Coaxial feed-throughs in active or passive substrates

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H01L2223/6622

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6622Coaxial feed-throughs in active or passive substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low capacitance through substrate via structures
- Patent number 12,112,995
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Deepak C. Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising a radar semiconductor chip and ass...
- Patent number 12,014,998
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for via last through-vias
- Patent number 11,978,758
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer
- Patent number 11,973,013
- Issue date Apr 30, 2024
- AMOSENSE CO., LTD.
- Changwoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects in a core layer configured for s...
- Patent number 11,955,409
- Issue date Apr 9, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having integrated antenna and method therefor
- Patent number 11,705,410
- Issue date Jul 18, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 11,699,656
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising a radar semiconductor chip and ass...
- Patent number 11,658,135
- Issue date May 23, 2023
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 11,637,078
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for via last through-vias
- Patent number 11,600,653
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost millimiter wave integrated LTCC package
- Patent number 11,430,752
- Issue date Aug 30, 2022
- Scientific Components Corporation
- Aaron Vaisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplification device
- Patent number 11,362,011
- Issue date Jun 14, 2022
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kazuhiko Ohhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryptographic device arranged to compute a target block cipher
- Patent number 11,362,802
- Issue date Jun 14, 2022
- Koninklijke Philips N.V.
- Ronald Rietman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low capacitance through substrate via structures
- Patent number 11,362,018
- Issue date Jun 14, 2022
- Micron Technology, Inc.
- Deepak C. Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer radio frequency integrated circuit package and related...
- Patent number 11,277,902
- Issue date Mar 15, 2022
- Arbe Robotics Ltd.
- Nadav Snir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 11,088,071
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density three-dimensional integrated capacitors
- Patent number 11,004,930
- Issue date May 11, 2021
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and electronic system with impedance matched in...
- Patent number 10,991,674
- Issue date Apr 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 10,930,603
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost millimeter wave integrated LTCC package and method of manu...
- Patent number 10,861,803
- Issue date Dec 8, 2020
- Scientific Components Corporation
- Aaron Vaisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,854,550
- Issue date Dec 1, 2020
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial-interconnect structure for a semiconductor component
- Patent number 10,734,334
- Issue date Aug 4, 2020
- Marvell Asia Pte, Ltd.
- Marc Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound via RF transition structure in a multilayer high-density i...
- Patent number 10,727,190
- Issue date Jul 28, 2020
- Tektronix, Inc.
- George S. Curtis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 10,720,387
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded millimeter-wave phased array module
- Patent number 10,658,312
- Issue date May 19, 2020
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground plane vertical isolation of, ground line coaxial isolation o...
- Patent number 10,607,951
- Issue date Mar 31, 2020
- Intel Corporation
- Yu Amos Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tile for an active electronically scanned array (AESA)
- Patent number 10,541,461
- Issue date Jan 21, 2020
- Ratheon Company
- Mary A. Teshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low capacitance through substrate via structures
- Patent number 10,490,483
- Issue date Nov 26, 2019
- Micron Technology, Inc.
- Deepak C. Pandey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF BRIDGE
- Publication number 20240243079
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213168
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...
- Publication number 20240203912
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Jeffrey Spencer Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
- Publication number 20240088068
- Publication date Mar 14, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED POWER AMPLIFIER DEVICE
- Publication number 20240071960
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...
- Publication number 20240006350
- Publication date Jan 4, 2024
- Intel Corporation
- Ellis NEASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A MULTI-LAYERED STRUCTURE HAVING ANTIPAD FORMATIONS
- Publication number 20230395968
- Publication date Dec 7, 2023
- Metawave Corporation
- Hamidreza Kazemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INTERPOSER FOR RF APPLICATION
- Publication number 20230343729
- Publication date Oct 26, 2023
- Xi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20230307390
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268256
- Publication date Aug 24, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BAND...
- Publication number 20230232528
- Publication date Jul 20, 2023
- NXP USA, Inc.
- Yu-Ting David Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA ARRAY
- Publication number 20230207499
- Publication date Jun 29, 2023
- MEDIATEK INC.
- Wun-Jian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA SUBSTRATE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230198165
- Publication date Jun 22, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Je Sang PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20230127676
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Sangwook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230107554
- Publication date Apr 6, 2023
- Korea Electronics Technology Institute
- Jong Min YOOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...
- Publication number 20230044284
- Publication date Feb 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BALL GRID ARRAY-TYPE INTEGRATED CIRCUIT PACKAGE FOR VERY...
- Publication number 20220375885
- Publication date Nov 24, 2022
- Teledyne e2v Semiconductors SAS
- Olivier Legendre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK CANCELATION STRUCTURES IN SEMICONDUCTOR PACKAGES
- Publication number 20220319980
- Publication date Oct 6, 2022
- Shahram Nikoukary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INTERCONNECTS IN A CORE LAYER CONFIGURED FOR S...
- Publication number 20220223499
- Publication date Jul 14, 2022
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED ANTENNA AND METHOD THEREFOR
- Publication number 20220189890
- Publication date Jun 16, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFICATION DEVICE
- Publication number 20220020658
- Publication date Jan 20, 2022
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kazuhiko OHHASHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTERPOSER
- Publication number 20220005757
- Publication date Jan 6, 2022
- AMOSENSE CO., LTD.
- Changwoo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...
- Publication number 20210368615
- Publication date Nov 25, 2021
- Nadav Snir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANK CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20210327809
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Three-dimensional Integrated Capacitors
- Publication number 20210265460
- Publication date Aug 26, 2021
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20210175187
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Via Last Through-Vias
- Publication number 20210159264
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210091006
- Publication date Mar 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS

Coaxial feed-throughs in active or passive substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low capacitance through substrate via structures

Coaxial through via with novel high isolation cross coupling method...

Semiconductor devices comprising a radar semiconductor chip and ass...

Methods and apparatus for via last through-vias

Interposer

Substrate comprising interconnects in a core layer configured for s...

Semiconductor package and method of manufacturing the same

Semiconductor device having integrated antenna and method therefor

Tank circuit structure and method of making the same

Semiconductor devices comprising a radar semiconductor chip and ass...

Coaxial through via with novel high isolation cross coupling method...

Methods and apparatus for via last through-vias

Low cost millimiter wave integrated LTCC package

Power amplification device

Cryptographic device arranged to compute a target block cipher

Low capacitance through substrate via structures

Single layer radio frequency integrated circuit package and related...

Tank circuit structure and method of making the same

High density three-dimensional integrated capacitors

Electronic assembly and electronic system with impedance matched in...

Coaxial through via with novel high isolation cross coupling method...

Low cost millimeter wave integrated LTCC package and method of manu...

Semiconductor package and method of manufacturing the same

Coaxial-interconnect structure for a semiconductor component

Compound via RF transition structure in a multilayer high-density i...

Tank circuit structure and method of making the same

Embedded millimeter-wave phased array module

Ground plane vertical isolation of, ground line coaxial isolation o...

Tile for an active electronically scanned array (AESA)

Low capacitance through substrate via structures

Patents Applicationslast 30 patents

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

RF BRIDGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...

HYBRID CHIP CARRIER PACKAGE

SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR

PACKAGED POWER AMPLIFIER DEVICE

SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...

A MULTI-LAYERED STRUCTURE HAVING ANTIPAD FORMATIONS

INTEGRATED INTERPOSER FOR RF APPLICATION

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BAND...

SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA ARRAY

ANTENNA SUBSTRATE AND ELECTRONIC DEVICE INCLUDING THE SAME

WIRING BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...

FLIP-CHIP BALL GRID ARRAY-TYPE INTEGRATED CIRCUIT PACKAGE FOR VERY...

CROSSTALK CANCELATION STRUCTURES IN SEMICONDUCTOR PACKAGES

SUBSTRATE COMPRISING INTERCONNECTS IN A CORE LAYER CONFIGURED FOR S...

SEMICONDUCTOR DEVICE HAVING INTEGRATED ANTENNA AND METHOD THEREFOR

POWER AMPLIFICATION DEVICE

INTERPOSER

SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...

TANK CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME

High Density Three-dimensional Integrated Capacitors

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

Methods and Apparatus for Via Last Through-Vias

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME