Claims
- 1. A method for bonding of ribbon to a first substrate, comprising:
disposing a ribbon between a bond head and first substrate, the bond head adapted to permit passage of a laser beam therethrough; aiming a laser at the top surface of the ribbon adjacent the bond head; firing the laser for a predetermined time sufficient to form a first weld nugget at a first bond site, the first weld nugget consisting of material from both the ribbon and first substrate.
- 2. The method of claim 1, wherein the laser is focused adjacent the bond site.
- 3. The method of claim 2, wherein the ribbon is conductive.
- 4. The method of claim 2, wherein the ribbon comprises nickel-clad copper.
- 5. The method of claim 1, wherein the laser is a Nd:YAG laser.
- 6. The method of claim 2, further comprising the steps of:
moving the bond head relative to a work piece to position the bond head at a second bond substrate while playing out ribbon from a ribbon spool; disposing the ribbon between the bond head and second substrate;
aiming the laser at the top surface of the ribbon; firing the laser for a predetermined time sufficient to form a second weld nugget at a second bond site, the second weld nugget consisting of material from both the ribbon and second substrate.
- 7. The method of claim 6, further comprising the additional step of severing the ribbon adjacent the second bond site.
- 8. The method of claim 7, wherein the ribbon is severed by the bond head to form a wedge bond.
- 9. An apparatus for bonding a section of ribbon to at least one substrate pad, comprising:
a laser beam generator; a bond foot defining an aperture for passage of the laser beam therethrough; and aiming means for direction of a laser beam to a bond site.
- 10. The apparatus of claim 9 further comprising a ribbon spool; and
means to prevent the feed of ribbon from the spool.
- 11. The apparatus of claim 10 wherein the feed preventing means comprises a clamp disposed about the ribbon for controlling ribbon feed.
- 12. The apparatus of claim 9, further comprising sighting means for observation of the bond site.
- 13. The apparatus of claim 9, wherein the aiming means comprises a lens disposed adjacent a mirror directing the laser beam to the bond site.
- 14. The apparatus of claims 12 and 13, wherein the sighting means comprises a view port through the mirror.
- 15. The apparatus of claim 14 wherein the mirror is a dichroic mirror.
- 16. The apparatus of claim 9, wherein the means for direction of a laser beam to a bond site comprises an optic fiber leading to a point adjacent the bond site.
- 17. The apparatus of claim 16, wherein the optic fiber adjacent the bond head is embedded in the bond head.
- 18. The apparatus of claim 9 wherein the laser beam generator is a Nd:YAG laser beam generator.
- 19. The apparatus of claim 9 further comprising a pattern-matching automation table.
- 20. The method of claim 1, further comprising the steps of:
moving the bond head horizontally to a location proximate to the first bond site, and firing the laser for an additional predetermined time sufficient to form a security weld.
- 21. A bonding apparatus for connecting a segment of a ribbon to at least one substrate pad to form a bond connection at the bond site, the apparatus comprising:
a laser beam source; a movable pedestal including a bond foot with an aperture for directing beams from the beam source; and an aiming structure to direct the beams precisely targeted at the bond site.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application No. 60/161,163, filed Oct. 22, 1999.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60161163 |
Oct 1999 |
US |
Divisions (2)
|
Number |
Date |
Country |
Parent |
10280965 |
Oct 2002 |
US |
Child |
10816794 |
Apr 2004 |
US |
Parent |
09688427 |
Oct 2000 |
US |
Child |
10280965 |
Oct 2002 |
US |