comprising conductive layers or plates or strips or rods or rings

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H01L23/585

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/585comprising conductive layers or plates or strips or rods or rings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with low loss waveguide interface and method t...
- Patent number 12,288,927
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure
- Patent number 12,288,735
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,283,477
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cumulative sealing structures
- Patent number 12,283,589
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Chen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,272,686
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,261,131
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Tsuneyuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with riveting structure between two rings and...
- Patent number 12,255,156
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme design for wafer singulation
- Patent number 12,249,580
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,589
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with crack-preventing structure
- Patent number 12,230,587
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with edge integrity detection structure
- Patent number 12,216,153
- Issue date Feb 4, 2025
- Avago Technologies International Sales Pte. Limited
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench MOS rectifier with termination structure
- Patent number 12,218,256
- Issue date Feb 4, 2025
- Diodes Incorporated
- Tao Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench structure for reduced wafer cracking
- Patent number 12,211,805
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures
- Patent number 12,205,907
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Bey Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced seal ring structure and method of making the same
- Patent number 12,199,049
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing for singulation
- Patent number 12,198,982
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 12,191,263
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with surface-contactable component embedded in la...
- Patent number 12,165,940
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-receiving element and distance-measuring module
- Patent number 12,158,542
- Issue date Dec 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ryota Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132269
- Publication date Apr 24, 2025
- Murata Manufacturing Co., Ltd.
- Shinya MASUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH STRUCTURE FOR REDUCED WAFER CRACKING
- Publication number 20250118684
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118685
- Publication date Apr 10, 2025
- RENESAS ELECTRONICS CORPORATION
- Takashi MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250118665
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Shih CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...
- Publication number 20250112167
- Publication date Apr 3, 2025
- Intel Corporation
- Kimberly Pierce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105169
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Leu-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250105174
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...
- Publication number 20250105175
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS
- Publication number 20250095951
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tsv structure and fabricating method of the same
- Publication number 20250087559
- Publication date Mar 13, 2025
- UNITED MICROELECTRONICS CORP.
- Hui-Lin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087601
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A CRACK-STOP RING STRUCTURE
- Publication number 20250087602
- Publication date Mar 13, 2025
- HangZhou HFC semiconductor Corporation
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK
- Publication number 20250079345
- Publication date Mar 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Ian McCallum-Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...
- Publication number 20250079346
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ting Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250070047
- Publication date Feb 27, 2025
- SK HYNIX INC.
- Yun Cheol HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM
- Publication number 20250070055
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Fengqun Lang
- B60 - VEHICLES IN GENERAL
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...
- Publication number 20250069982
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250069990
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Hsin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20250070052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAISY-CHAIN SEAL RING STRUCTURE
- Publication number 20250062166
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Surface-Contactable Component Embedded in La...
- Publication number 20250062171
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062252
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH DENSITY OF THROUGH-SILICON VIAS (TSV)
- Publication number 20250054881
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Front-to-Front Stacked Chips
- Publication number 20250046756
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF
- Publication number 20250046655
- Publication date Feb 6, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Chao Yi Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF
- Publication number 20250040275
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIEN-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS

comprising conductive layers or plates or strips or rods or rings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with low loss waveguide interface and method t...

Through via structure

Method of manufacturing a semiconductor device

Semiconductor device including cumulative sealing structures

Extended seal ring structure on wafer-stacking

Semiconductor die including through substrate via barrier structure...

Method of making electrostatic discharge protection cell and antenn...

Semiconductor structure and manufacturing method of the same

Semiconductor device and method of manufacturing semiconductor device

Structure and method for sealing a silicon IC

Semiconductor package with riveting structure between two rings and...

Passivation scheme design for wafer singulation

Package structure and methods of manufacturing the same

Semiconductor package

Wafer level package with polymer layer delamination prevention desi...

Semiconductor device with crack-preventing structure

Semiconductor product with edge integrity detection structure

Trench MOS rectifier with termination structure

Trench structure for reduced wafer cracking

Semiconductor package and manufacturing method thereof

Seal ring structures

Electronic package and manufacturing method thereof

Advanced seal ring structure and method of making the same

Laser dicing for singulation

Semiconductor structure and manufacturing method of semiconductor s...

Semiconductor die package with multi-lid structures and method for...

Daisy-chain seal ring structure

Metal-free frame design for silicon bridges for semiconductor packages

Component carrier with surface-contactable component embedded in la...

Light-receiving element and distance-measuring module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

TRENCH STRUCTURE FOR REDUCED WAFER CRACKING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...

ELECTRONIC COMPONENT AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS

Tsv structure and fabricating method of the same

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP HAVING A CRACK-STOP RING STRUCTURE

SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK

STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...

DAISY-CHAIN SEAL RING STRUCTURE

Component Carrier With Surface-Contactable Component Embedded in La...

SEMICONDUCTOR PACKAGE

FORMING LARGE CHIPS THROUGH STITCHING

SEMICONDUCTOR PACKAGE WITH HIGH DENSITY OF THROUGH-SILICON VIAS (TSV)

Interconnect Structure for Front-to-Front Stacked Chips

MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF

SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF