Conductive materials

Industry

CPC
H05K2201/03

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/03Conductive materials

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminated plate, resin-clad copper foil, and circuit su...
- Patent number 12,233,621
- Issue date Feb 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof, and terminal device
- Patent number 12,219,695
- Issue date Feb 4, 2025
- HONOR DEVICE CO., LTD.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery interconnects
- Patent number 12,218,385
- Issue date Feb 4, 2025
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,207,410
- Issue date Jan 21, 2025
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting assembly, camera module, and electronic device
- Patent number 12,206,975
- Issue date Jan 21, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Fei-Fan Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board with polymer conductive members
- Patent number 12,200,865
- Issue date Jan 14, 2025
- BizLink International Corp.
- Shi-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,144
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yukio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support substrate and method for producing a support substrate
- Patent number 12,177,970
- Issue date Dec 24, 2024
- Rogers Germany GmbH
- Tilo Welker
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Printed wiring board
- Patent number 12,177,973
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,177,975
- Issue date Dec 24, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device
- Patent number 12,160,950
- Issue date Dec 3, 2024
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic imide resin composition, prepreg, copper-clad laminate and p...
- Patent number 12,146,057
- Issue date Nov 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater having flexible printed wiring board and method for manufact...
- Patent number 12,144,068
- Issue date Nov 12, 2024
- Nippon Mektron, Ltd.
- Garo Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20250081358
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus of Conductive Hybrid Material Layer Stacks wit...
- Publication number 20250081341
- Publication date Mar 6, 2025
- Atlas Magnetics
- John Othniel McDonald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250071887
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES
- Publication number 20250071883
- Publication date Feb 27, 2025
- Elbit Systems Ltd.
- Reut BEN ZAKEN (BITTON)
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250071896
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250063655
- Publication date Feb 20, 2025
- Primax Electronics Ltd.
- Lei-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL
- Publication number 20250059665
- Publication date Feb 20, 2025
- Shenzhen Institute of Advanced Electronic Materials
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...
- Publication number 20250063656
- Publication date Feb 20, 2025
- MIDAS H&T INC.
- Se Yun CHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250063665
- Publication date Feb 20, 2025
- TDK Corporation
- Yukari WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250063653
- Publication date Feb 20, 2025
- InnoLux Corporation
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method for producing a metal ceramic su...
- Publication number 20250048556
- Publication date Feb 6, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
- Publication number 20250040036
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF...
- Publication number 20250031314
- Publication date Jan 23, 2025
- SAFRAN
- Rabih KHAZAKA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING...
- Publication number 20250011940
- Publication date Jan 9, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Masami SONE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHIELDABLE CIRCUIT BOARD STRUCTURE
- Publication number 20250016910
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN
- Publication number 20250016929
- Publication date Jan 9, 2025
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...
- Publication number 20250016919
- Publication date Jan 9, 2025
- Mitsubishi Electric Corporation
- Motoki MASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008645
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008652
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...
- Publication number 20240431035
- Publication date Dec 26, 2024
- HAESUNG DS CO., LTD.
- Myeong Jin HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fuse and Method of Fabricating the Same
- Publication number 20240429013
- Publication date Dec 26, 2024
- LG ENERGY SOLUTION, LTD.
- Chang Bog Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Conductive materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board

Printed circuit board and electronic device including same

Component carrier with embedded semiconductor component and embedde...

Copper-clad laminated plate, resin-clad copper foil, and circuit su...

Circuit board and method for manufacturing the same

Printed circuit board and method of fabricating the same

Conductive paste and electronic device

Circuit board and manufacturing method thereof, and terminal device

Battery interconnects

Wiring circuit board

Connecting assembly, camera module, and electronic device

Circuit board with polymer conductive members

Fine pitch copper pillar package and method

Substrate for mounting electronic element, electronic device, and e...

Module

Module

Flexible wiring board

Support substrate and method for producing a support substrate

Printed wiring board

Wiring substrate

Flexible printed circuit board and method of manufacturing flexible...

Metal foil with carrier and preparation method thereof

Electronic device

Cyclic imide resin composition, prepreg, copper-clad laminate and p...

Heater having flexible printed wiring board and method for manufact...

Wiring structure and method of manufacturing the same, semiconducto...

Low-roughness surface-treated copper foil with low bending deformat...

Resin composition, resin sheet, multilayer printed wiring board, an...

Wiring substrate and semiconductor device

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Patents Applicationslast 30 patents

WIRING BOARD

Method and Apparatus of Conductive Hybrid Material Layer Stacks wit...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

MEMBRANE CIRCUIT BOARD

ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL

SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

ELECTRONIC DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Metal-ceramic substrate and method for producing a metal ceramic su...

WIRING SUBSTRATE

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF...

ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING...

SHIELDABLE CIRCUIT BOARD STRUCTURE

SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN

MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...

Fuse and Method of Fabricating the Same

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

PRINTED CIRCUIT BOARD