comprising an eutectic alloy

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H01L2224/32506

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32506comprising an eutectic alloy

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device including through si...
- Patent number 10,497,619
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming semiconductor apparatus mounting on substrate
- Patent number 10,446,510
- Issue date Oct 15, 2019
- Sumitomo Electric Device Innovations, Inc.
- Masaomi Emori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 10,297,583
- Issue date May 21, 2019
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including through si...
- Patent number 10,049,931
- Issue date Aug 14, 2018
- Taiwan Semicondutor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,502,370
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including through si...
- Patent number 9,287,440
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,281,287
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and power source device
- Patent number 9,082,756
- Issue date Jul 14, 2015
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with through silicon vias
- Patent number 8,946,742
- Issue date Feb 3, 2015
- TSMC Solid State Lighting Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 8,878,355
- Issue date Nov 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 8,846,452
- Issue date Sep 30, 2014
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,841,772
- Issue date Sep 23, 2014
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Solder layer and device bonding substrate using the same and method...
- Patent number 8,747,579
- Issue date Jun 10, 2014
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
- Patent number 8,728,867
- Issue date May 20, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic material
- Patent number 8,728,606
- Issue date May 20, 2014
- IQLP, LLC
- Michael A. Zimmerman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat dissipation by through silicon plugs
- Patent number 8,507,940
- Issue date Aug 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package of a flipped MOSFET and its manufacturing method
- Patent number 8,481,368
- Issue date Jul 9, 2013
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating stacked semiconductor package with localized...
- Patent number 8,470,640
- Issue date Jun 25, 2013
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 8,399,996
- Issue date Mar 19, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabricating method thereof
- Patent number 8,399,969
- Issue date Mar 19, 2013
- VisEra Technologies Company Limited
- Kuo-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,390,117
- Issue date Mar 5, 2013
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Die package
- Patent number 8,373,279
- Issue date Feb 12, 2013
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...
- Publication number 20230326899
- Publication date Oct 12, 2023
- Qorvo US, Inc.
- Yinbao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20210134698
- Publication date May 6, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...
- Publication number 20180350678
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FORMING SEMICONDUCTOR APPARATUS MOUNTING ON SUBSTRATE
- Publication number 20180240765
- Publication date Aug 23, 2018
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masaomi Emori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE
- Publication number 20140203444
- Publication date Jul 24, 2014
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20140117510
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Methods of Packaging Thereof
- Publication number 20140057393
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING IMPROVED BACKSIDE METAL CONTACTS...
- Publication number 20130330571
- Publication date Dec 12, 2013
- Northrop Grumman Systems Corporation
- Ramesh Varma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...
- Publication number 20130302979
- Publication date Nov 14, 2013
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130234298
- Publication date Sep 12, 2013
- Kabushiki Kaisha Toshiba
- Satoshi MITSUGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20130161823
- Publication date Jun 27, 2013
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20120211901
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...
- Publication number 20120211799
- Publication date Aug 23, 2012
- ABB Research Ltd.
- Chunlei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20120025387
- Publication date Feb 2, 2012
- Kuo-Ching CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO LEAD PACKAGE WITH HEAT SPREADER
- Publication number 20110304032
- Publication date Dec 15, 2011
- Mary Jean Bajacan Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Carrier
- Publication number 20110285033
- Publication date Nov 24, 2011
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE
- Publication number 20110261542
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY THROUGH SILICON PLUGS
- Publication number 20110241061
- Publication date Oct 6, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS
- Publication number 20110241040
- Publication date Oct 6, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110237031
- Publication date Sep 29, 2011
- Renesas Electronics Corporation
- Yuichi YATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET AND ITS MANUFACTURING METHOD
- Publication number 20110193208
- Publication date Aug 11, 2011
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...
- Publication number 20100308475
- Publication date Dec 9, 2010
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMOPLASTIC MATERIAL
- Publication number 20100203283
- Publication date Aug 12, 2010
- Michael Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD
- Publication number 20100105172
- Publication date Apr 29, 2010
- Ming LI
- H01 - BASIC ELECTRIC ELEMENTS

comprising an eutectic alloy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal interface structures for integrated circuit packages

Low-temperature bonding with spaced nanorods and eutectic alloys

Method of manufacturing a semiconductor device including through si...

Process of forming semiconductor apparatus mounting on substrate

Semiconductor device package and methods of packaging thereof

Method of manufacturing a semiconductor device including through si...

Apparatus for eutectic bonding

Substrate composite, method and device for bonding of substrates

Semiconductor bonding structure and process

Method of manufacturing a semiconductor device including through si...

Hermetically sealed wafer packages

Semiconductor bonding structure and process

Method for bonding wafers and structure of bonding part

Semiconductor device and power source device

Hermetically sealed wafer packages

Semiconductor package with through silicon vias

Semiconductor bonding structure and process

Semiconductor device package and methods of packaging thereof

Semiconductor device and method of manufacturing the same

Solder layer and device bonding substrate using the same and method...

Semiconductor device, manufacturing method of semiconductor device,...

Thermoplastic material

Substrate bonding with metal germanium silicon material

Heat dissipation by through silicon plugs

Semiconductor package of a flipped MOSFET and its manufacturing method

Method of fabricating stacked semiconductor package with localized...

Chip carrier

Chip package and fabricating method thereof

Semiconductor device and method of manufacturing the same

Die package

Patents Applicationslast 30 patents

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...

LIQUID METAL THERMAL INTERFACE

THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...

PROCESS OF FORMING SEMICONDUCTOR APPARATUS MOUNTING ON SUBSTRATE

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE

Semiconductor Bonding Structure and Process

Semiconductor Device Package and Methods of Packaging Thereof

METHOD AND APPARATUS FOR PROVIDING IMPROVED BACKSIDE METAL CONTACTS...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH SI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor Device and Method of Manufacturing the Same

HERMETICALLY SEALED WAFER PACKAGES

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

CHIP PACKAGE AND FABRICATING METHOD THEREOF

NO LEAD PACKAGE WITH HEAT SPREADER

Chip Carrier

DIE PACKAGE

HEAT DISSIPATION BY THROUGH SILICON PLUGS

NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET AND ITS MANUFACTURING METHOD

COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...

THERMOPLASTIC MATERIAL

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD