comprising conductive layers or plates or strips or rods or rings

Industry

CPC
H01L23/585

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/585comprising conductive layers or plates or strips or rods or rings

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double seal ring and electrical connection of multiple chiplets
- Patent number 12,362,293
- Issue date Jul 15, 2025
- MARVELL ASIA PTE. LTD.
- Lijuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring structure
- Patent number 12,354,975
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing integrated deep trench optically sensitive defec...
- Patent number 12,354,904
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical integrated circuit structure including edge coupling protec...
- Patent number 12,353,034
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,354,976
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring with continuous ring shape features for semiconductor dev...
- Patent number 12,347,794
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mandrel fin design for double seal ring
- Patent number 12,341,113
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,342,579
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy patterns in redundant region of double seal ring
- Patent number 12,341,071
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for die crack detection
- Patent number 12,327,802
- Issue date Jun 10, 2025
- WIN SEMICONDUCTORS CORP.
- Chu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 12,327,801
- Issue date Jun 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal ring structure
- Patent number 12,322,711
- Issue date Jun 3, 2025
- United Microelectronics Corp.
- Chia-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with guard ring
- Patent number 12,315,798
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including seal ring structure
- Patent number 12,315,827
- Issue date May 27, 2025
- United Microelectronics Corp.
- Hui-Lung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect beyond sealring boundary
- Patent number 12,308,330
- Issue date May 20, 2025
- Ceremorphic, Inc.
- Robert Wiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having functional patterns in redundant region...
- Patent number 12,300,635
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure and method of fabricating the same
- Patent number 12,300,636
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with low loss waveguide interface and method t...
- Patent number 12,288,927
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure
- Patent number 12,288,735
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,283,477
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cumulative sealing structures
- Patent number 12,283,589
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Chen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,272,686
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,261,131
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Tsuneyuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with riveting structure between two rings and...
- Patent number 12,255,156
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20250239541
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Via Power Delivery Structure for Stacked Chips
- Publication number 20250233054
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226314
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- JEEWOONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THE...
- Publication number 20250226330
- Publication date Jul 10, 2025
- Global Unichip Corporation
- Wei-Chiao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250218875
- Publication date Jul 3, 2025
- MEDIATEK INC.
- Cing-Yao JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20250218765
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL STRUCTURES
- Publication number 20250221022
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250220927
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY
- Publication number 20250218878
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE, METHOD OF FORMING REDISTRIBUTION LA...
- Publication number 20250219003
- Publication date Jul 3, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH CAPACITOR AND METHODS FOR MAKING
- Publication number 20250210508
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Jing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BASED ON HETEROSTRUCTURE HAVING A BACK CONTACT...
- Publication number 20250212439
- Publication date Jun 26, 2025
- STMicroelectronics International N.V.
- Ferdinando IUCOLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210589
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A DEFECT REGION AND METHOD OF FABRICATION...
- Publication number 20250210546
- Publication date Jun 26, 2025
- NXP B.V.
- Petrus Hubertus Cornelis Magnee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...
- Publication number 20250210468
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250210488
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chih Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250210614
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-JIER FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS
- Publication number 20250210463
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR COMPONENT
- Publication number 20250201737
- Publication date Jun 19, 2025
- XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
- Houngchi WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192027
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND...
- Publication number 20250192072
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192074
- Publication date Jun 12, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES
- Publication number 20250183199
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Bey Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION
- Publication number 20250183192
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174580
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250167140
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20250157948
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20250157915
- Publication date May 15, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157917
- Publication date May 15, 2025
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS

comprising conductive layers or plates or strips or rods or rings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die package with ring structure

Double seal ring and electrical connection of multiple chiplets

Guard ring structure

Method of reducing integrated deep trench optically sensitive defec...

Optical integrated circuit structure including edge coupling protec...

Semiconductor device and electronic device

Seal ring with continuous ring shape features for semiconductor dev...

Mandrel fin design for double seal ring

Semiconductor device

Dummy patterns in redundant region of double seal ring

Semiconductor structure for die crack detection

Robust mold integrated substrate

Die seal ring structure

Semiconductor die including through substrate via barrier structure...

Integrated circuit with guard ring

Semiconductor structure including seal ring structure

Chip to chip interconnect beyond sealring boundary

Semiconductor device having functional patterns in redundant region...

Seal ring structure and method of fabricating the same

Semiconductor device with low loss waveguide interface and method t...

Through via structure

Method of manufacturing a semiconductor device

Semiconductor device including cumulative sealing structures

Extended seal ring structure on wafer-stacking

Semiconductor die including through substrate via barrier structure...

Method of making electrostatic discharge protection cell and antenn...

Semiconductor structure and manufacturing method of the same

Semiconductor device and method of manufacturing semiconductor device

Structure and method for sealing a silicon IC

Semiconductor package with riveting structure between two rings and...

Patents Applicationslast 30 patents

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

Through Via Power Delivery Structure for Stacked Chips

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THE...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEAL STRUCTURES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY

REDISTRIBUTION LAYER STRUCTURE, METHOD OF FORMING REDISTRIBUTION LA...

INTERCONNECT STRUCTURE WITH CAPACITOR AND METHODS FOR MAKING

SEMICONDUCTOR DEVICE BASED ON HETEROSTRUCTURE HAVING A BACK CONTACT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH A DEFECT REGION AND METHOD OF FABRICATION...

SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS

SEMICONDUCTOR CHIP AND SEMICONDUCTOR COMPONENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

SEAL RING STRUCTURES

PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE