Conductive materials

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  • Information Patent Application

    POROUS FILM AND COPPER CLAD LAMINATE

    • Publication number 20250129212
    • Publication date Apr 24, 2025
    • Industrial Technology Research Institute
    • Li-Ting HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250126707
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Won Han
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250126718
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Ho Shin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20250126709
    • Publication date Apr 17, 2025
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250126715
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Hak KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...

    • Publication number 20250126716
    • Publication date Apr 17, 2025
    • NXP USA, Inc.
    • Boon Yew Low
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD

    • Publication number 20250120016
    • Publication date Apr 10, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRETCHABLE DEVICE

    • Publication number 20250120012
    • Publication date Apr 10, 2025
    • Murata Manufacturing Co., Ltd.
    • Takayoshi Obata
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELASTIC INTERPOSER AND CONDUCTIVE DEVICE THEREOF

    • Publication number 20250113435
    • Publication date Apr 3, 2025
    • XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
    • Choon Leong LOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COIL DEVICE AND PRINTED WIRING BOARD

    • Publication number 20250107001
    • Publication date Mar 27, 2025
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Michi OGATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...

    • Publication number 20250106987
    • Publication date Mar 27, 2025
    • CYNTEC CO., LTD.
    • Chia-Fu Hsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

    • Publication number 20250106997
    • Publication date Mar 27, 2025
    • Intel Corporation
    • Ehsan ZAMANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SWITCHING POWER SUPPLY DEVICE

    • Publication number 20250096673
    • Publication date Mar 20, 2025
    • Murata Manufacturing Co., Ltd.
    • Tatsuya HOSOTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

    • Publication number 20250089171
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRETCHABLE DEVICE

    • Publication number 20250089159
    • Publication date Mar 13, 2025
    • Murata Manufacturing Co., Ltd.
    • Koji YOSHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LOW STRESS THROUGH GLASS VIAS (TGVS)

    • Publication number 20250089156
    • Publication date Mar 13, 2025
    • Intel Corporation
    • Mohamed R. SABER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250089165
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Hun NA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD

    • Publication number 20250081358
    • Publication date Mar 6, 2025
    • Shinko Electric Industries Co., Ltd.
    • Takashi NISHIYAMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and Apparatus of Conductive Hybrid Material Layer Stacks wit...

    • Publication number 20250081341
    • Publication date Mar 6, 2025
    • Atlas Magnetics
    • John Othniel McDonald
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20250071887
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • In Gun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

    • Publication number 20250071894
    • Publication date Feb 27, 2025
    • Sumitomo Electric Industries, Ltd.
    • Hiroshi UEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

    • Publication number 20250071883
    • Publication date Feb 27, 2025
    • Elbit Systems Ltd.
    • Reut BEN ZAKEN (BITTON)
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

    • Publication number 20250071896
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Ho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MEMBRANE CIRCUIT BOARD

    • Publication number 20250063655
    • Publication date Feb 20, 2025
    • Primax Electronics Ltd.
    • Lei-Lung Tsai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL

    • Publication number 20250059665
    • Publication date Feb 20, 2025
    • Shenzhen Institute of Advanced Electronic Materials
    • Zhe Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...

    • Publication number 20250063656
    • Publication date Feb 20, 2025
    • MIDAS H&T INC.
    • Se Yun CHANG
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

    • Publication number 20250063665
    • Publication date Feb 20, 2025
    • TDK Corporation
    • Yukari WADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20250063653
    • Publication date Feb 20, 2025
    • InnoLux Corporation
    • Roger HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

    • Publication number 20250056721
    • Publication date Feb 13, 2025
    • HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
    • Cheng-Jia LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Metal-ceramic substrate and method for producing a metal ceramic su...

    • Publication number 20250048556
    • Publication date Feb 6, 2025
    • Rogers Germany GmbH
    • Andreas Meyer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR