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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1414Circular array

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including coax-like electrical connections and methods for...
- Patent number 11,837,565
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Saqib Kaleem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup module and endoscope
- Patent number 10,660,511
- Issue date May 26, 2020
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC stacking device and method of manufacture
- Patent number 10,109,613
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a dense arrangement of contact terminals
- Patent number 10,090,251
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 9,881,889
- Issue date Jan 30, 2018
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures, semiconductor device and semiconductor device pack...
- Patent number 9,741,675
- Issue date Aug 22, 2017
- Advanced Semiconductor Engineering, Inc.
- Dao-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with active warpage control printed circ...
- Patent number 9,679,861
- Issue date Jun 13, 2017
- Altera Corporation
- Vincent Hool
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for high-speed, low-profile memory packages and...
- Patent number 9,583,452
- Issue date Feb 28, 2017
- Apple Inc.
- Anthony Fai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate pillars
- Patent number 9,508,701
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect pillars with directed compliance geometry
- Patent number 9,184,144
- Issue date Nov 10, 2015
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structure for semiconductor devices
- Patent number 9,093,332
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-circular under bump metallization (UBM) structure, orientation...
- Patent number 8,847,391
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing and packaging th...
- Patent number 8,598,691
- Issue date Dec 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing and assembling semiconductor chips with off...
- Patent number 8,394,672
- Issue date Mar 12, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic assembly
- Patent number 7,421,778
- Issue date Sep 9, 2008
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device and electronic system
- Patent number 7,221,053
- Issue date May 22, 2007
- Infineon Technologies AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having multi-material interconnects
- Patent number 7,183,493
- Issue date Feb 27, 2007
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,164,208
- Issue date Jan 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to compliantly interconnect area grid arrays a...
- Patent number 6,493,238
- Issue date Dec 10, 2002
- General Dynamics Information Systems, Inc.
- Deepak K. Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts loaded module including thermal stress absorbing p...
- Patent number 5,422,516
- Issue date Jun 6, 1995
- Hitachi, Ltd.
- Takashi Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321797
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SHIMOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE
- Publication number 20240321801
- Publication date Sep 26, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Haiying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER
- Publication number 20230054800
- Publication date Feb 23, 2023
- Shinko Electric Industries Co., Ltd.
- Kengo YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...
- Publication number 20220059487
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Saqib KALEEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CENTRIPETAL BUMPING LAYOUT AND METHOD
- Publication number 20200335466
- Publication date Oct 22, 2020
- STMicroelectronics (Alps) SAS
- Laurent SCHWARTZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Stacking Device and Method of Manufacture
- Publication number 20170005073
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...
- Publication number 20170005056
- Publication date Jan 5, 2017
- Apple Inc.
- Anthony Fai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer to Wafer Bonding Process and Structures
- Publication number 20160190089
- Publication date Jun 30, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160079195
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Jun TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140306343
- Publication date Oct 16, 2014
- XINTEC INC.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...
- Publication number 20140008788
- Publication date Jan 9, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH OFFSET PADS
- Publication number 20130161814
- Publication date Jun 27, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing and Packaging Th...
- Publication number 20130062741
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Pillars with Directed Compliance Geometry
- Publication number 20130020711
- Publication date Jan 24, 2013
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elongated Bump Structure for Semiconductor Devices
- Publication number 20120199966
- Publication date Aug 9, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH OFFSET PADS
- Publication number 20120038061
- Publication date Feb 16, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package component with ball conducting joints
- Publication number 20110235296
- Publication date Sep 29, 2011
- Quanta Computer Inc.
- Hong-Bin Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE
- Publication number 20100252855
- Publication date Oct 7, 2010
- Hidenori Kamei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20070072405
- Publication date Mar 29, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated device and electronic system
- Publication number 20060208357
- Publication date Sep 21, 2006
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060162959
- Publication date Jul 27, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060001159
- Publication date Jan 5, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050167832
- Publication date Aug 4, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazuyuki Kainou
- H01 - BASIC ELECTRIC ELEMENTS

Circular array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for packing optimization of semiconductor devices

Devices including coax-like electrical connections and methods for...

Method and system for packing optimization of semiconductor devices

Method and system for packing optimization of semiconductor devices

Image pickup module and endoscope

3DIC stacking device and method of manufacture

Semiconductor chip having a dense arrangement of contact terminals

Chip package and method for fabricating the same

Bump structures, semiconductor device and semiconductor device pack...

Substrate composite, method and device for bonding of substrates

Integrated circuit package with active warpage control printed circ...

Systems and methods for high-speed, low-profile memory packages and...

3D device packaging using through-substrate pillars

Interconnect pillars with directed compliance geometry

Elongated bump structure for semiconductor devices

Non-circular under bump metallization (UBM) structure, orientation...

Semiconductor devices and methods of manufacturing and packaging th...

Method of manufacturing and assembling semiconductor chips with off...

Method of making an electronic assembly

Integrated device and electronic system

Electronic assembly having multi-material interconnects

Semiconductor device and method for manufacturing the same

Method and apparatus to compliantly interconnect area grid arrays a...

Electronic parts loaded module including thermal stress absorbing p...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

WAFER

Method and System for Packing Optimization of Semiconductor Devices

DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...

Method and System for Packing Optimization of Semiconductor Devices

CENTRIPETAL BUMPING LAYOUT AND METHOD

3DIC Stacking Device and Method of Manufacture

SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...

Wafer to Wafer Bonding Process and Structures

SEMICONDUCTOR DEVICE

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...

SEMICONDUCTOR CHIP WITH OFFSET PADS

Semiconductor Devices and Methods of Manufacturing and Packaging Th...

Interconnect Pillars with Directed Compliance Geometry

Elongated Bump Structure for Semiconductor Devices

SEMICONDUCTOR CHIP WITH OFFSET PADS

Integrated circuit package component with ball conducting joints

SEMICONDUCTOR LIGHT-EMITTING DEVICE

Semiconductor device and method for manufacturing the same

Integrated device and electronic system

Electronic assembly having multi-material interconnects

Electronic assembly having multi-material interconnects

Semiconductor device and method for manufacturing the same