comprising apertures or cavities

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H01L2224/37011

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37011comprising apertures or cavities

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,715,676
- Issue date Aug 1, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module using same
- Patent number 11,694,948
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Masashi Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,274
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,910,294
- Issue date Feb 2, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated spring mounted chip termination
- Patent number 10,818,992
- Issue date Oct 27, 2020
- Smiths Interconnect Americas, Inc.
- Christopher Raymond Hawn
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 10,727,163
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 10,453,946
- Issue date Oct 22, 2019
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,028,400
- Issue date Jul 17, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 9,997,620
- Issue date Jun 12, 2018
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 9,704,979
- Issue date Jul 11, 2017
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,698,091
- Issue date Jul 4, 2017
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip mounting portion on which a sepa...
- Patent number 9,478,483
- Issue date Oct 25, 2016
- Renesas Electronics Corporation
- Yukihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 9,397,028
- Issue date Jul 19, 2016
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240244750
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234361
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240178179
- Publication date May 30, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136320
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240063073
- Publication date Feb 22, 2024
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...
- Publication number 20240021436
- Publication date Jan 18, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE
- Publication number 20240021568
- Publication date Jan 18, 2024
- LITTELFUSE, INC.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP APPLIED TO POWER MODULE
- Publication number 20230395554
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352376
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230343755
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER SEMICONDUCTOR DEVICES WITH IMPROVED PAR...
- Publication number 20230326907
- Publication date Oct 12, 2023
- Nexperia Technology (Shanghai) Ltd.
- Wei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND VEHICLE
- Publication number 20230260951
- Publication date Aug 17, 2023
- Fuji Electric Co., Ltd.
- Hitoshi NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092121
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND SEMICONDUCTOR MODULE
- Publication number 20210288016
- Publication date Sep 16, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210202429
- Publication date Jul 1, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210143087
- Publication date May 13, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Kenji NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200388562
- Publication date Dec 10, 2020
- J-DEVICES CORPORATION
- Kenji NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON CONTACT SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180182730
- Publication date Jun 28, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE
- Publication number 20170287818
- Publication date Oct 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module
- Publication number 20160181221
- Publication date Jun 23, 2016
- NSK LTD.
- Takashi SUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE
- Publication number 20140367739
- Publication date Dec 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...
- Publication number 20140299998
- Publication date Oct 9, 2014
- Eckart Geinitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF ELECTRON...
- Publication number 20140284077
- Publication date Sep 25, 2014
- KABUSHIKI KAISHA TOSHIBA
- Tetsuo SAKAI
- H01 - BASIC ELECTRIC ELEMENTS

comprising apertures or cavities

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Semiconductor device and semiconductor module using same

Additive manufacturing of a frontside or backside interconnect of a...

Electronic module

Semiconductor device

Porous Cu on Cu surface for semiconductor packages

Semiconductor device and method of manufacturing semiconductor device

Integrated spring mounted chip termination

Semiconductor device

Electrode terminal, semiconductor device, and power conversion appa...

Semiconductor devices and methods of making the same

Semiconductor module and conductive member for semiconductor module...

Semiconductor device and an electronic device

Method of manufacturing a semiconductor device

Semiconductor devices and methods of making the same

Semiconductor device

Semiconductor device and an electronic device

Semiconductor device, method of manufacturing a semiconductor devic...

Semiconductor device having multiple contact clips

Semiconductor device and an electronic device

Power semiconductor device

Power module and method of manufacturing power module

Semiconductor module

Semiconductor device and manufacturing method thereof

Semiconductor module package and method of manufacturing the same

Semiconductor device having a chip mounting portion on which a sepa...

Lead for connection to a semiconductor device

Semiconductor device

Semiconductor devices and methods of making the same

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...

POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE

METAL CLIP APPLIED TO POWER MODULE

POWER MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE FOR POWER SEMICONDUCTOR DEVICES WITH IMPROVED PAR...

SEMICONDUCTOR APPARATUS AND VEHICLE

SEMICONDUCTOR DEVICE

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

WIRING STRUCTURE AND SEMICONDUCTOR MODULE

ELECTRONIC MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Porous Cu on Cu Surface for Semiconductor Packages

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

COMMON CONTACT SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE

Semiconductor Module

SEMICONDUCTOR DEVICE AND AN ELECTRONIC DEVICE

METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...

BUS BAR, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF ELECTRON...