comprising flexible or deformable structures

Industry

CPC
B81C1/00134

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00134comprising flexible or deformable structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
MEMS structure including a cap with a via
- Patent number 12,043,542
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Altti Torkkeli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component and method for producing a micromechanica...
- Patent number 11,940,618
- Issue date Mar 26, 2024
- Robert Bosch GmbH
- Alexander Eberspaecher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined multi-axis gyroscopes with reduced stress sensitivity
- Patent number 11,898,845
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mirror assembly for light steering with reduced finger thickness
- Patent number 11,815,627
- Issue date Nov 14, 2023
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and electronic apparatus
- Patent number 11,262,376
- Issue date Mar 1, 2022
- Weifang Goertek Microelectronics Co., Ltd.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Versatile, flexible and biocompatible elastomeric microtubes
- Patent number 11,161,736
- Issue date Nov 2, 2021
- National University of Singapore
- Wang Xi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device stress-reducing structure
- Patent number 11,142,453
- Issue date Oct 12, 2021
- TDK Corporation
- Klaus Mayer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices with an element having varying widths
- Patent number 11,130,670
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Ying Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing MEMS device and MEMS device
- Patent number 11,114,604
- Issue date Sep 7, 2021
- Seiko Epson Corporation
- Yoshiki Sugawara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromachined multi-axis gyroscopes with reduced stress sensitivity
- Patent number 11,085,766
- Issue date Aug 10, 2021
- Semiconductor Components Industries, LLC
- Cenk Acar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for fabricating 3D soft microstructures
- Patent number 11,014,804
- Issue date May 25, 2021
- President and Fellows of Harvard College
- Nicholas W. Bartlett
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Supply system for an extreme ultraviolet light source
- Patent number 10,904,994
- Issue date Jan 26, 2021
- ASML Netherlands B.V.
- Koen Gerhardus Winkels
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device including a capacitor
- Patent number 10,861,929
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a remote-controlled micro-scale three-dimen...
- Patent number 10,821,565
- Issue date Nov 3, 2020
- Regents of The University of Minnesota
- Chao Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Release hole plus contact via for fine pitch ultrasound transducer...
- Patent number 10,722,918
- Issue date Jul 28, 2020
- QUALCOMM Incorporated
- Donald William Kidwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Complementary metal oxide semiconductor (CMOS) ultrasonic transduce...
- Patent number 10,710,873
- Issue date Jul 14, 2020
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication process for a symmetrical MEMS accelerometer
- Patent number 10,647,570
- Issue date May 12, 2020
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS integrated pressure sensor devices and methods of forming same
- Patent number 10,508,029
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Proof mass and polysilicon electrode integrated thereon
- Patent number 10,505,006
- Issue date Dec 10, 2019
- Invensense, Inc.
- Bongsang Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Supply system for an extreme ultraviolet light source
- Patent number 10,499,485
- Issue date Dec 3, 2019
- ASML Netherlands B.V.
- Koen Gerhardus Winkels
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication process for a symmetrical MEMS accelerometer
- Patent number 10,392,247
- Issue date Aug 27, 2019
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device including micromechanical components in cavities having diff...
- Patent number 10,384,932
- Issue date Aug 20, 2019
- Robert Bosch GmbH
- Achim Breitling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming micro-electro-mechanical devices including a con...
- Patent number 10,266,390
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Ying Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system device
- Patent number 10,266,391
- Issue date Apr 23, 2019
- MIRAMEMS SENSING TECHNOLOGY CO., LTD
- I-Heng Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Complementary metal oxide semiconductor (CMOS) ultrasonic transduce...
- Patent number 10,266,401
- Issue date Apr 23, 2019
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone and method for producing a microphone
- Patent number 10,117,027
- Issue date Oct 30, 2018
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device with electrode connected to through wire, and method for man...
- Patent number 10,090,780
- Issue date Oct 2, 2018
- Canon Kabushiki Kaisha
- Shinan Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS and method for forming the same
- Patent number 10,023,459
- Issue date Jul 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS integrated pressure sensor devices and methods of forming same
- Patent number 10,017,382
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device and method for manufacturing a micromechanic...
- Patent number 9,988,261
- Issue date Jun 5, 2018
- Robert Bosch GmbH
- Julian Gonska
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STRETCHABLE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220162060
- Publication date May 26, 2022
- Korea Institute of Science and Technology
- Seungjun CHUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MIRROR ASSEMBLY FOR LIGHT STEERING WITH REDUCED FINGER THICKNESS
- Publication number 20210396850
- Publication date Dec 23, 2021
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY
- Publication number 20210372795
- Publication date Dec 2, 2021
- Semiconductor Components Industries, LLC
- Cenk ACAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICA...
- Publication number 20210271073
- Publication date Sep 2, 2021
- ROBERT BOSCH GmbH
- Alexander Eberspaecher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE INCLUDING A CAP WITH A VIA
- Publication number 20200283292
- Publication date Sep 10, 2020
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPLY SYSTEM FOR AN EXTREME ULTRAVIOLET LIGHT SOURCE
- Publication number 20200128657
- Publication date Apr 23, 2020
- ASML NETHERLANDS B.V.
- Koen Gerhardus Winkels
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING 3D SOFT MICROSTRUCTURES
- Publication number 20200079643
- Publication date Mar 12, 2020
- President and Fellows of Harvard College
- Nicholas W. Bartlett
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE INCLUDING A CAPACITOR
- Publication number 20200006470
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION PROCESS FOR A SYMMETRICAL MEMS ACCELEROMETER
- Publication number 20190382264
- Publication date Dec 19, 2019
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Lianzhong YU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device
- Publication number 20190375630
- Publication date Dec 12, 2019
- TDK Electronics AG
- Klaus Mayer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods of Forming the Same
- Publication number 20190248646
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Ying Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCE...
- Publication number 20190210869
- Publication date Jul 11, 2019
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY
- Publication number 20190145772
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Cenk ACAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190079110
- Publication date Mar 14, 2019
- GOERTEK INC
- Quanbo ZOU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Versatile, Flexible And Biocompatible Elastomeric Microtubes
- Publication number 20190062152
- Publication date Feb 28, 2019
- Wang XI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MEMS DEVICE AND MEMS DEVICE
- Publication number 20190036006
- Publication date Jan 31, 2019
- SEIKO EPSON CORPORATION
- Yoshiki SUGAWARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPLY SYSTEM FOR AN EXTREME ULTRAVIOLET LIGHT SOURCE
- Publication number 20180368242
- Publication date Dec 20, 2018
- ASML NETHERLANDS B.V.
- Koen Gerhardus Winkels
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE PACKAGE AND METHOD FOR PACKAGING MEMS DEVICE
- Publication number 20180297836
- Publication date Oct 18, 2018
- Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- WaiSoon Liew
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCE...
- Publication number 20180186628
- Publication date Jul 5, 2018
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCE...
- Publication number 20170283254
- Publication date Oct 5, 2017
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone and Method for Producing a Microphone
- Publication number 20170070825
- Publication date Mar 9, 2017
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER...
- Publication number 20170066014
- Publication date Mar 9, 2017
- QUALCOMM Incorporated
- Donald William Kidwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS Integrated Moving-Gate Transducer with Silicon as a Functional...
- Publication number 20160115013
- Publication date Apr 28, 2016
- ROBERT BOSCH GmbH
- Ando Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE WITH ELECTRODE CONNECTED TO THROUGH WIRE, AND METHOD FOR MAN...
- Publication number 20160043660
- Publication date Feb 11, 2016
- Canon Kabushiki Kaisha
- Shinan Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical sensor device
- Publication number 20150375990
- Publication date Dec 31, 2015
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ETCH RELEASE RESIDUE REMOVAL USING ANHYDROUS SOLUTION
- Publication number 20150368099
- Publication date Dec 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Srivatsa G. Kundalgurki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROELECTRONIC AND/OR NANOELECTRONIC DEVICE WITH INCREA...
- Publication number 20150338246
- Publication date Nov 26, 2015
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Philippe ROBERT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-STATE INTERFEROMETRIC MODULATOR WITH LARGE STABLE RANGE OF MO...
- Publication number 20150205092
- Publication date Jul 23, 2015
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Teruo Sasagawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS PRESSURE SENSOR WITH MECHANICAL ELECTRICAL ISOLATION
- Publication number 20150060956
- Publication date Mar 5, 2015
- WindTop Technology Corp.
- Kun-Lung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE PRESSURE SENSORS AND FABRICATION METHODS THEREOF
- Publication number 20150061047
- Publication date Mar 5, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- QIYANG HE
- B81 - MICRO-STRUCTURAL TECHNOLOGY

comprising flexible or deformable structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS structure including a cap with a via

Micromechanical component and method for producing a micromechanica...

Micromachined multi-axis gyroscopes with reduced stress sensitivity

Mirror assembly for light steering with reduced finger thickness

MEMS device and electronic apparatus

Versatile, flexible and biocompatible elastomeric microtubes

MEMS device stress-reducing structure

MEMS devices with an element having varying widths

Method of manufacturing MEMS device and MEMS device

Micromachined multi-axis gyroscopes with reduced stress sensitivity

Systems and methods for fabricating 3D soft microstructures

Supply system for an extreme ultraviolet light source

Electronic device including a capacitor

Method of manufacturing a remote-controlled micro-scale three-dimen...

Release hole plus contact via for fine pitch ultrasound transducer...

Complementary metal oxide semiconductor (CMOS) ultrasonic transduce...

Fabrication process for a symmetrical MEMS accelerometer

MEMS integrated pressure sensor devices and methods of forming same

Proof mass and polysilicon electrode integrated thereon

Supply system for an extreme ultraviolet light source

Fabrication process for a symmetrical MEMS accelerometer

Device including micromechanical components in cavities having diff...

Methods of forming micro-electro-mechanical devices including a con...

Microelectromechanical system device

Complementary metal oxide semiconductor (CMOS) ultrasonic transduce...

Microphone and method for producing a microphone

Device with electrode connected to through wire, and method for man...

MEMS and method for forming the same

MEMS integrated pressure sensor devices and methods of forming same

Micromechanical device and method for manufacturing a micromechanic...

Patents Applicationslast 30 patents

STRETCHABLE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

MIRROR ASSEMBLY FOR LIGHT STEERING WITH REDUCED FINGER THICKNESS

MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY

MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICA...

MEMS STRUCTURE INCLUDING A CAP WITH A VIA

SUPPLY SYSTEM FOR AN EXTREME ULTRAVIOLET LIGHT SOURCE

SYSTEMS AND METHODS FOR FABRICATING 3D SOFT MICROSTRUCTURES

ELECTRONIC DEVICE INCLUDING A CAPACITOR

FABRICATION PROCESS FOR A SYMMETRICAL MEMS ACCELEROMETER

MEMS Device

MEMS Devices and Methods of Forming the Same

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCE...

MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY

MEMS DEVICE AND ELECTRONIC APPARATUS

Versatile, Flexible And Biocompatible Elastomeric Microtubes

METHOD OF MANUFACTURING MEMS DEVICE AND MEMS DEVICE

SUPPLY SYSTEM FOR AN EXTREME ULTRAVIOLET LIGHT SOURCE

MEMS DEVICE PACKAGE AND METHOD FOR PACKAGING MEMS DEVICE

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCE...

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCE...

Microphone and Method for Producing a Microphone

RELEASE HOLE PLUS CONTACT VIA FOR FINE PITCH ULTRASOUND TRANSDUCER...

CMOS Integrated Moving-Gate Transducer with Silicon as a Functional...

DEVICE WITH ELECTRODE CONNECTED TO THROUGH WIRE, AND METHOD FOR MAN...

Micromechanical sensor device

ETCH RELEASE RESIDUE REMOVAL USING ANHYDROUS SOLUTION

CAPACITIVE MICROELECTRONIC AND/OR NANOELECTRONIC DEVICE WITH INCREA...

MULTI-STATE INTERFEROMETRIC MODULATOR WITH LARGE STABLE RANGE OF MO...

INTEGRATED MEMS PRESSURE SENSOR WITH MECHANICAL ELECTRICAL ISOLATION

CAPACITIVE PRESSURE SENSORS AND FABRICATION METHODS THEREOF