Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industry

CPC
H05K1/185

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic component module
- Patent number 12,232,269
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and communication device
- Patent number 12,232,247
- Issue date Feb 18, 2025
- Sumitomo Electric Industries, Ltd.
- Noriyoshi Suda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,144
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yukio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device comprisi...
- Patent number 12,185,464
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,183,488
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded printed circuit board
- Patent number 12,185,470
- Issue date Dec 31, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,177,976
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component housing package, electronic device, and electr...
- Patent number 12,177,983
- Issue date Dec 24, 2024
- Kyocera Corporation
- Yoshitomo Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) module comprising an embedded radio-fre...
- Patent number 12,171,058
- Issue date Dec 17, 2024
- GN HEARING A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 12,154,715
- Issue date Nov 26, 2024
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,144,116
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Jong Bae Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with output inductors and output capacitors that are e...
- Patent number 12,120,822
- Issue date Oct 15, 2024
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of making a semiconductor device package
- Patent number 12,119,282
- Issue date Oct 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching Pi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 12,108,534
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,108,563
- Issue date Oct 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded bridge
- Patent number 12,108,532
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Seok Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board
- Patent number 12,089,337
- Issue date Sep 10, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun Oh Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,075,558
- Issue date Aug 27, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhaozheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD (PCB) MODULE COMPRISING AN EMBEDDED RADIO-FRE...
- Publication number 20250063652
- Publication date Feb 20, 2025
- GN Hearing A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250063667
- Publication date Feb 20, 2025
- ASUSTek COMPUTER INC.
- Chih-Kuan Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250063666
- Publication date Feb 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Methods for Fine-Pitch Components and Corresponding Compo...
- Publication number 20250063668
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20250056729
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20250036176
- Publication date Jan 30, 2025
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250031312
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROGOWSKI COIL BASED BUSHING CURRENT TRANSFORMER
- Publication number 20250022651
- Publication date Jan 16, 2025
- Accuenergy (Canada) Inc.
- Vahid Behjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...
- Publication number 20250022840
- Publication date Jan 16, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Lasse Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES
- Publication number 20250016930
- Publication date Jan 9, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...
- Publication number 20240429217
- Publication date Dec 26, 2024
- Monolithic Power Systems, Inc.
- Daocheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240422912
- Publication date Dec 19, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413061
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...
- Publication number 20240387110
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ho In JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plateable Single Layer Capacitor
- Publication number 20240381537
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME
- Publication number 20240364291
- Publication date Oct 31, 2024
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MECHANICAL PACKAGING FOR MODULAR ENERGY SYSTEM
- Publication number 20240324098
- Publication date Sep 26, 2024
- Cilag GMBH International
- Madeleine C. Jayme
- G02 - OPTICS
Information Patent Application
THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...
- Publication number 20240306348
- Publication date Sep 12, 2024
- GaN Systems Inc.
- Ruoyu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...
- Publication number 20240298409
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Seok Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...
- Publication number 20240290687
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240284598
- Publication date Aug 22, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240260189
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- Won Suk JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONIC DEVICE ASSEMBLIES HAVING HEAT SPREADERS AND ELECTR...
- Publication number 20240244805
- Publication date Jul 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING...
- Publication number 20240196512
- Publication date Jun 13, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186261
- Publication date Jun 6, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20240170301
- Publication date May 23, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- ZHI-CHENG LAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240172368
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yun Je JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...
- Publication number 20240171839
- Publication date May 23, 2024
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component module

Circuit module and communication device

Embeddable electrically insulating thermal connector and circuit bo...

Circuit board structure

Module

Wiring substrate and method for manufacturing wiring substrate

Electronic component embedded substrate

Rigid flexible printed circuit board and electronic device comprisi...

Electronic component

Embedded printed circuit board

Module

Electronic component housing package, electronic device, and electr...

Printed circuit board (PCB) module comprising an embedded radio-fre...

Component carrier with embedded interposer laterally between electr...

Methods to selectively embed magnetic materials in substrate and co...

Printed circuit board

Printed circuits with embedded resistive thermal devices

Interface assembly and method for manufacturing interface assembly

Bridge interconnection with layered interconnect structures

Power module with output inductors and output capacitors that are e...

Method of making a semiconductor device package

Substrate structure and electronic device including the same

Power electronics assemblies having embedded power electronics devices

Printed circuit board with embedded bridge

Component carrier with stack-stack connection for connecting compon...

Integrated electronic device with flexible and stretchable substrate

Interface assembly and method for manufacturing interface assembly

Circuit board

Printed circuit board

Embedding component in component carrier by component fixation stru...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD (PCB) MODULE COMPRISING AN EMBEDDED RADIO-FRE...

ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

Embedding Methods for Fine-Pitch Components and Corresponding Compo...

SUBSTRATE

Printed Circuits with Embedded Resistive Thermal Devices

PRINTED CIRCUIT BOARD

ROGOWSKI COIL BASED BUSHING CURRENT TRANSFORMER

SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES

POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...

ELECTRONIC DEVICE

PACKAGE STRUCTURE

ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...

Plateable Single Layer Capacitor

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME

METHOD FOR MECHANICAL PACKAGING FOR MODULAR ENERGY SYSTEM

THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

PRINTED CIRCUIT BOARD

POWER ELECTRONIC DEVICE ASSEMBLIES HAVING HEAT SPREADERS AND ELECTR...

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...