comprising conductive layers or plates or strips or rods or rings

Industry

CPC
H01L23/585

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/585comprising conductive layers or plates or strips or rods or rings

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical integrated circuit structure including edge coupling protec...
- Patent number 11,940,659
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection cell and antenna integrated with...
- Patent number 11,942,441
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme design for wafer singulation
- Patent number 11,942,436
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalysts with modified active phase dispersion and method to prepa...
- Patent number 11,935,827
- Issue date Mar 19, 2024
- Saudi Arabian Oil Company
- Omer Refa Koseoglu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density flip chip package for wireless transceivers
- Patent number 11,923,323
- Issue date Mar 5, 2024
- QUALCOMM Incorporated
- Ibrahim Ramez Chamas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 11,894,319
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land-side silicon capacitor design and semiconductor package using...
- Patent number 11,887,976
- Issue date Jan 30, 2024
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance high voltage isolators
- Patent number 11,881,449
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor package seal rings
- Patent number 11,881,460
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack and integrated device structure including improved bondin...
- Patent number 11,869,859
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 11,869,853
- Issue date Jan 9, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 11,862,557
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a crack detection ring and a crack dete...
- Patent number 11,862,575
- Issue date Jan 2, 2024
- SK Hynix Inc.
- Sung Ryong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,855,007
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting defects in semiconductor device
- Patent number 11,854,913
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor devices with recesses for dicing and me...
- Patent number 11,854,887
- Issue date Dec 26, 2023
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Weixing Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crackstop with embedded passive radio frequency noise suppressor an...
- Patent number 11,855,005
- Issue date Dec 26, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method for forming features in redundan...
- Patent number 11,855,010
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,848,282
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including buried dielectric pattern at edge regi...
- Patent number 11,848,285
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit containing a transformer and corresponding method
- Patent number 11,841,394
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Marcus Nuebling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced seal ring structure and method of making the same
- Patent number 11,830,825
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for detection of defects in semiconductor devices
- Patent number 11,830,828
- Issue date Nov 28, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with rotated semiconductor die
- Patent number 11,830,820
- Issue date Nov 28, 2023
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip and semiconductor package including the same
- Patent number 11,830,840
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Young Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
- Publication number 20240136305
- Publication date Apr 25, 2024
- Macronix International Co., Ltd.
- Cheng-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20240120295
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hsien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS
- Publication number 20240120270
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE
- Publication number 20240113042
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS
- Publication number 20240088015
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jeewoong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20240088200
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jeewoong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH GUARD RING
- Publication number 20240088027
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiao-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20240088066
- Publication date Mar 14, 2024
- EM Microelectronic-Marin SA
- Christophe ENTRINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE
- Publication number 20240079283
- Publication date Mar 7, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIA WITH GUARD RING STRUCTURE
- Publication number 20240071956
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR STRUCTURE INCLUDING BUFFER LAYER
- Publication number 20240063158
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh SINGH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240055371
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20240055358
- Publication date Feb 15, 2024
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20240047353
- Publication date Feb 8, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
- Publication number 20240047383
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240047384
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047440
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME
- Publication number 20240047513
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240038684
- Publication date Feb 1, 2024
- United Microelectronics Corp.
- Ming-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Sealing a Silicon IC
- Publication number 20240038689
- Publication date Feb 1, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240038686
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038688
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038674
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACKSTOP WITH EMBEDDED PASSIVE RADIO FREQUENCY NOISE SUPPRESSOR AN...
- Publication number 20240030160
- Publication date Jan 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR ASSEMBLY
- Publication number 20240030081
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scribe Edge Protection Structure for Semiconductor Devices
- Publication number 20240030158
- Publication date Jan 25, 2024
- Apple Inc.
- Szu-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR HYBRID-BOND
- Publication number 20240021544
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND APPARATUS COMPRISING AN OPTICAL SENSOR
- Publication number 20240011828
- Publication date Jan 11, 2024
- STMicroelectronics (Research and Development) Limited
- Jeffrey M. RAYNOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR RF ISOLATION STRUCTURE IN AN INTERPOSER AND METHODS OF FOR...
- Publication number 20240014115
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006344
- Publication date Jan 4, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS

comprising conductive layers or plates or strips or rods or rings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated high voltage capacitor

Interconnect structure and forming method thereof

Optical integrated circuit structure including edge coupling protec...

Electrostatic discharge protection cell and antenna integrated with...

Passivation scheme design for wafer singulation

Semiconductor structure and method of forming the same

Catalysts with modified active phase dispersion and method to prepa...

Methods of manufacturing an integrated circuit having stress tuning...

High-density flip chip package for wireless transceivers

Extended seal ring structure on wafer-stacking

Land-side silicon capacitor design and semiconductor package using...

High performance high voltage isolators

Ceramic semiconductor package seal rings

Die stack and integrated device structure including improved bondin...

Semiconductor device and electronic device

Selectable monolithic or external scalable die-to-die interconnecti...

Semiconductor device having a crack detection ring and a crack dete...

Semiconductor structure

Method for detecting defects in semiconductor device

Nitride-based semiconductor devices with recesses for dicing and me...

Crackstop with embedded passive radio frequency noise suppressor an...

Semiconductor structure and method for forming features in redundan...

Semiconductor devices having crack-inhibiting structures

Semiconductor chip including buried dielectric pattern at edge regi...

Circuit containing a transformer and corresponding method

Seal ring structures and methods of forming same

Advanced seal ring structure and method of making the same

System and method for detection of defects in semiconductor devices

Electronic package with rotated semiconductor die

Integrated chip and semiconductor package including the same

Patents Applicationslast 30 patents

3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS

SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE

INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS

INTEGRATED CIRCUIT

INTEGRATED CIRCUIT WITH GUARD RING

SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE

THROUGH VIA WITH GUARD RING STRUCTURE

METHOD OF MAKING SEMICONDUCTOR STRUCTURE INCLUDING BUFFER LAYER

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

Structure and Method for Sealing a Silicon IC

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CRACKSTOP WITH EMBEDDED PASSIVE RADIO FREQUENCY NOISE SUPPRESSOR AN...

SEMICONDUCTOR ASSEMBLY

Scribe Edge Protection Structure for Semiconductor Devices

SEAL RING FOR HYBRID-BOND

OPTICAL SENSOR AND APPARATUS COMPRISING AN OPTICAL SENSOR

INDUCTOR RF ISOLATION STRUCTURE IN AN INTERPOSER AND METHODS OF FOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME