Conductive materials

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CPC
H05K2201/03

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/03Conductive materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device
- Patent number 12,160,950
- Issue date Dec 3, 2024
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic imide resin composition, prepreg, copper-clad laminate and p...
- Patent number 12,146,057
- Issue date Nov 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater having flexible printed wiring board and method for manufact...
- Patent number 12,144,068
- Issue date Nov 12, 2024
- Nippon Mektron, Ltd.
- Garo Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-roughened electrodeposited copper foil and copper clad laminate
- Patent number 12,120,816
- Issue date Oct 15, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting electronic component, substrate and an optical s...
- Patent number 12,114,434
- Issue date Oct 8, 2024
- Canon Kabushiki Kaisha
- Shunsuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,114,417
- Issue date Oct 8, 2024
- Sumitomo Bakelite Co., Ltd.
- Nobuo Tagashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible conductive elastomer for electrical connection of orth...
- Patent number 12,095,192
- Issue date Sep 17, 2024
- Vitesco Technologies USA, LLC.
- David W Ivaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image forming apparatus including a printed circuit board connectab...
- Patent number 12,085,868
- Issue date Sep 10, 2024
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal circuit structure based on FPC and method of making the same
- Patent number 12,089,331
- Issue date Sep 10, 2024
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Optical sensor and optical sensor module
- Patent number 12,078,561
- Issue date Sep 3, 2024
- Sony Group Corporation
- Tomoko Katsuhara
- G01 - MEASURING TESTING
Information Patent Grant
Devices and methods to improve thermal conduction from SMT and chip...
- Patent number 12,082,334
- Issue date Sep 3, 2024
- Hamilton Sundstrand Corporation
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pad structure
- Patent number 12,075,566
- Issue date Aug 27, 2024
- Innolux Corporation
- Yu-Ting Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...
- Publication number 20240397616
- Publication date Nov 28, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389234
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240389229
- Publication date Nov 21, 2024
- InnoLux Corporation
- Yu-Ting LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...
- Publication number 20240388019
- Publication date Nov 21, 2024
- HARTING ELECTRONICS GMBH
- Markus FRIESEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE FORMING APPARATUS
- Publication number 20240369951
- Publication date Nov 7, 2024
- Canon Kabushiki Kaisha
- SHINSUKE SERIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...
- Publication number 20240373543
- Publication date Nov 7, 2024
- GUANGZHOU ON-BRIGHT ELECTRONICS CO., LTD.
- XIAOKUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240373545
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Hsiang-Hua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR WIRING BOARD
- Publication number 20240365466
- Publication date Oct 31, 2024
- YAZAKI CORPORATION
- Hideaki Kikuchi
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...
- Publication number 20240356168
- Publication date Oct 24, 2024
- Airbus SAS
- Alois FRIEDBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION OF CABLES FOR A CONNECTOR
- Publication number 20240356251
- Publication date Oct 24, 2024
- Cisco Technology, Inc.
- David Nozadze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20240357740
- Publication date Oct 24, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing SUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
Transparent Conductive Film
- Publication number 20240355501
- Publication date Oct 24, 2024
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240349422
- Publication date Oct 17, 2024
- SONY GROUP CORPORATION
- Kenji UEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer-Multi-Turn Structure For High Efficiency Wireless Commu...
- Publication number 20240348091
- Publication date Oct 17, 2024
- NUCURRENT, INC.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240334610
- Publication date Oct 3, 2024
- InnoLux Corporation
- Hsin-Li CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Conductive materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal foil with carrier and preparation method thereof

Electronic device

Cyclic imide resin composition, prepreg, copper-clad laminate and p...

Heater having flexible printed wiring board and method for manufact...

Wiring structure and method of manufacturing the same, semiconducto...

Low-roughness surface-treated copper foil with low bending deformat...

Resin composition, resin sheet, multilayer printed wiring board, an...

Wiring substrate and semiconductor device

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Micro-roughened electrodeposited copper foil and copper clad laminate

Reel mechanism and winding device for flexible copper clad laminate

Wiring structure, method for manufacturing same, and semiconductor...

Method of mounting electronic component, substrate and an optical s...

Circuit board

Ceramic-copper composite, ceramic circuit board, power module, and...

Circuit board using thermocouple to dissipate generated heat and me...

Printed circuit board

Flexible circuit board

Compressible conductive elastomer for electrical connection of orth...

Insulated circuit board

Image forming apparatus including a printed circuit board connectab...

Metal-coated liquid-crystal polymer film

Metal circuit structure based on FPC and method of making the same

Electronic device

Micro assembled LED displays and lighting elements

Optical sensor and optical sensor module

Devices and methods to improve thermal conduction from SMT and chip...

Flexible circuit board

Bonding pad structure

Electromagnetic wave transmission board comprising an inner board w...

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

PRINTED CIRCUIT BOARD

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

CIRCUIT MODULE

ELECTRONIC DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

IMAGE FORMING APPARATUS

PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

VEHICULAR WIRING BOARD

ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...

TERMINATION OF CABLES FOR A CONNECTOR

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

Transparent Conductive Film

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Multi-Layer-Multi-Turn Structure For High Efficiency Wireless Commu...

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

WIRING SUBSTRATE

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

WIRING SUBSTRATE

ELECTRONIC DEVICE