Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industry

CPC
H05K1/185

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industries

Patents Grantslast 30 patents

Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,979,985
- Issue date May 7, 2024
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 11,971,760
- Issue date Apr 30, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 11,973,486
- Issue date Apr 30, 2024
- Kyocera Corporation
- Sinichiro Kitanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mechanical packaging for modular energy system
- Patent number 11,968,776
- Issue date Apr 23, 2024
- Cilag GmbH International
- Madeleine C. Jayme
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically functional circuit board core material
- Patent number 11,943,869
- Issue date Mar 26, 2024
- KEMET Electronics Corporation
- Brandon Summey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, an image sensor module, a lens driving device, and a...
- Patent number 11,936,968
- Issue date Mar 19, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator module
- Patent number 11,923,773
- Issue date Mar 5, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate with electronic component embedded therein
- Patent number 11,910,527
- Issue date Feb 20, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Song I Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising embedded magnet stack
- Patent number 11,889,629
- Issue date Jan 30, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with connected component carrier and fluid coolin...
- Patent number 11,889,622
- Issue date Jan 30, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic device assemblies having an electrically insulatin...
- Patent number 11,869,760
- Issue date Jan 9, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driver board assemblies and methods of forming a driver board assembly
- Patent number 11,864,323
- Issue date Jan 2, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with an embedded thermally conductive block and m...
- Patent number 11,864,306
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,856,701
- Issue date Dec 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyun Woo Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method for printed wiring board
- Patent number 11,849,546
- Issue date Dec 19, 2023
- Kyocera Corporation
- Atsuo Kawagoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic electronic component to be embedded in board, ma...
- Patent number RE49747
- Issue date Dec 5, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hye Seong Kim
Information Patent Grant
Apparatus and method for encapsulating an electronic component
- Patent number 11,832,398
- Issue date Nov 28, 2023
- Acleap Power Inc.
- Evan Cosentino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having electric component built in circuit board
- Patent number 11,825,594
- Issue date Nov 21, 2023
- Denso Corporation
- Shohei Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate comprising an inductor and a capacitor located in an enca...
- Patent number 11,817,379
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding method of a flat heat pipe into PCB for active device coo...
- Patent number 11,812,550
- Issue date Nov 7, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,812,556
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging device for connection with a circuit element
- Patent number 11,800,249
- Issue date Oct 24, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Event detection sensor and recording system
- Patent number 11,789,843
- Issue date Oct 17, 2023
- Cornerstone Research Group, Inc.
- Mark Cridge
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component built-in wiring substrate
- Patent number 11,792,937
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takahiro Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems including a vapor chamber as the heat spreading substrate o...
- Patent number 11,776,875
- Issue date Oct 3, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having a cooling area above and below a semiconductor...
- Patent number 11,778,735
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising printed circuit board with slits
- Patent number 11,765,812
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Namseok Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...
- Publication number 20240155770
- Publication date May 9, 2024
- Rogers Germany GmbH
- Andreas MEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147622
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Yoon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20240147633
- Publication date May 2, 2024
- DAIWA CO., LTD.
- Eiji YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR
- Publication number 20240130046
- Publication date Apr 18, 2024
- Nippon Telegraph and Telephone Corporation
- Teruo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
- Publication number 20240121903
- Publication date Apr 11, 2024
- Kyocera Corporation
- Atsuo KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
- Publication number 20240114622
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240049389
- Publication date Feb 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC DEVICE ASSEMBLIES HAVING AN ELECTRICALLY INSULATIN...
- Publication number 20240038625
- Publication date Feb 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032201
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...
- Publication number 20240032202
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Yun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD (PCB) MODULE COMPRISING AN EMBEDDED RADIO-FRE...
- Publication number 20240015882
- Publication date Jan 11, 2024
- GN HEARING A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WRITE DUAL CURE GASKET
- Publication number 20240002692
- Publication date Jan 4, 2024
- Raytheon Company
- Susan C. Trulli
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SANDWICH STRUCTURE POWER SUPPLY MODULE
- Publication number 20230396158
- Publication date Dec 7, 2023
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...
- Publication number 20230354513
- Publication date Nov 2, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE AND INTERPOSER
- Publication number 20230343685
- Publication date Oct 26, 2023
- NGK Insulators, Ltd.
- Yoshitsugu WAKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230328886
- Publication date Oct 12, 2023
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230328877
- Publication date Oct 12, 2023
- MURATA MANUFACTURING CO., LTD.
- Yukiya YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20230319977
- Publication date Oct 5, 2023
- MURATA MANUFACTURING CO., LTD.
- Ryota SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
- Publication number 20230299018
- Publication date Sep 21, 2023
- Huawei Technologies Co., Ltd
- Chen KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Resin Embedding
- Publication number 20230300992
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Ewald Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...
- Publication number 20230292446
- Publication date Sep 14, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- LAN-TING CHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...
- Publication number 20230282553
- Publication date Sep 7, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Functional Circuit Board Core Material
- Publication number 20230276574
- Publication date Aug 31, 2023
- KEMET Electronics Corporation
- Brandon Summey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20230276575
- Publication date Aug 31, 2023
- Shinko Electric Industries Co., Ltd.
- Yukinori HATORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-PROFILE POWER MODULE
- Publication number 20230269877
- Publication date Aug 24, 2023
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED CIRCUIT BOARD WITH MOLD ADHESION BOUNDARY FOR DIE ATTACH PAD
- Publication number 20230262901
- Publication date Aug 17, 2023
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITIVELY COUPLED RESONATORS FOR HIGH FREQUENCY GALVANIC ISOLATORS
- Publication number 20230247767
- Publication date Aug 3, 2023
- Analog Devices International Unlimited Company
- Jinglin Xu
- H01 - BASIC ELECTRIC ELEMENTS

Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component-embedded substrate

Printed circuit board

Printed circuits with embedded resistive thermal devices

Electronic component and method for manufacturing the same

Method for mechanical packaging for modular energy system

Component carrier having component covered with ultra-thin transiti...

Electrically functional circuit board core material

Circuit board, an image sensor module, a lens driving device, and a...

Voltage regulator module

Substrate with electronic component embedded therein

Component carrier comprising embedded magnet stack

Electronic device with connected component carrier and fluid coolin...

Power electronic device assemblies having an electrically insulatin...

Driver board assemblies and methods of forming a driver board assembly

Component carrier with an embedded thermally conductive block and m...

Printed circuit board

Printed wiring board and manufacturing method for printed wiring board

Multilayer ceramic electronic component to be embedded in board, ma...

Apparatus and method for encapsulating an electronic component

Semiconductor device having electric component built in circuit board

Substrate comprising an inductor and a capacitor located in an enca...

Embedding method of a flat heat pipe into PCB for active device coo...

Printed circuit board and manufacturing method thereof

Imaging device for connection with a circuit element

Event detection sensor and recording system

Component built-in wiring substrate

Systems including a vapor chamber as the heat spreading substrate o...

Circuit board with embedded electronic component and method for man...

Circuit board having a cooling area above and below a semiconductor...

Electronic device comprising printed circuit board with slits

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...

PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

CAPACITOR

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

PRINTED CIRCUIT BOARD

POWER ELECTRONIC DEVICE ASSEMBLIES HAVING AN ELECTRICALLY INSULATIN...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...

PRINTED CIRCUIT BOARD (PCB) MODULE COMPRISING AN EMBEDDED RADIO-FRE...

DIRECT WRITE DUAL CURE GASKET

SANDWICH STRUCTURE POWER SUPPLY MODULE

STACKABLE VIA PACKAGE AND METHOD

PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...

CORE SUBSTRATE AND INTERPOSER

CIRCUIT BOARD

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

CIRCUIT MODULE

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

PACKAGE SUBSTRATE AND COMMUNICATION DEVICE

Direct Resin Embedding

MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...

POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...

Electrically Functional Circuit Board Core Material

EMBEDDED PRINTED CIRCUIT BOARD

LOW-PROFILE POWER MODULE

PRINTED CIRCUIT BOARD WITH MOLD ADHESION BOUNDARY FOR DIE ATTACH PAD

CAPACITIVELY COUPLED RESONATORS FOR HIGH FREQUENCY GALVANIC ISOLATORS