analysis system of voltage contrast defect
- Patent number 11,927,625
- Issue date Mar 12, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yue-Ying Yen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Benchmark circuit on a semiconductor wafer and method for operating...
- Patent number 11,927,628
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chu-Feng Liao
- G01 - MEASURING TESTING
Information Patent Grant
Diagnostic disc with a high vacuum and temperature tolerant power s...
- Patent number 11,924,972
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Phillip A. Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring circuit and semiconductor device
- Patent number 11,921,153
- Issue date Mar 5, 2024
- SK Hynix Inc.
- Tae-Pyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack sensor for sensing cracks in a solder pad, and method for pro...
- Patent number 11,908,809
- Issue date Feb 20, 2024
- STMicroelectronics (Crolles 2) SAS
- Eric Sabouret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for identifying latch-up structure
- Patent number 11,899,057
- Issue date Feb 13, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qian Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device having cell on periphery structure
- Patent number 11,895,842
- Issue date Feb 6, 2024
- Samsung Electronics Co, Ltd.
- Changyeon Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and test apparatus and method thereof
- Patent number 11,887,901
- Issue date Jan 30, 2024
- Silicon Works Co., Ltd.
- Jae Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,876,025
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsang-Po Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including crack sensor
- Patent number 11,860,116
- Issue date Jan 2, 2024
- SK hynix Inc.
- Jong Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuits and semiconductor test methods
- Patent number 11,860,217
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical test structure, semiconductor structure and electrical t...
- Patent number 11,854,915
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hai Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating placement of semiconductor devices
- Patent number 11,854,916
- Issue date Dec 26, 2023
- MAKINAROCKS CO., LTD.
- Wooshik Myung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid state ESD SiC simulator
- Patent number 11,846,664
- Issue date Dec 19, 2023
- FEI Company
- Marcos Hernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,848,284
- Issue date Dec 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device die with wafer/package detection circuit
- Patent number 11,842,934
- Issue date Dec 12, 2023
- NXP B.V.
- Jan-Peter Schat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resistance patterns for an On-Die EPM
- Patent number 11,837,512
- Issue date Dec 5, 2023
- SK hynix Inc.
- Oh Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV testing method and apparatus
- Patent number 11,835,573
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and chip testing method
- Patent number 11,835,595
- Issue date Dec 5, 2023
- Shanghai Biren Technology Co., Ltd
- Kai Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for detection of defects in semiconductor devices
- Patent number 11,830,828
- Issue date Nov 28, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 11,828,790
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20240125846
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128135
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- GYOSOO CHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DETECTING CLUSTERS OF WAFER DEFECTS
- Publication number 20240128128
- Publication date Apr 18, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- KIBUM LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20240128134
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Control Monitor Device Structure for Buried TSV Formation i...
- Publication number 20240120242
- Publication date Apr 11, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS BOX ASSEMBLY FOR HIGH PRESSURE PROCESSING APPARATUS
- Publication number 20240096661
- Publication date Mar 21, 2024
- HPSP Co., Ltd.
- Kun Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV TESTING
- Publication number 20240094280
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20240096823
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE PROCESSING APPARATUS
- Publication number 20240096662
- Publication date Mar 21, 2024
- HPSP Co., Ltd.
- Kun Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTKEY STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240096718
- Publication date Mar 21, 2024
- WINBOND ELECTRONICS CORP.
- Chung-Hsuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT METHOD AND ALIGNMENT DEVICE
- Publication number 20240096716
- Publication date Mar 21, 2024
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- CHOON LEONG LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20240094282
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING THE SAME
- Publication number 20240079280
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240077366
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Yuichi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST KEY TRANSISTOR FOR DEEP TRENCH ISOLATION DEPTH DETECTION
- Publication number 20240071846
- Publication date Feb 29, 2024
- Cista System Corp.
- Jingyi BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR TEST-POINT ACCESS IN A SEMICONDUCTOR
- Publication number 20240047281
- Publication date Feb 8, 2024
- NXP USA, Inc.
- Kristofor Jason Dickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE ESD SIC SIMULATOR
- Publication number 20240044964
- Publication date Feb 8, 2024
- FEI Company
- Marcos Hernandez
- G01 - MEASURING TESTING
Information Patent Application
DIE-TO-DIE CONNECTIVITY MONITORING WITH A CLOCKED RECEIVER
- Publication number 20240038602
- Publication date Feb 1, 2024
- PROTEANTECS LTD.
- Eyal FAYNEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...
- Publication number 20240023246
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Phillip A. Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTI...
- Publication number 20240006201
- Publication date Jan 4, 2024
- ELEMENTAL SCIENTIFIC, INC.
- Tyler Yost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE CONTRAST SCAN AREA ON A WAFER
- Publication number 20240006254
- Publication date Jan 4, 2024
- Intel Corporation
- Xiao WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CRACK SENSOR
- Publication number 20230417696
- Publication date Dec 28, 2023
- SK HYNIX INC.
- Jong Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE ELECTRICAL DETECTION OF DEFECTS AT WAFER LEVEL
- Publication number 20230417830
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Hsuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS MONITORING SYSTEM AND METHOD
- Publication number 20230411190
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Sung HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...
- Publication number 20230413446
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Phillip A. Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTKEY STRUCTURE AND MONITORING METHOD WITH TESTKEY STRUCTURE
- Publication number 20230402329
- Publication date Dec 14, 2023
- United Semiconductor (Xiamen) Co., Ltd.
- Hang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTI...
- Publication number 20230395406
- Publication date Dec 7, 2023
- ELEMENTAL SCIENTIFIC, INC.
- Tyler Yost
- G01 - MEASURING TESTING
Information Patent Application
LOGIC CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20230395726
- Publication date Dec 7, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION
- Publication number 20230386887
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS

Circuits for electrically characterising or monitoring manufacturing processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

HVMOS reliability evaluation using bulk resistances as indices

Test method for tolerance against the hot carrier effect

Transmission-based temperature measurement of a workpiece in a ther...

System and method for measuring device inside through-silicon via s...

High density low power interconnect using 3D die stacking

Semiconductor structure and testing method thereof

Microwave plasma source, microwave plasma processing apparatus and...

Stacked semiconductor device test circuits and methods of use

Analysis method and analysis system of voltage contrast defect

Benchmark circuit on a semiconductor wafer and method for operating...

Diagnostic disc with a high vacuum and temperature tolerant power s...

Monitoring circuit and semiconductor device

Crack sensor for sensing cracks in a solder pad, and method for pro...

Method for identifying latch-up structure

Nonvolatile memory device having cell on periphery structure

Semiconductor device and test apparatus and method thereof

Semiconductor structure

Semiconductor devices including crack sensor

Test circuits and semiconductor test methods

Electrical test structure, semiconductor structure and electrical t...

Method for evaluating placement of semiconductor devices

Solid state ESD SiC simulator

Protective elements for bonded structures

Integrated circuit device die with wafer/package detection circuit

Resistance patterns for an On-Die EPM

TSV testing method and apparatus

Chip and chip testing method

System and method for detection of defects in semiconductor devices

Circuit test structure and method of using

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING

SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR DETECTING CLUSTERS OF WAFER DEFECTS

SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING

Process Control Monitor Device Structure for Buried TSV Formation i...

GAS BOX ASSEMBLY FOR HIGH PRESSURE PROCESSING APPARATUS

TSV TESTING

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

HIGH PRESSURE PROCESSING APPARATUS

TESTKEY STRUCTURE AND METHOD FOR FORMING THE SAME

ALIGNMENT METHOD AND ALIGNMENT DEVICE

CIRCUIT TEST STRUCTURE AND METHOD OF USING

NONVOLATILE MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

TEST KEY TRANSISTOR FOR DEEP TRENCH ISOLATION DEPTH DETECTION

STRUCTURE AND METHOD FOR TEST-POINT ACCESS IN A SEMICONDUCTOR

SOLID STATE ESD SIC SIMULATOR

DIE-TO-DIE CONNECTIVITY MONITORING WITH A CLOCKED RECEIVER

DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...

SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTI...

VOLTAGE CONTRAST SCAN AREA ON A WAFER

SEMICONDUCTOR DEVICES INCLUDING CRACK SENSOR

IN-LINE ELECTRICAL DETECTION OF DEFECTS AT WAFER LEVEL

WAFER PROCESS MONITORING SYSTEM AND METHOD

DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...

TESTKEY STRUCTURE AND MONITORING METHOD WITH TESTKEY STRUCTURE

SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTI...

LOGIC CIRCUIT AND SEMICONDUCTOR DEVICE

SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION