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H01L2224/8201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8201Cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 10,219,384
- Issue date Feb 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer system in package
- Patent number 9,936,578
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,391,027
- Issue date Jul 12, 2016
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,209,151
- Issue date Dec 8, 2015
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic module
- Patent number 8,959,757
- Issue date Feb 24, 2015
- RF Micro Devices, Inc.
- Thong Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct write interconnections and method of manufacturing thereof
- Patent number 8,716,870
- Issue date May 6, 2014
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with via interconnection
- Patent number 6,406,939
- Issue date Jun 18, 2002
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit Board Structure
- Publication number 20190150288
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RDL SYSTEM IN PACKAGE
- Publication number 20130170147
- Publication date Jul 4, 2013
- RF Micro Devices, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WRITE INTERCONNECTIONS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20130154110
- Publication date Jun 20, 2013
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a printed circuit board structure

Circuit board structure

Redistribution layer system in package

Embedded semiconductor device package and method of manufacturing t...

Embedded semiconductor device package and method of manufacturing t...

Method of manufacturing an electronic module

Direct write interconnections and method of manufacturing thereof

Flip chip assembly with via interconnection

Patents Applicationslast 30 patents

Circuit Board Structure

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

RDL SYSTEM IN PACKAGE

DIRECT WRITE INTERCONNECTIONS AND METHOD OF MANUFACTURING THEREOF