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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0614Circular array

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 11,810,891
- Issue date Nov 7, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 11,169,207
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 10,937,755
- Issue date Mar 2, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 10,663,512
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips electri...
- Patent number 10,204,885
- Issue date Feb 12, 2019
- Samsung Electronics Co., Ltd.
- Tae Joo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 10,175,294
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package
- Patent number 9,899,351
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Museob Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures, semiconductor device and semiconductor device pack...
- Patent number 9,741,675
- Issue date Aug 22, 2017
- Advanced Semiconductor Engineering, Inc.
- Dao-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with sidewall contacting bonding tape
- Patent number 9,691,691
- Issue date Jun 27, 2017
- Samsung Electronics Co., Ltd.
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 9,618,572
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,455,244
- Issue date Sep 27, 2016
- Samsung Electronics Co., Ltd.
- MuSeob Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 9,372,206
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with output circuit and pad arrangements
- Patent number 9,343,460
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 9,116,203
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,980,692
- Issue date Mar 17, 2015
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad configurations for controlling semiconductor chip package...
- Patent number 8,928,146
- Issue date Jan 6, 2015
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-circular under bump metallization (UBM) structure, orientation...
- Patent number 8,847,391
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 8,797,057
- Issue date Aug 5, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Redistribution layer (RDL) with variable offset bumps
- Patent number 8,710,656
- Issue date Apr 29, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 8,711,650
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,710,637
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Yukinori Tashiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic system with expansion feature
- Patent number 8,703,541
- Issue date Apr 22, 2014
- Stats Chippac Ltd.
- Haengcheol Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad configurations for controlling semiconductor chip package...
- Patent number 8,680,681
- Issue date Mar 25, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,664,775
- Issue date Mar 4, 2014
- Fujitsu Semiconductor Limited
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having offset vias
- Patent number 8,624,404
- Issue date Jan 7, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with output circuit arrangement
- Patent number 8,552,561
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical test structure applying 3D-ICS bonding technology for st...
- Patent number 8,546,952
- Issue date Oct 1, 2013
- National Chiao Tung University
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,525,306
- Issue date Sep 3, 2013
- Renesas Electronics Corporation
- Yukinori Tashiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND DRIVING CIRCUIT STRUCTURE
- Publication number 20230352452
- Publication date Nov 2, 2023
- E Ink Holdings Inc.
- Shu-Fen TSAI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
WAFER
- Publication number 20230054800
- Publication date Feb 23, 2023
- Shinko Electric Industries Co., Ltd.
- Kengo YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220392979
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sang Duk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20210183810
- Publication date Jun 17, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS
- Publication number 20200264231
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Application
SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT
- Publication number 20200111758
- Publication date Apr 9, 2020
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20200006280
- Publication date Jan 2, 2020
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190139939
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Tae Joo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS
- Publication number 20190128958
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170098628
- Publication date Apr 6, 2017
- MEDIATEK INC.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer to Wafer Bonding Process and Structures
- Publication number 20160190089
- Publication date Jun 30, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150287724
- Publication date Oct 8, 2015
- RENESAS ELECTRONICS CORPORATION
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS
- Publication number 20140327464
- Publication date Nov 6, 2014
- Wei-Cheng WU
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20140187000
- Publication date Jul 3, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONFIGURATIONS FOR CONTROLLING SEMICONDUCTOR CHIP PACKAGE...
- Publication number 20140145330
- Publication date May 29, 2014
- GLOBLAFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) WITH VARIABLE OFFSET BUMPS
- Publication number 20140021600
- Publication date Jan 23, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...
- Publication number 20140008788
- Publication date Jan 9, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130341728
- Publication date Dec 26, 2013
- RENESAS ELECTRONICS CORPORATION
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS
- Publication number 20130341802
- Publication date Dec 26, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TEST STRUCTURE APPLYING 3D-ICS BONDING TECHNOLOGY FOR ST...
- Publication number 20130062776
- Publication date Mar 14, 2013
- NATIONAL CHIAO-TUNG UNIVERSITY
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Pad Configurations for Controlling Semiconductor Chip Package...
- Publication number 20130049206
- Publication date Feb 28, 2013
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130032942
- Publication date Feb 7, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Kenichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Bump Pitch Scaling
- Publication number 20120319269
- Publication date Dec 20, 2012
- BROADCOM CORPORATION
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP
- Publication number 20120262992
- Publication date Oct 18, 2012
- RENESAS TECHNOLOGY CORP.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Application
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS
- Publication number 20120206160
- Publication date Aug 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng WU
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC SYSTEM WITH EXPANSION FEATURE
- Publication number 20120193132
- Publication date Aug 2, 2012
- Haengcheol Choi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS E...
- Publication number 20120068350
- Publication date Mar 22, 2012
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120018859
- Publication date Jan 26, 2012
- RENESAS ELECTRONICS CORPORATION
- Yukinori TASHIRO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100171177
- Publication date Jul 8, 2010
- RENESAS TECHNOLOGY CORP.
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

Circular array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and driving circuit structure

Bond pads for low temperature hybrid bonding

Testing of semiconductor chips with microbumps

Bond pads for low temperature hybrid bonding

Testing of semiconductor chips with microbumps

Semiconductor package including stacked semiconductor chips electri...

Testing of semiconductor chips with microbumps

Semiconductor package

Bump structures, semiconductor device and semiconductor device pack...

Waterfall wire bonding

Semiconductor package with sidewall contacting bonding tape

Testing of semiconductor chips with microbumps

Semiconductor package

Testing of semiconductor chips with microbumps

Semiconductor device with output circuit and pad arrangements

Testing of semiconductor chips with microbumps

Semiconductor device manufacturing method

Bond pad configurations for controlling semiconductor chip package...

Non-circular under bump metallization (UBM) structure, orientation...

Testing of semiconductor chips with microbumps

Redistribution layer (RDL) with variable offset bumps

Semiconductor device including multi-chip

Semiconductor device and method of manufacturing the same

Electronic system with expansion feature

Bond pad configurations for controlling semiconductor chip package...

Semiconductor device

Integrated circuit package having offset vias

Semiconductor device with output circuit arrangement

Electrical test structure applying 3D-ICS bonding technology for st...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

DISPLAY DEVICE AND DRIVING CIRCUIT STRUCTURE

WAFER

DISPLAY DEVICE

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS

SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

SEMICONDUCTOR PACKAGE

TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Wafer to Wafer Bonding Process and Structures

SEMICONDUCTOR DEVICE

TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

WATERFALL WIRE BONDING

BOND PAD CONFIGURATIONS FOR CONTROLLING SEMICONDUCTOR CHIP PACKAGE...

REDISTRIBUTION LAYER (RDL) WITH VARIABLE OFFSET BUMPS

NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...

Semiconductor Device

INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS

ELECTRICAL TEST STRUCTURE APPLYING 3D-ICS BONDING TECHNOLOGY FOR ST...

Bond Pad Configurations for Controlling Semiconductor Chip Package...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Enhanced Bump Pitch Scaling

SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP

TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS

ELECTRONIC SYSTEM WITH EXPANSION FEATURE

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS E...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE