Connecting at different heights

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H01L2224/49105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49105Connecting at different heights

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 11,830,798
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting element package including solder bump
- Patent number 10,361,351
- Issue date Jul 23, 2019
- Samsung Electronics Co., Ltd.
- Chang Hoon Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnected package on package
- Patent number 10,242,965
- Issue date Mar 26, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,204,892
- Issue date Feb 12, 2019
- Samsung Electronics Co., Ltd.
- Tae-young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package having patterned insulation metal substrate
- Patent number 10,056,319
- Issue date Aug 21, 2018
- DELTA ELECTRONICS, INC.
- Chia-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for communication systems transceiver interfaces
- Patent number 9,831,233
- Issue date Nov 28, 2017
- Analog Devices Global
- Javier Alejandro Salcedo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealing layer covering a semiconducto...
- Patent number 9,543,271
- Issue date Jan 10, 2017
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with output circuit and pad arrangements
- Patent number 9,343,460
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,224,717
- Issue date Dec 29, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with output circuit and pad
- Patent number 9,093,283
- Issue date Jul 28, 2015
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with output circuit arrangement
- Patent number 8,552,561
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,714,357
- Issue date May 11, 2010
- Renesas Technology Corp.
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE
- Publication number 20240030190
- Publication date Jan 25, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Honglong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ENCAPSULANT
- Publication number 20230083493
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Seungwan SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20220302008
- Publication date Sep 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20220037285
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Hyunjun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTED PACKAGE ON PACKAGE
- Publication number 20180005974
- Publication date Jan 4, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170358564
- Publication date Dec 14, 2017
- Samsung Electronics Co., Ltd.
- Tae-young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR COMMUNICATION SYSTEMS TRANSCEIVER INTERFACES
- Publication number 20170317070
- Publication date Nov 2, 2017
- ANALOG DEVICES GLOBAL
- Javier Alejandro Salcedo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE
- Publication number 20170317015
- Publication date Nov 2, 2017
- Delta Electronics, Inc.
- Chia-Yen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEALING LAYER COVERING A SEMICONDUCTO...
- Publication number 20160268229
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Manabu MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150108579
- Publication date Apr 23, 2015
- RENESAS ELECTRONICS CORPORATION
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20150091118
- Publication date Apr 2, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130341728
- Publication date Dec 26, 2013
- RENESAS ELECTRONICS CORPORATION
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100171177
- Publication date Jul 8, 2010
- RENESAS TECHNOLOGY CORP.
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090050940
- Publication date Feb 26, 2009
- RENESAS TECHNOLOGY CORP.
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070120258
- Publication date May 31, 2007
- RENESAS TECHNOLOGY CORP.
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

Connecting at different heights

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Method for fabricating stack die package

Semiconductor light emitting element package including solder bump

Semiconductor device including interconnected package on package

Semiconductor package

Package-on-package assembly with wire bonds to encapsulation surface

Power module package having patterned insulation metal substrate

Apparatuses for communication systems transceiver interfaces

Package-on-package assembly with wire bonds to encapsulation surface

Method for fabricating stack die package

Semiconductor device having a sealing layer covering a semiconducto...

Semiconductor device with output circuit and pad arrangements

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor devices with output circuit and pad

Semiconductor device with output circuit arrangement

Semiconductor device

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR STACK STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING AN ENCAPSULANT

SEMICONDUCTOR DEVICE PACKAGE

MULTI-CHIP PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTED PACKAGE ON PACKAGE

SEMICONDUCTOR PACKAGE

APPARATUSES FOR COMMUNICATION SYSTEMS TRANSCEIVER INTERFACES

POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE

SEMICONDUCTOR DEVICE HAVING A SEALING LAYER COVERING A SEMICONDUCTO...

SEMICONDUCTOR DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

METHOD FOR FABRICATING STACK DIE PACKAGE

Semiconductor Device

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device