Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industry

CPC
H05K1/185

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Modular energy system
- Patent number 12,289,824
- Issue date Apr 29, 2025
- Cilag GmbH International
- Madeleine C. Jayme
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrostatic discharge protection of electronic component embedded...
- Patent number 12,284,753
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Mahadi-Ul Hassan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mold adhesion boundary for die attach pad
- Patent number 12,274,006
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with embedded electronic component and manufacturing...
- Patent number 12,245,358
- Issue date Mar 4, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded printed circuit board
- Patent number 12,245,376
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic optical shutter with movable permanent magnet and i...
- Patent number 12,244,199
- Issue date Mar 4, 2025
- OCEAN OPTICS, INC.
- Brian McGee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic device assemblies having heat spreaders and electr...
- Patent number 12,238,906
- Issue date Feb 25, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module
- Patent number 12,232,269
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and communication device
- Patent number 12,232,247
- Issue date Feb 18, 2025
- Sumitomo Electric Industries, Ltd.
- Noriyoshi Suda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,144
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yukio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device comprisi...
- Patent number 12,185,464
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded printed circuit board
- Patent number 12,185,470
- Issue date Dec 31, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 12,183,488
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,177,976
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component housing package, electronic device, and electr...
- Patent number 12,177,983
- Issue date Dec 24, 2024
- Kyocera Corporation
- Yoshitomo Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) module comprising an embedded radio-fre...
- Patent number 12,171,058
- Issue date Dec 17, 2024
- GN HEARING A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 12,154,715
- Issue date Nov 26, 2024
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,144,116
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Jong Bae Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with output inductors and output capacitors that are e...
- Patent number 12,120,822
- Issue date Oct 15, 2024
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of making a semiconductor device package
- Patent number 12,119,282
- Issue date Oct 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching Pi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with embedded bridge
- Patent number 12,108,532
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Seok Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132271
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Kyojin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126718
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250120006
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Chul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embeddable Electrically Insulating Thermal Connector and Circuit Bo...
- Publication number 20250106979
- Publication date Mar 27, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250095885
- Publication date Mar 20, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER ELECTRICAL STRUCTURES
- Publication number 20250081339
- Publication date Mar 6, 2025
- Qorvo US, Inc.
- Jerry Holt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081354
- Publication date Mar 6, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MODULE
- Publication number 20250071906
- Publication date Feb 27, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD (PCB) MODULE COMPRISING AN EMBEDDED RADIO-FRE...
- Publication number 20250063652
- Publication date Feb 20, 2025
- GN Hearing A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250063667
- Publication date Feb 20, 2025
- ASUSTek COMPUTER INC.
- Chih-Kuan Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250063666
- Publication date Feb 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Methods for Fine-Pitch Components and Corresponding Compo...
- Publication number 20250063668
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20250056729
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20250036176
- Publication date Jan 30, 2025
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250031312
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROGOWSKI COIL BASED BUSHING CURRENT TRANSFORMER
- Publication number 20250022651
- Publication date Jan 16, 2025
- Accuenergy (Canada) Inc.
- Vahid Behjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...
- Publication number 20250022840
- Publication date Jan 16, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Lasse Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES
- Publication number 20250016930
- Publication date Jan 9, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...
- Publication number 20240429217
- Publication date Dec 26, 2024
- Monolithic Power Systems, Inc.
- Daocheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240422912
- Publication date Dec 19, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413061
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...
- Publication number 20240387110
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ho In JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plateable Single Layer Capacitor
- Publication number 20240381537
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME
- Publication number 20240364291
- Publication date Oct 31, 2024
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS

Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modular energy system

Electrostatic discharge protection of electronic component embedded...

Printed circuit board with mold adhesion boundary for die attach pad

Circuit board with embedded electronic component and manufacturing...

Embedded printed circuit board

Electromagnetic optical shutter with movable permanent magnet and i...

Power electronic device assemblies having heat spreaders and electr...

Circuit board and method for manufacturing the same

Electronic component module

Circuit module and communication device

Embeddable electrically insulating thermal connector and circuit bo...

Circuit board structure

Module

Wiring substrate and method for manufacturing wiring substrate

Electronic component embedded substrate

Rigid flexible printed circuit board and electronic device comprisi...

Embedded printed circuit board

Electronic component

Module

Electronic component housing package, electronic device, and electr...

Printed circuit board (PCB) module comprising an embedded radio-fre...

Component carrier with embedded interposer laterally between electr...

Methods to selectively embed magnetic materials in substrate and co...

Printed circuit board

Printed circuits with embedded resistive thermal devices

Interface assembly and method for manufacturing interface assembly

Bridge interconnection with layered interconnect structures

Power module with output inductors and output capacitors that are e...

Method of making a semiconductor device package

Printed circuit board with embedded bridge

Patents Applicationslast 30 patents

Component Carrier With Embedded Electronic Switch Components and a...

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

PRINTED CIRCUIT BOARD

Embeddable Electrically Insulating Thermal Connector and Circuit Bo...

ELECTRONIC COMPONENT

CIRCUIT BOARD

MULTI-LAYER ELECTRICAL STRUCTURES

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE AND MODULE

PRINTED CIRCUIT BOARD (PCB) MODULE COMPRISING AN EMBEDDED RADIO-FRE...

ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

Embedding Methods for Fine-Pitch Components and Corresponding Compo...

SUBSTRATE

Printed Circuits with Embedded Resistive Thermal Devices

PRINTED CIRCUIT BOARD

ROGOWSKI COIL BASED BUSHING CURRENT TRANSFORMER

SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES

POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...

ELECTRONIC DEVICE

PACKAGE STRUCTURE

ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...

Plateable Single Layer Capacitor

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME