Cleaning

Industry

CPC
H01L2224/8391

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8391Cleaning

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,862,601
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Min Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Soldering device and a method for producing a solder connection of...
- Patent number 11,491,567
- Issue date Nov 8, 2022
- Pink GmbH Thermosysteme
- Aaron Hutzler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,966
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Min Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strong, heat stable junction
- Patent number 10,862,016
- Issue date Dec 8, 2020
- The United States of America as represented by the Secretary of the Army
- Patrick J Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,541,224
- Issue date Jan 21, 2020
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting die (LED) packages and related methods
- Patent number 10,256,385
- Issue date Apr 9, 2019
- Cree, Inc.
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,192,850
- Issue date Jan 29, 2019
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for adhesive control between a substrate and a die
- Patent number 10,056,294
- Issue date Aug 21, 2018
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for producing same
- Patent number 9,740,067
- Issue date Aug 22, 2017
- Sharp Kabushiki Kaisha
- Keiji Aota
- G02 - OPTICS
Information Patent Grant
Reflow film, solder bump formation method, solder joint formation m...
- Patent number 9,656,353
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless chip carrier having improved mountability
- Patent number 9,418,919
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240387492
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Dohan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240124799
- Publication date Apr 18, 2024
- Kabushiki Kaisha Toshiba
- Masato YASUI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20240021557
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220352117
- Publication date Nov 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- Min Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210125956
- Publication date Apr 29, 2021
- SAMSUNG DISPLAY CO., LTD.
- Min Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRONG, HEAT STABLE JUNCTION
- Publication number 20180342659
- Publication date Nov 29, 2018
- Patrick J. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20170170132
- Publication date Jun 15, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Chip-To-Wafer Integration
- Publication number 20160155720
- Publication date Jun 2, 2016
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TERNARY WAFER BONDING AND STRUCTURE THEREOF
- Publication number 20150294950
- Publication date Oct 15, 2015
- National Central University
- CHENG-YI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...
- Publication number 20140252607
- Publication date Sep 11, 2014
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS
- Publication number 20120187862
- Publication date Jul 26, 2012
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
- Publication number 20120181678
- Publication date Jul 19, 2012
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND DICING TAPE...
- Publication number 20120021174
- Publication date Jan 26, 2012
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding process with inhibited oxide formation

Display device and method of manufacturing the same

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Soldering device and a method for producing a solder connection of...

Bonding process with inhibited oxide formation

Display device and method of manufacturing the same

Bonding process with inhibited oxide formation

Strong, heat stable junction

Electronic component device

Method of manufacturing semiconductor device and semiconductor device

Metallic interconnect, a method of manufacturing a metallic interco...

Method for fabricating stack die package

Bonding process with inhibited oxide formation

Three dimensional device integration method and integrated device

Light emitting die (LED) packages and related methods

Bonding process with inhibited oxide formation

Techniques for adhesive control between a substrate and a die

Display device and method for producing same

Reflow film, solder bump formation method, solder joint formation m...

Method and apparatus for chip-to-wafer integration

Method for fabricating stack die package

Stacked synchronous buck converter having chip embedded in outside...

Leadless chip carrier having improved mountability

Patents Applicationslast 30 patents

DISPLAY DEVICE

CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

STRONG, HEAT STABLE JUNCTION

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Method and Apparatus for Chip-To-Wafer Integration

METHOD FOR TERNARY WAFER BONDING AND STRUCTURE THEREOF

METHOD FOR FABRICATING STACK DIE PACKAGE

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND DICING TAPE...