TREA

Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

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  • H05K1/185
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE SUPPORT WITH PRINTED HEATER
    • Publication number 20250227851
    • Publication date Jul 10, 2025
    • TOKYO ELECTRON LIMITED
    • Melvin Verbaas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for Embedding a Component in a Printed Circuit Board
    • Publication number 20250227850
    • Publication date Jul 10, 2025
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Timo Schwarz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
    • Publication number 20250218913
    • Publication date Jul 3, 2025
    • LG Innotek Co., Ltd.
    • Su Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL PLANAR METROLOGY MOUNTING DEVICE AND METHODS FOR ABRASIVE C...
    • Publication number 20250216190
    • Publication date Jul 3, 2025
    • The United States of America, as represented by the Secretary of the Navy
    • Derek Lengacher
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
    • Publication number 20250220818
    • Publication date Jul 3, 2025
    • Intel Corporation
    • Bohan SHAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212335
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Kyung LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212336
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTEGRATED POWER MODULE FOR ELECTRIC VEHICLE
    • Publication number 20250196665
    • Publication date Jun 19, 2025
    • Toyota Jidosha Kabushiki Kaisha
    • Feng Zhou
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
    • Publication number 20250203782
    • Publication date Jun 19, 2025
    • AISIN CORPORATION
    • Takashi KUROZUMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RADIO FREQUENCY MODULE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20250203781
    • Publication date Jun 19, 2025
    • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
    • Zhiming Zhai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250194004
    • Publication date Jun 12, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Mi Sun Hwang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS
    • Publication number 20250168987
    • Publication date May 22, 2025
    • NXP USA, Inc.
    • Zhiwei Gong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
    • Publication number 20250149252
    • Publication date May 8, 2025
    • TDK Corporation
    • Daiki ISHII
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROSTATIC DISCHARGE COLLECTOR
    • Publication number 20250151189
    • Publication date May 8, 2025
    • Wiliot, LTD.
    • Alon YEHEZKELY
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier With Embedded Electronic Switch Components and a...
    • Publication number 20250142713
    • Publication date May 1, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Gerald WEIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250132224
    • Publication date Apr 24, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Chul GONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250132271
    • Publication date Apr 24, 2025
    • Samsung Electronics Co., Ltd.
    • Kyojin Hwang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126718
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Ho Shin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
    • Publication number 20250125248
    • Publication date Apr 17, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250120006
    • Publication date Apr 10, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Chul CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Embeddable Electrically Insulating Thermal Connector and Circuit Bo...
    • Publication number 20250106979
    • Publication date Mar 27, 2025
    • KYOCERA AVX Components Corporation
    • Cory Nelson
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20250095885
    • Publication date Mar 20, 2025
    • Rohm Co., Ltd.
    • Bungo TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYER ELECTRICAL STRUCTURES
    • Publication number 20250081339
    • Publication date Mar 6, 2025
    • Qorvo US, Inc.
    • Jerry Holt
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250081354
    • Publication date Mar 6, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE AND MODULE
    • Publication number 20250071906
    • Publication date Feb 27, 2025
    • MURATA MANUFACTURING CO., LTD.
    • Ryuichi KUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD (PCB) MODULE COMPRISING AN EMBEDDED RADIO-FRE...
    • Publication number 20250063652
    • Publication date Feb 20, 2025
    • GN Hearing A/S
    • Maja Amskov Gravad
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREOF
    • Publication number 20250063667
    • Publication date Feb 20, 2025
    • ASUSTek COMPUTER INC.
    • Chih-Kuan Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250063666
    • Publication date Feb 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Embedding Methods for Fine-Pitch Components and Corresponding Compo...
    • Publication number 20250063668
    • Publication date Feb 20, 2025
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Jeesoo Mok
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR