Conformal deposition

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H01L2224/03466

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03466Conformal deposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 12,300,548
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,295,225
- Issue date May 6, 2025
- Samsung Display Co., Ltd.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,237,282
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad fabrication process for a semiconductor product
- Patent number 12,170,256
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 12,154,876
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,059
- Issue date Oct 1, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 11,764,110
- Issue date Sep 19, 2023
- Semiconductor Components Industries, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative integration for redistribution layer process
- Patent number 11,450,631
- Issue date Sep 20, 2022
- Lam Research Corporation
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 11,424,205
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 10,910,331
- Issue date Feb 2, 2021
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing contact areas on a semiconductor substrate
- Patent number 10,332,850
- Issue date Jun 25, 2019
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve CMP scratch resistance for non planar surfaces
- Patent number 10,090,264
- Issue date Oct 2, 2018
- Texas Instruments Incorporated
- Jonathan Philip Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,805,937
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for fine pitch assembly of semiconductor st...
- Patent number 9,786,633
- Issue date Oct 10, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure having wirebonds and method of manufacturin...
- Patent number 9,613,843
- Issue date Apr 4, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having texturized solder pads and methods...
- Patent number 9,281,286
- Issue date Mar 8, 2016
- Freescale Semiconductor Inc.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 9,224,649
- Issue date Dec 29, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,196,505
- Issue date Nov 24, 2015
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 8,796,828
- Issue date Aug 5, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 8,610,264
- Issue date Dec 17, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 8,450,856
- Issue date May 28, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE
- Publication number 20250201775
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...
- Publication number 20250157959
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Joon MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Comprising Structured Contacts and A Method...
- Publication number 20250118691
- Publication date Apr 10, 2025
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022758
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20240395748
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
- Publication number 20240395741
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- Publication number 20240178167
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...
- Publication number 20230377974
- Publication date Nov 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230361062
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION
- Publication number 20230238341
- Publication date Jul 27, 2023
- STMicroelectronics Pte Ltd
- Churn Weng YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PAD FABRICATION PROCESS FOR A SEMICONDUCTOR PRODUCT
- Publication number 20230061951
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230027391
- Publication date Jan 26, 2023
- SAMSUNG DISPLAY CO., LTD.
- Na Hyeon CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220328435
- Publication date Oct 13, 2022
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKLIGHT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220302181
- Publication date Sep 22, 2022
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Junling LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093544
- Publication date Mar 24, 2022
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20200006266
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES
- Publication number 20190006299
- Publication date Jan 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Philip Davis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Conditioning And Material Modification In A Semiconductor D...
- Publication number 20170345780
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Murlidhar Bashyam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES
- Publication number 20170162526
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Philip Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR FINE PITCH ASSEMBLY OF SEMICONDUCTOR ST...
- Publication number 20170098627
- Publication date Apr 6, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING TEXTURIZED SOLDER PADS AND METHODS...
- Publication number 20160064341
- Publication date Mar 3, 2016
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Contact Areas on a Semiconductor Substrate
- Publication number 20140374919
- Publication date Dec 25, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140342503
- Publication date Nov 20, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS

Conformal deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Moat coverage with dielectric film for device passivation and singu...

Display device

Semiconductor device and method of forming the same

Contact pad fabrication process for a semiconductor product

Semiconductor interconnect structure and method

Semiconductor package and manufacturing method thereof

Semiconductor device including bond pad with fixing parts fixed ont...

Moat coverage with dielectric film for device passivation and singu...

Semiconductor device bonding area including fused solder film and m...

Alternative integration for redistribution layer process

Semiconductor interconnect structure and method

Semiconductor device bonding area including fused solder film and m...

Method for producing contact areas on a semiconductor substrate

Power overlay structure and reconstituted semiconductor wafer havin...

Method to improve CMP scratch resistance for non planar surfaces

Method of manufacturing semiconductor device and semiconductor device

Interconnect structures for fine pitch assembly of semiconductor st...

Power overlay structure having wirebonds and method of manufacturin...

Microelectronic packages having texturized solder pads and methods...

Compliant interconnects in wafers

Semiconductor device and method of forming the same

Compliant interconnects in wafers

Compliant interconnects in wafers

Semiconductor device and method of forming the same

Patents Applicationslast 30 patents

HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...

Semiconductor Component Comprising Structured Contacts and A Method...

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

INTEGRATED CIRCUIT PACKAGES AND METHODS

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

Grain Structure Engineering for Metal Gapfill Materials

SEMICONDUCTOR DEVICE

Semiconductor Interconnect Structure and Method

METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGES

MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION

CONTACT PAD FABRICATION PROCESS FOR A SEMICONDUCTOR PRODUCT

DISPLAY DEVICE

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

BACKLIGHT MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Semiconductor Interconnect Structure and Method

METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Surface Conditioning And Material Modification In A Semiconductor D...

METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES

INTERCONNECT STRUCTURES FOR FINE PITCH ASSEMBLY OF SEMICONDUCTOR ST...

MICROELECTRONIC PACKAGES HAVING TEXTURIZED SOLDER PADS AND METHODS...

Method for Producing Contact Areas on a Semiconductor Substrate

COMPLIANT INTERCONNECTS IN WAFERS