CO2 LASER

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CPC
H01L2924/40252

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/40252CO2 LASER

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 10,103,076
- Issue date Oct 16, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 9,780,054
- Issue date Oct 3, 2017
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for laser welding of ribbons
- Patent number 6,717,100
- Issue date Apr 6, 2004
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device transfer method, and device array method and image display u...
- Patent number 6,683,416
- Issue date Jan 27, 2004
- Sony Corporation
- Toyoharu Oohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for laser welding of ribbons
- Patent number 6,501,043
- Issue date Dec 31, 2002
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board for semiconductor plastic package
- Patent number 6,479,760
- Issue date Nov 12, 2002
- Mitsubishi Gas Chemical Company, Inc.
- Hidenori Kimbara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board for semiconductor plastic package
- Patent number 6,362,436
- Issue date Mar 26, 2002
- Mitsubishi Gas Chemical Company, Inc.
- Hidenori Kimbara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407954
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170309559
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20170148692
- Publication date May 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING BALL LANDS, SEMICONDUCTOR PACKAGES INCLUDING THE...
- Publication number 20150145131
- Publication date May 28, 2015
- SK HYNIX INC.
- Jong Woo YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
- Publication number 20150050781
- Publication date Feb 19, 2015
- lintel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with embedded die and its methods of fabrication
- Publication number 20110215464
- Publication date Sep 8, 2011
- Intel Corporation
- John Stephen Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for laser welding of ribbons for electrical co...
- Publication number 20040256367
- Publication date Dec 23, 2004
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE TRANSFER METHOD, AND DEVICE ARRAY METHOD AND IMAGE DISPLAY U...
- Publication number 20040012337
- Publication date Jan 22, 2004
- Toyoharu Oohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for laser welding of ribbons
- Publication number 20030127434
- Publication date Jul 10, 2003
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board for semiconductor plastic package
- Publication number 20020039644
- Publication date Apr 4, 2002
- Hidenori Kimbara
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Printed circuit board and semiconductor package

Printed circuit board and semiconductor package

Semiconductor package including a semiconductor die having redistri...

Semiconductor package with embedded die and its methods of fabrication

Apparatus and method for laser welding of ribbons

Device transfer method, and device array method and image display u...

Apparatus and method for laser welding of ribbons

Printed wiring board for semiconductor plastic package

Printed wiring board for semiconductor plastic package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

SUBSTRATES HAVING BALL LANDS, SEMICONDUCTOR PACKAGES INCLUDING THE...

SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

Semiconductor package with embedded die and its methods of fabrication

Apparatus and method for laser welding of ribbons for electrical co...

DEVICE TRANSFER METHOD, AND DEVICE ARRAY METHOD AND IMAGE DISPLAY U...

Apparatus and method for laser welding of ribbons

Printed wiring board for semiconductor plastic package