Conductive materials

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CPC
H05K2201/03

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/03Conductive materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded body and method for manufacturing i...
- Patent number 12,356,554
- Issue date Jul 8, 2025
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,356,546
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric circuit board and power module
- Patent number 12,349,299
- Issue date Jul 1, 2025
- Kyocera Corporation
- Yoshitada Konishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method of wiring board
- Patent number 12,342,457
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, copper foil with resin, and printed wiring board
- Patent number 12,331,212
- Issue date Jun 17, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Kazuhiro Oosawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composite copper components
- Patent number 12,336,116
- Issue date Jun 17, 2025
- Namics Corporation
- Naoki Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 12,320,028
- Issue date Jun 3, 2025
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Copper clad laminate film and electronic device including same
- Patent number 12,324,094
- Issue date Jun 3, 2025
- Toray Advanced Materials Korea Inc.
- Jong Hun Cheon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer-multi-turn structure for high efficiency wireless commu...
- Patent number 12,316,128
- Issue date May 27, 2025
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate, single-sided metal-clad laminated sheet, and multi-layer...
- Patent number 12,309,919
- Issue date May 20, 2025
- Kaneka Corporation
- Kanji Shimoosako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure embedded substrate and substrate structure inc...
- Patent number 12,309,924
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hong Min
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with convex shaped post, light emitting device, and m...
- Patent number 12,309,934
- Issue date May 20, 2025
- Nichia Corporation
- Yosuke Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary carrier and method for manufacturing coreless substrate t...
- Patent number 12,302,508
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method for multilayer wiring board
- Patent number 12,302,504
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and storage device including the same
- Patent number 12,295,095
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sunhong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible membrane adapted to carry high-frequency (RF) power signal...
- Patent number 12,292,457
- Issue date May 6, 2025
- Technoprobe S.p.A.
- Flavio Maggioni
- G01 - MEASURING TESTING
Information Patent Grant
Providing one or more carbon layers to a copper conductive material...
- Patent number 12,289,831
- Issue date Apr 29, 2025
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet
- Patent number 12,286,573
- Issue date Apr 29, 2025
- MEKTEC CORPORATION
- Masayuki Iwase
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Loss-dissipation flexible copper clad laminate, manufacturing metho...
- Patent number 12,286,511
- Issue date Apr 29, 2025
- CPC CORPORATION, TAIWAN
- Ching-Hsuan Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive particles and connection structure
- Patent number 12,288,629
- Issue date Apr 29, 2025
- Sekisui Chemical Co., Ltd.
- Yuto Dobashi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interconnect structure for insertion loss reduction in signal trans...
- Patent number 12,283,488
- Issue date Apr 22, 2025
- Yuan Ze University
- Cheng En Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate and carrier plate wiring structure with filter...
- Patent number 12,279,377
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with a magnetic element and a manufacturing method
- Patent number 12,279,372
- Issue date Apr 15, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,274,001
- Issue date Apr 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Min Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mold adhesion boundary for die attach pad
- Patent number 12,274,006
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate plate and printed wiring board
- Patent number 12,262,469
- Issue date Mar 25, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Daisuke Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,262,468
- Issue date Mar 25, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONIC SYSTEM WITH CONDUCTOR HAVING DAMPING FUNCTION
- Publication number 20250239378
- Publication date Jul 24, 2025
- Delta Electronics, Inc.
- Boyi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM,...
- Publication number 20250230279
- Publication date Jul 17, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki UMEHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME
- Publication number 20250230298
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
- Publication number 20250223471
- Publication date Jul 10, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Tomohiro NAGATAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...
- Publication number 20250227847
- Publication date Jul 10, 2025
- LG ENERGY SOLUTION, LTD.
- Sang Ok Seon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING SOLDER WALL
- Publication number 20250227852
- Publication date Jul 10, 2025
- Samsung Electronics Co., LTD
- Eun-seok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250220813
- Publication date Jul 3, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC TEXTILES AND SYSTEMS AND PROCESSES ASSOCIATED THEREWITH
- Publication number 20250215639
- Publication date Jul 3, 2025
- Purdue Research Foundation
- Chi Hwan Lee
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20250212337
- Publication date Jun 26, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
- Publication number 20250203772
- Publication date Jun 19, 2025
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Louis Diamond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250203774
- Publication date Jun 19, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Deok Hong Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250185180
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD F...
- Publication number 20250168969
- Publication date May 22, 2025
- Circuit Foil Luxembourg
- Roman MICHEZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20250168977
- Publication date May 22, 2025
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...
- Publication number 20250159807
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...
- Publication number 20250151208
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS FILM AND COPPER CLAD LAMINATE
- Publication number 20250129212
- Publication date Apr 24, 2025
- Industrial Technology Research Institute
- Li-Ting HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126707
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Won Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126718
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126715
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hak KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...
- Publication number 20250126716
- Publication date Apr 17, 2025
- NXP USA, Inc.
- Boon Yew Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250120016
- Publication date Apr 10, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20250120012
- Publication date Apr 10, 2025
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTIC INTERPOSER AND CONDUCTIVE DEVICE THEREOF
- Publication number 20250113435
- Publication date Apr 3, 2025
- XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
- Choon Leong LOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250107001
- Publication date Mar 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...
- Publication number 20250106987
- Publication date Mar 27, 2025
- CYNTEC CO., LTD.
- Chia-Fu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20250096673
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H01 - BASIC ELECTRIC ELEMENTS

Conductive materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing bonded body and method for manufacturing i...

Printed circuit board

Electric circuit board and power module

Wiring board and manufacturing method of wiring board

Resin composition, copper foil with resin, and printed wiring board

Composite copper components

Electrochemical three-dimensional printing and soldering

Copper clad laminate film and electronic device including same

Multi-layer-multi-turn structure for high efficiency wireless commu...

Laminate, single-sided metal-clad laminated sheet, and multi-layer...

Connection structure embedded substrate and substrate structure inc...

Circuit board with convex shaped post, light emitting device, and m...

Temporary carrier and method for manufacturing coreless substrate t...

Production method for multilayer wiring board

Conductive structure including copper-phosphorous alloy and a metho...

Printed circuit board and storage device including the same

Flexible membrane adapted to carry high-frequency (RF) power signal...

Providing one or more carbon layers to a copper conductive material...

Adhesive sheet

Loss-dissipation flexible copper clad laminate, manufacturing metho...

Conductive particles and connection structure

Interconnect structure for insertion loss reduction in signal trans...

Wiring circuit board

Conductive substrate and carrier plate wiring structure with filter...

Component carrier with a magnetic element and a manufacturing method

Printed circuit board

Printed circuit board with mold adhesion boundary for die attach pad

Multilayer resin substrate and method for producing same

Copper-clad laminate plate and printed wiring board

Copper-clad laminate and method of forming the same

Patents Applicationslast 30 patents

POWER ELECTRONIC SYSTEM WITH CONDUCTOR HAVING DAMPING FUNCTION

RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM,...

COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME

CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE

Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...

ELECTRONIC DEVICE COMPRISING SOLDER WALL

WIRING BOARD

ELECTRONIC TEXTILES AND SYSTEMS AND PROCESSES ASSOCIATED THEREWITH

PRINTED CIRCUIT BOARD

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD F...

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...

SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...

POROUS FILM AND COPPER CLAD LAMINATE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...

WIRING BOARD

STRETCHABLE DEVICE

ELASTIC INTERPOSER AND CONDUCTIVE DEVICE THEREOF

COIL DEVICE AND PRINTED WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

SWITCHING POWER SUPPLY DEVICE