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H01L2224/8191

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8191Cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with metal-containing layer
- Patent number 12,002,746
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning flip chip assemblies
- Patent number 11,876,005
- Issue date Jan 16, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 11,727,714
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Soldering device and a method for producing a solder connection of...
- Patent number 11,491,567
- Issue date Nov 8, 2022
- Pink GmbH Thermosysteme
- Aaron Hutzler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,335,634
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 11,194,990
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,957,733
- Issue date Mar 23, 2021
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,790,268
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,727,267
- Issue date Jul 28, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 10,643,965
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,636,774
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 10,636,763
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Charles C. Bureau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,607,960
- Issue date Mar 31, 2020
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,553,451
- Issue date Feb 4, 2020
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,283,480
- Issue date May 7, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for flip chip type semiconductor back surface and its use
- Patent number 10,211,083
- Issue date Feb 19, 2019
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux residue cleaning system and method
- Patent number 10,170,295
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20240312900
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20240021557
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
- Publication number 20230352441
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20230343133
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT
- Publication number 20230207756
- Publication date Jun 29, 2023
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20220270963
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR DEVICE AND METHOD
- Publication number 20220067334
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210066181
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200312900
- Publication date Oct 1, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING APPARATUS AND METHOD FOR CHIP-STACKED STRUCTURE
- Publication number 20200161125
- Publication date May 21, 2020
- GRAND PROCESS TECHNOLOGY CORPORATION
- Fu-Yuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200083272
- Publication date Mar 12, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES
- Publication number 20190244837
- Publication date Aug 8, 2019
- ACM Research (Shanghai) Inc.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20190244004
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20190229087
- Publication date Jul 25, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE PROCESS FLOW
- Publication number 20180350706
- Publication date Dec 6, 2018
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsing-Ding WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308712
- Publication date Oct 25, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20180005975
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170246699
- Publication date Aug 31, 2017
- Samsung Electronics Co., Ltd.
- Min-woo SONG
- B82 - NANO-TECHNOLOGY
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20170243852
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20160228999
- Publication date Aug 11, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR IMPROVING THERMAL PERFORMANCE OF FLIP CHIP PACKAGES
- Publication number 20150243580
- Publication date Aug 27, 2015
- SKYWORKS SOLUTIONS, INC.
- Jaydutt Jagdish Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD
- Publication number 20150179595
- Publication date Jun 25, 2015
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and method of forming a joint assembly

Chip package structure with metal-containing layer

Semiconductor device and manufacturing method thereof

Methods and apparatus for cleaning flip chip assemblies

Interconnect structure for semiconductor with ultra-fine pitch and...

Fingerprint sensor device and method

Soldering device and a method for producing a solder connection of...

Structure and method of forming a joint assembly

Chip package structure and method for forming the same

Semiconductor device and manufacturing method thereof

Fingerprint sensor device and method

Semiconductor device

Interconnect bump structures for photo detectors

Device packaging facility and method, and device processing apparat...

Semiconductor device and method of forming a 3D integrated system-i...

Mounting Method of a semiconductor device using a colored auxiliary...

Method of processing solder bump by vacuum annealing

Metallic interconnect, a method of manufacturing a metallic interco...

Interconnect bump structures for photo detectors

Semiconductor device and method of manufacturing the same

Structure and method of forming a joint assembly

Semiconductor device and method of forming a 3D integrated system-i...

Enhanced cleaning for water-soluble flux soldering

Substrate structure with selective surface finishes for flip chip a...

Semiconductor device and manufacturing method thereof

Semiconductor chip mounted on a packaging substrate

Substrate structure with selective surface finishes for flip chip a...

Film for flip chip type semiconductor back surface and its use

Flux residue cleaning system and method

Structures and methods to enable a full intermetallic interconnect

Patents Applicationslast 30 patents

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

Fingerprint Sensor Device and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD

BUMP TO PACKAGE SUBSTRATE SOLDER JOINT

Fingerprint Sensor Device and Method

METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

Structure and Method of Forming a Joint Assembly

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

FINGERPRINT SENSOR DEVICE AND METHOD

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

CLEANING APPARATUS AND METHOD FOR CHIP-STACKED STRUCTURE

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES

Fingerprint Sensor Device and Method

SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

SYSTEM IN PACKAGE PROCESS FLOW

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHODS FOR IMPROVING THERMAL PERFORMANCE OF FLIP CHIP PACKAGES

SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD