connected to auxiliary connecting means on the bonding areas

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CPC
H01L2224/48475

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48475connected to auxiliary connecting means on the bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,281,457
- Issue date Mar 8, 2016
- Nichia Corporation
- Satoshi Shirahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,190,385
- Issue date Nov 17, 2015
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with copper wire ball-bonded to electrode pad...
- Patent number 8,692,370
- Issue date Apr 8, 2014
- Semiconductor Components Industries, LLC
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,604,627
- Issue date Dec 10, 2013
- Rohm Co., Ltd.
- Hideki Hiromoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package system with stackable devices and a meth...
- Patent number 8,559,185
- Issue date Oct 15, 2013
- Stats Chippac Ltd.
- Sang-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for wire bond
- Patent number 8,524,529
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor component having through wire interconnect (T...
- Patent number 8,513,797
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,476,726
- Issue date Jul 2, 2013
- Nichia Corporation
- Satoshi Shirahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 8,446,015
- Issue date May 21, 2013
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relay board and semiconductor device having the relay board
- Patent number 8,404,980
- Issue date Mar 26, 2013
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stacked semiconductor system with encapsulat...
- Patent number 8,404,523
- Issue date Mar 26, 2013
- Micron Technoloy, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package system with thermal die bonding
- Patent number 8,304,922
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Sangkwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure and method that eliminates special wire bond...
- Patent number 8,269,356
- Issue date Sep 18, 2012
- Stats Chippac Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof for effecti...
- Patent number 8,242,594
- Issue date Aug 14, 2012
- Unimicron Technology Corp.
- Chung-Pan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having stacked components with encapsul...
- Patent number 8,217,510
- Issue date Jul 10, 2012
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
System-in-package packaging for minimizing bond wire contamination...
- Patent number 8,217,520
- Issue date Jul 10, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through wire interconnect (TWI) with...
- Patent number 8,193,646
- Issue date Jun 5, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for stackable devices
- Patent number 8,189,344
- Issue date May 29, 2012
- Stats Chippac Ltd.
- Sang-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack resistant circuit under pad structure and method of manufactu...
- Patent number 8,183,663
- Issue date May 22, 2012
- Samsung Electronics Co., Ltd.
- Kyounghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement having specially fashioned bond wires
- Patent number 8,174,104
- Issue date May 8, 2012
- Micronas GmbH
- Pascal Stumpf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Aluminum bump bonding for fine aluminum wire
- Patent number 8,138,081
- Issue date Mar 20, 2012
- Fairchild Semiconductor Corporation
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20130267050
- Publication date Oct 10, 2013
- Satoshi SHIRAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKABLE DEVICES AND A METH...
- Publication number 20120228767
- Publication date Sep 13, 2012
- Sang-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACE FOR WIRE BOND
- Publication number 20120077316
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20120049362
- Publication date Mar 1, 2012
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20110304046
- Publication date Dec 15, 2011
- ON SEMICONDUCTOR TRADING, LTD. a Bermuda limited company
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF
- Publication number 20110266700
- Publication date Nov 3, 2011
- Hun-Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110159644
- Publication date Jun 30, 2011
- Renesas Electronics Corporation
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK RESISTANT CIRCUIT UNDER PAD STRUCTURE AND METHOD OF MANUFACTU...
- Publication number 20110101487
- Publication date May 5, 2011
- Samsung Electronics Co., Ltd.
- Kyounghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...
- Publication number 20110089566
- Publication date Apr 21, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...
- Publication number 20110057296
- Publication date Mar 10, 2011
- TEXAS INSTRUMENTS INCORPORATED
- CHIEN-TE FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System With Semiconductor Components Having Encapsulated Through Wi...
- Publication number 20110024745
- Publication date Feb 3, 2011
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...
- Publication number 20110018135
- Publication date Jan 27, 2011
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295180
- Publication date Nov 25, 2010
- GREAT TEAM BACKEND FOUNDRY INC.
- CHING HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20100276802
- Publication date Nov 4, 2010
- Nichia Corporation.
- Satoshi SHIRAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Having Through Wire Interconnect (TWI) With...
- Publication number 20100264521
- Publication date Oct 21, 2010
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264534
- Publication date Oct 21, 2010
- Unimicron Technology Corp.
- Chung-Pan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELAY BOARD AND SEMICONDUCTOR DEVICE HAVING THE RELAY BOARD
- Publication number 20100258926
- Publication date Oct 14, 2010
- FUJITSU SEMICONDUCTOR LIMITED (Formerly Fujitsu Microelectronics Limited)
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100255637
- Publication date Oct 7, 2010
- KABUSHIKI KAISHA TOSHIBA
- Katsuhiro Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20100248470
- Publication date Sep 30, 2010
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20100237480
- Publication date Sep 23, 2010
- SHINKAWA LTD.
- Tatsunari Mii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND INTERCONNECTION
- Publication number 20100225008
- Publication date Sep 9, 2010
- Hun-Teak Lee
- H01 - BASIC ELECTRIC ELEMENTS

connected to auxiliary connecting means on the bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin plastic leadless package with exposed metal die paddle

Bonding structure of bonding wire

Semiconductor device and method of manufacturing the semiconductor...

Thin plastic leadless package with exposed metal die paddle

Mixed wire semiconductor lead frame package

Semiconductor module system having encapsulated through wire interc...

Through wire interconnect (TWI) for semiconductor components having...

Method for fabricating a through wire interconnect (TWI) on a semic...

Semiconductor device with copper wire ball-bonded to electrode pad...

Semiconductor device

Through wire interconnect (TWI) having bonded connection and encaps...

Integrated circuit package system with stackable devices and a meth...

Brace for wire bond

Stacked semiconductor component having through wire interconnect (T...

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor device and method for manufacturing thereof

Relay board and semiconductor device having the relay board

Method for fabricating stacked semiconductor system with encapsulat...

Semiconductor package system with thermal die bonding

Wire bonding structure and method that eliminates special wire bond...

Chip package structure and manufacturing method thereof for effecti...

Semiconductor module system having stacked components with encapsul...

System-in-package packaging for minimizing bond wire contamination...

Semiconductor component having through wire interconnect (TWI) with...

Integrated circuit package system for stackable devices

Crack resistant circuit under pad structure and method of manufactu...

Semiconductor arrangement having specially fashioned bond wires

Semiconductor device

Aluminum bump bonding for fine aluminum wire

Semiconductor device and manufacturing method for the same

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

Through Wire Interconnect (TWI) For Semiconductor Components Having...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKABLE DEVICES AND A METH...

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

BRACE FOR WIRE BOND

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

Semiconductor Module System Having Stacked Components With Encapsul...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

WIRE BOND INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

CRACK RESISTANT CIRCUIT UNDER PAD STRUCTURE AND METHOD OF MANUFACTU...

BONDING STRUCTURE OF BONDING WIRE

WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...

DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...

System With Semiconductor Components Having Encapsulated Through Wi...

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Component Having Through Wire Interconnect (TWI) With...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

RELAY BOARD AND SEMICONDUCTOR DEVICE HAVING THE RELAY BOARD

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

WIRE BOND INTERCONNECTION