Coating

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H01L2224/1354

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1354Coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,435
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having stepped conductive pillars
- Patent number 11,955,447
- Issue date Apr 9, 2024
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,929,316
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,032
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,798,907
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved reliability in bonds between...
- Patent number 11,676,925
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,646,260
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved reliability in bonds between...
- Patent number 11,158,594
- Issue date Oct 26, 2021
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,872,861
- Issue date Dec 22, 2020
- ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG, TAIWAN
- Yong-Da Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,861,825
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,510,720
- Issue date Dec 17, 2019
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,256,216
- Issue date Apr 9, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,224,313
- Issue date Mar 5, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 9,905,539
- Issue date Feb 27, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball, manufacturing method thereof, and semiconductor device
- Patent number 9,780,056
- Issue date Oct 3, 2017
- ChipMOS Technologies Inc.
- Tung-Bao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interconnections having different sizes
- Patent number 9,773,755
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to enable a full intermetallic interconnect
- Patent number 9,741,682
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with semiconductor die directly attached to l...
- Patent number 9,711,484
- Issue date Jul 18, 2017
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming Cu pillar bump with non-metal sidewall spacer and...
- Patent number 9,685,372
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing connector structures of integrated circuits
- Patent number 9,659,903
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure design for stress reduction
- Patent number 9,627,290
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method for forming the same
- Patent number 9,620,468
- Issue date Apr 11, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure
- Patent number 9,431,325
- Issue date Aug 30, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,379,077
- Issue date Jun 28, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structures of integrated circuits
- Patent number 9,373,598
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 9,293,338
- Issue date Mar 22, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interconnections having different sizes
- Patent number 9,142,533
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20240413113
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240371739
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Pin-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355779
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20240250051
- Publication date Jul 25, 2024
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194646
- Publication date Jun 13, 2024
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240105657
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
- Publication number 20240105655
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL PADS
- Publication number 20240088072
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Tsung Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...
- Publication number 20240038704
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014158
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20240006360
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20230154878
- Publication date May 18, 2023
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069490
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230039094
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Moonyong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND WIRING SUBSTRATE
- Publication number 20220399297
- Publication date Dec 15, 2022
- Shinko Electric Industries Co., Ltd.
- Yoko NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...
- Publication number 20220293543
- Publication date Sep 15, 2022
- DIC CORPORATION
- Ryota YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220148989
- Publication date May 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Manufacturing Method Thereof
- Publication number 20220115352
- Publication date Apr 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220068863
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- JISEOK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220059444
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- JONGYOUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210143116
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- JISEOK HONG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive terminal for side facing packages

Semiconductor package

Semiconductor chip having stepped conductive pillars

Semiconductor package and method of fabricating the same

Semiconductor structure and manufacturing method thereof

Semiconductor packages

Semiconductor packages having improved reliability in bonds between...

Semiconductor package and method of fabricating the same

Semiconductor packages having improved reliability in bonds between...

Semiconductor packages

Interconnect structures with intermetallic palladium joints and ass...

Electronic package and method for fabricating the same

Interconnect structures with intermetallic palladium joints and ass...

Interconnect structures with intermetallic palladium joints and ass...

Structures and methods to enable a full intermetallic interconnect

Interconnect structures with intermetallic palladium joints and ass...

Solder ball, manufacturing method thereof, and semiconductor device

Substrate interconnections having different sizes

Structures to enable a full intermetallic interconnect

Semiconductor package with semiconductor die directly attached to l...

Semiconductor packages

Method of forming Cu pillar bump with non-metal sidewall spacer and...

Method of manufacturing connector structures of integrated circuits

Bump structure design for stress reduction

Semiconductor packaging structure and method for forming the same

Semiconductor packaging structure

Metal contact for semiconductor device

Connector structures of integrated circuits

Semiconductor packaging structure and method

Substrate interconnections having different sizes

Patents Applicationslast 30 patents

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...

EMBEDDED METAL PADS

HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

Harvested Reconstitution Bumping

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

SEMICONDUCTOR PACKAGE

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE

TERMINAL STRUCTURE AND WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...

SEMICONDUCTOR PACKAGES

Semiconductor Structure And Manufacturing Method Thereof

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME