comprising an intermetallic compound

Industry

CPC
H01L2224/16503

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16503comprising an intermetallic compound

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
- Patent number 11,908,820
- Issue date Feb 20, 2024
- Intel Corporation
- Chandramouleeswaran Subramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated device comprising pillar interconnect with cavity
- Patent number 11,721,656
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,594,512
- Issue date Feb 28, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having molded die and semiconductor die and m...
- Patent number 11,538,761
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including substrate with outer insulating layer
- Patent number 11,508,649
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Eungkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
- Patent number 11,322,469
- Issue date May 3, 2022
- Intel Corporation
- Chandramouleeswaran Subramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having chip stacked and molded
- Patent number 11,227,826
- Issue date Jan 18, 2022
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having semiconductor die bonded to r...
- Patent number 11,101,237
- Issue date Aug 24, 2021
- Advanced Semiconductor Engineering, Inc.
- Ming Hsien Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting conductive pads with post-transition metal and nanoporou...
- Patent number 11,024,597
- Issue date Jun 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method
- Patent number 10,992,100
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,943,884
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,861,825
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer and method for forming the same
- Patent number 10,811,377
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-porous copper to copper interconnect
- Patent number 10,804,241
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having semiconductor die bonded to r...
- Patent number 10,763,234
- Issue date Sep 1, 2020
- ADVANCED SEMICOMDUCTOR ENGINEERING, INC.
- Ming Hsien Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,720,410
- Issue date Jul 21, 2020
- TOSHIBA MEMORY CORPORATION
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,600,755
- Issue date Mar 24, 2020
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-porous copper to copper interconnect
- Patent number 10,553,555
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded trace substrate structure and semiconductor package struct...
- Patent number 10,483,196
- Issue date Nov 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adaptive Flip Chip Bonding for Semiconductor Packages
- Publication number 20240213035
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Chew Yeek Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20230246006
- Publication date Aug 3, 2023
- TDK Corporation
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY
- Publication number 20230057439
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20230057113
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216153
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20210225802
- Publication date Jul 22, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210111139
- Publication date Apr 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20210035937
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MAN...
- Publication number 20200402949
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming Hsien CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20200227378
- Publication date Jul 16, 2020
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20200098723
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BUMP STRUCTURES AND SEMICONDUCTOR PACKA...
- Publication number 20200075524
- Publication date Mar 5, 2020
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
- Publication number 20190252345
- Publication date Aug 15, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...
- Publication number 20190237434
- Publication date Aug 1, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190189577
- Publication date Jun 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SOLDER METHODOLOGIES FOR ULTRAHIGH DENSITY FIRST LEVEL INTERCO...
- Publication number 20190189581
- Publication date Jun 20, 2019
- Intel Corporation
- Chandramouleeswaran Subramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20190088608
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20190067239
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20190051629
- Publication date Feb 14, 2019
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...
- Publication number 20190013296
- Publication date Jan 10, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS

comprising an intermetallic compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced device assembly structures and methods

Package structure with a barrier layer

Solderless interconnection structure and method of forming same

Method for manufacturing semiconductor device having chip stacked a...

Dual solder methodologies for ultrahigh density first level interco...

Integrated device comprising pillar interconnect with cavity

Semiconductor device and method of making wafer level chip scale pa...

Method of manufacturing an electronic device and electronic device...

Multilayered transient liquid phase bonding

Semiconductor package having molded die and semiconductor die and m...

Semiconductor package including substrate with outer insulating layer

Method for forming package structure with a barrier layer

Package structure and method for connecting components

Dual solder methodologies for ultrahigh density first level interco...

Semiconductor device having chip stacked and molded

Semiconductor device structure having semiconductor die bonded to r...

Semiconductor packages with an intermetallic layer

Solderless interconnection structure and method of forming same

Connecting conductive pads with post-transition metal and nanoporou...

Semiconductor device and method

Method of manufacturing an electronic device and electronic device...

Interconnect structures with intermetallic palladium joints and ass...

Package structure with a barrier layer and method for forming the same

Non-porous copper to copper interconnect

Semiconductor device structure having semiconductor die bonded to r...

Semiconductor device and manufacturing method thereof

Method of manufacturing an electronic device and electronic device...

Non-porous copper to copper interconnect

Package-on-package (PoP) structure including stud bulbs

Embedded trace substrate structure and semiconductor package struct...

Patents Applicationslast 30 patents

Advanced Device Assembly Structures And Methods

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE WITH A BARRIER LAYER

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

Adaptive Flip Chip Bonding for Semiconductor Packages

JOINT STRUCTURE

SEMICONDUCTOR PACKAGE

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Solderless Interconnection Structure and Method of Forming Same

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER

WIRING STRUCTURE, SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MAN...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

NON-POROUS COPPER TO COPPER INTERCONNECT

SEMICONDUCTOR DEVICE HAVING BUMP STRUCTURES AND SEMICONDUCTOR PACKA...

ALLOY DIFFUSION BARRIER LAYER

Solderless Interconnection Structure and Method of Forming Same

PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS

INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

DUAL SOLDER METHODOLOGIES FOR ULTRAHIGH DENSITY FIRST LEVEL INTERCO...

Package-On-Package (PoP) Structure Including Stud Bulbs

ALLOY DIFFUSION BARRIER LAYER

NON-POROUS COPPER TO COPPER INTERCONNECT

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...