Connecting between different semiconductor or solid-state bodies

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H01L2224/48135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48135Connecting between different semiconductor or solid-state bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging concepts for integration of ASICs and optical co...
- Patent number 11,651,976
- Issue date May 16, 2023
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including routing dies and methods of formin...
- Patent number 11,177,201
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,163,833
- Issue date Dec 25, 2018
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,109,565
- Issue date Oct 23, 2018
- Renesas Electronics Corporation
- Keita Takada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Compensation of bondwires in the microwave regime
- Patent number 10,014,276
- Issue date Jul 3, 2018
- The United States of America, as represented by the Secretary of the Navy
- Jia-Chi Samuel Chieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing the module
- Patent number 9,613,938
- Issue date Apr 4, 2017
- Mitsumi Electric Co., Ltd.
- Soichiro Suzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package module and a doped polysilicon trench for isolat...
- Patent number 9,048,104
- Issue date Jun 2, 2015
- Microchip Technology Inc.
- Benedict C. K. Choy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor package apparatus having a responsive bendab...
- Patent number 8,618,656
- Issue date Dec 31, 2013
- Hynix Semiconductor Inc.
- Tac Keun Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 8,472,196
- Issue date Jun 25, 2013
- Delta Electronics, Inc.
- Jian-Hong Zeng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flexible semiconductor package apparatus having a responsive bendab...
- Patent number 8,049,332
- Issue date Nov 1, 2011
- Hynix Semiconductor Inc.
- Tac Keun Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi chip package structure having a plurality of semiconductor ch...
- Patent number 6,972,487
- Issue date Dec 6, 2005
- Fujitsu Limited
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240194551
- Publication date Jun 13, 2024
- Mitsubishi Electric Corporation
- Akitoshi SHIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL
- Publication number 20240030208
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
- Publication number 20230402361
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
- Publication number 20230386865
- Publication date Nov 30, 2023
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Wire and Method for Manufacturing the Same
- Publication number 20230125151
- Publication date Apr 27, 2023
- Nippon Telegraph and Telephone Corporation
- Toshiki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005884
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Minkyeong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20220375892
- Publication date Nov 24, 2022
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
- Publication number 20210090908
- Publication date Mar 25, 2021
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20190088607
- Publication date Mar 21, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multichip modules and methods of fabrication
- Publication number 20170236794
- Publication date Aug 17, 2017
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170179010
- Publication date Jun 22, 2017
- RENESAS ELECTRONICS CORPORATION
- Keita TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20150221595
- Publication date Aug 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS
- Publication number 20130193589
- Publication date Aug 1, 2013
- ROBERT J. WENZEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...
- Publication number 20120038054
- Publication date Feb 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
- Publication number 20120013016
- Publication date Jan 19, 2012
- Tac Keun OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20120014069
- Publication date Jan 19, 2012
- Jian-Hong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package Module And A Doped Polysilicon Trench For Isolat...
- Publication number 20120007216
- Publication date Jan 12, 2012
- SUPERTEX, INC.
- Benedict C. K. Choy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
- Publication number 20100109140
- Publication date May 6, 2010
- Tac Keun OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20060226529
- Publication date Oct 12, 2006
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20050161794
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20020140107
- Publication date Oct 3, 2002
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS

Connecting between different semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Impedance controlled electrical interconnection employing meta-mate...

Embedded packaging concepts for integration of ASICs and optical co...

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor packages including routing dies and methods of formin...

Multichip modules and methods of fabrication

Impedance controlled electrical interconnection employing meta-mate...

Multichip modules and methods of fabrication

Semiconductor device

Compensation of bondwires in the microwave regime

Module and method for manufacturing the module

Multi-chip package module and a doped polysilicon trench for isolat...

Flexible semiconductor package apparatus having a responsive bendab...

Power module

Flexible semiconductor package apparatus having a responsive bendab...

Multi chip package structure having a plurality of semiconductor ch...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

Embedded Packaging Concepts for Integration of ASICs and Optical Co...

Bonding Wire and Method for Manufacturing the Same

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR PACKAGE

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

Embedded Packaging Concepts for Integration of ASICs and Optical Co...

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

MULTICHIP MODULES AND METHODS OF FABRICATION

Multichip modules and methods of fabrication

SEMICONDUCTOR DEVICE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS

IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...

FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...

POWER MODULE

Multi-Chip Package Module And A Doped Polysilicon Trench For Isolat...

FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...

Semiconductor device, method for manufacturing the semiconductor de...

Semiconductor device, method for manufacturing the semiconductor de...

Semiconductor device, method for manufacturing the semiconductor de...