Connecting between the body and an opposite side of the item with respect to the body

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H01L2224/4024

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4024Connecting between the body and an opposite side of the item with respect to the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
- Patent number 12,334,466
- Issue date Jun 17, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with improved inspectability of stacked semico...
- Patent number 12,334,418
- Issue date Jun 17, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal clip and related methods of ma...
- Patent number 12,266,628
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 12,261,145
- Issue date Mar 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,224,230
- Issue date Feb 11, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yasuaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power storage pack, semiconductor device, and semiconductor device...
- Patent number 12,165,958
- Issue date Dec 10, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Toshifumi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 12,159,815
- Issue date Dec 3, 2024
- Silanna Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sense terminal
- Patent number 12,113,041
- Issue date Oct 8, 2024
- Renesas Electronics Corporation
- Noriko Okunishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding method
- Patent number 12,080,675
- Issue date Sep 3, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package having a lateral power transistor with segmented chi...
- Patent number 12,040,302
- Issue date Jul 16, 2024
- Infineon Technologies Austria AG
- Hyeongnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of dies electrically connected to a printed circuit board...
- Patent number 11,935,807
- Issue date Mar 19, 2024
- Hamilton Sundstrand Corporation
- Karthik Debbadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side heat dissipation for silicon chip package
- Patent number 11,842,952
- Issue date Dec 12, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 11,830,784
- Issue date Nov 28, 2023
- Semiconductor Components Industries, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density and durable semiconductor device interconnect
- Patent number 11,756,923
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,715,676
- Issue date Aug 1, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,699,692
- Issue date Jul 11, 2023
- Kabushiki Kaisha Toshiba
- Takamitsu Noda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233085
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250233099
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...
- Publication number 20250219029
- Publication date Jul 3, 2025
- MURATA MANUFACTURING CO., LTD.
- David M. GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210578
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
- Publication number 20250210574
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Engineered Interconnect Structures for Enhanced Bonding Strength
- Publication number 20250201674
- Publication date Jun 19, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201678
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CARRIER, A SEMICONDUCTOR DIE AND...
- Publication number 20250201754
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Joon Shyan TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...
- Publication number 20250201653
- Publication date Jun 19, 2025
- Vishay General Semiconductor LLC
- Huiying DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20250192093
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20250183132
- Publication date Jun 5, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR DEVICE
- Publication number 20250183118
- Publication date Jun 5, 2025
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167079
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Ryoji MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...
- Publication number 20250157857
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES
- Publication number 20250140718
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jose Arvin M. PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250133803
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250132666
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...
- Publication number 20250118638
- Publication date Apr 10, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112135
- Publication date Apr 3, 2025
- NEXPERIA B.V.
- Yuet Keung Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Manufacturing Semiconductor Pa...
- Publication number 20250112109
- Publication date Apr 3, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko Bernardoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250105226
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105198
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Heiming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079383
- Publication date Mar 6, 2025
- SANKEN ELECTRIC CO., LTD.
- Takashi Haishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...
- Publication number 20250079386
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS

Connecting between the body and an opposite side of the item with respect to the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module

Semiconductor module with improved inspectability of stacked semico...

Power substrate assembly with reduced warpage

Leadframe spacer for double-sided power module

Semiconductor package having a metal clip and related methods of ma...

Semiconductor device and methods of manufacturing semiconductor dev...

Semiconductor package having wettable lead flanks and tie bars and...

Semiconductor device and method for manufacture of semiconductor de...

Semiconductor devices and methods of manufacturing semiconductor de...

Power storage pack, semiconductor device, and semiconductor device...

Connection arrangements for integrated lateral diffusion field effe...

Package including multiple semiconductor devices

Semiconductor device with sense terminal

Semiconductor device and bonding method

Semiconductor module

Power module and fabrication method of the same, graphite plate, an...

Leadframe package with adjustable clip

Device package having a lateral power transistor with segmented chi...

Semiconductor device

Semiconductor device

Semiconductor module

Semiconductor module

Plurality of dies electrically connected to a printed circuit board...

Semiconductor device having a metallization structure

Double side heat dissipation for silicon chip package

Leadframe spacer for double-sided power module

High density and durable semiconductor device interconnect

Semiconductor device

Semiconductor device

Semiconductor device and method for manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE

Engineered Interconnect Structures for Enhanced Bonding Strength

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE COMPRISING A CARRIER, A SEMICONDUCTOR DIE AND...

ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

SEMI-CONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...

DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...

SEMICONDUCTOR PACKAGE

Semiconductor Package and Method for Manufacturing Semiconductor Pa...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF

CLIP

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...