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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package
Patent number
12,368,119
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Basin-shaped underbump plates and methods of forming the same
Patent number
12,362,299
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,354,980
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Boin Noh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display backboard and manufacturing method thereof and display device
Patent number
12,336,355
Issue date
Jun 17, 2025
BOE Technology Group Co., Ltd.
Zhiwei Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with redistribution plugs
Patent number
12,315,793
Issue date
May 27, 2025
NANYA TECHNOLOGY CORPORATION
Chun-Cheng Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
12,243,837
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
12,237,282
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passivation structure with planar top surfaces
Patent number
12,218,022
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
12,191,266
Issue date
Jan 7, 2025
Kabushiki Kaisha Toshiba
Emiko Inoue
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Manufacturing method of an electronic apparatus
Patent number
12,191,277
Issue date
Jan 7, 2025
INNOLUX CORPORATION
Ming-Chang Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with barrier layer
Patent number
12,148,722
Issue date
Nov 19, 2024
NANYA TECHNOLOGY CORPORATION
Ming-Hung Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip bonding method and semiconductor chip structure
Patent number
12,119,315
Issue date
Oct 15, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Chih-Wei Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Patterned and planarized under-bump metallization
Patent number
12,119,316
Issue date
Oct 15, 2024
NXP USA, INC.
Namrata Kanth
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
12,119,314
Issue date
Oct 15, 2024
Mitsubishi Electric Corporation
Nobuyoshi Kimoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for fabricating semiconductor device with redistribution plugs
Patent number
12,112,978
Issue date
Oct 8, 2024
NANYA TECHNOLOGY CORPORATION
Chun-Cheng Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method to minimize stress on stack via
Patent number
12,080,600
Issue date
Sep 3, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonded structures with integrated passive component
Patent number
12,057,383
Issue date
Aug 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Structure and method of forming a joint assembly
Patent number
12,009,335
Issue date
Jun 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
Patent number
12,002,773
Issue date
Jun 4, 2024
Raytheon Company
Andrew Clarke
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Pad structure for front side illuminated image sensor
Patent number
11,996,433
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chun Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,984,417
Issue date
May 14, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method for forming same
Patent number
11,973,045
Issue date
Apr 30, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method
Patent number
11,855,017
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passivation structure with planar top surfaces
Patent number
11,817,361
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display backboard and manufacturing method thereof and display device
Patent number
11,764,343
Issue date
Sep 19, 2023
BOE Technology Group Co., Ltd.
Zhiwei Liang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
11,749,635
Issue date
Sep 5, 2023
SK hynix Inc.
Nam Jae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,742,271
Issue date
Aug 29, 2023
Samsung Electronics Co., Ltd.
Gyuho Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure and method of forming same
Patent number
11,728,296
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiao Yun Lo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
Patent number
11,728,297
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
11,688,707
Issue date
Jun 27, 2023
Samsung Electronics Co., Ltd.
Joonho Jun
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...
Publication number
20250233095
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Jaesic Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250210555
Publication date
Jun 26, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250212480
Publication date
Jun 26, 2025
Kabushiki Kaisha Toshiba
Yoshiki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250192081
Publication date
Jun 12, 2025
REALTEK SEMICONDUCTOR CORPORATION
Wen Cheng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
Publication number
20250183208
Publication date
Jun 5, 2025
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20250183204
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250140726
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Kyunglyul LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
Publication number
20250140627
Publication date
May 1, 2025
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
Publication number
20250125248
Publication date
Apr 17, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250079360
Publication date
Mar 6, 2025
MEDIATEK INC.
Cheng Lin HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
Publication number
20250070017
Publication date
Feb 27, 2025
NANYA TECHNOLOGY CORPORATION
Chun-Cheng LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20250029941
Publication date
Jan 23, 2025
Samsung Electronics Co., Ltd.
HYUNSU HWANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250006644
Publication date
Jan 2, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzuan-Horng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240395743
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
Publication number
20240387423
Publication date
Nov 21, 2024
NEXPERIA B.V.
Vasantha Kumar Vaddagere Nagaraju
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
Publication number
20240339419
Publication date
Oct 10, 2024
Sumitomo Electric Industries, Ltd.
Shota SAMBONSUGE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240304576
Publication date
Sep 12, 2024
KIOXIA Corporation
Yuya KIYOMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method of Forming a Joint Assembly
Publication number
20240282743
Publication date
Aug 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240274556
Publication date
Aug 15, 2024
Samsung Electronics Co., Ltd.
Won CHOI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC COMPONENT
Publication number
20240250048
Publication date
Jul 25, 2024
TDK Corporation
Kosuke TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240222299
Publication date
Jul 4, 2024
Samsung Electronics Co., Ltd.
Hwan Young CHOI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240162343
Publication date
May 16, 2024
RENESAS ELECTRONICS CORPORATION
Yuji ENARI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240120304
Publication date
Apr 11, 2024
Innolux Corporation
Tzu-Sheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
Publication number
20240063151
Publication date
Feb 22, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
Publication number
20240063153
Publication date
Feb 22, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...
Publication number
20240057350
Publication date
Feb 15, 2024
Changxin Memory Technologies, Inc.
LING-YI CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SE...
Publication number
20240055375
Publication date
Feb 15, 2024
Fuji Electric Co., Ltd.
Takashi TSUJI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE
Publication number
20240047510
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240021550
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240021551
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS