Connecting bonding areas at different heights

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H01L2224/40105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40105Connecting bonding areas at different heights

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Patents Grantslast 30 patents

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Multi-clip structure for die bonding
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- Issue date Nov 30, 2021
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Integrated circuit chip packaging including a heat sink topped cavity
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- Issue date Sep 19, 2017
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Information Patent Grant
Semiconductor module package and method of manufacturing the same
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- Issue date Dec 20, 2016
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- Kwang Soo Kim
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Information Patent Grant
Switching element with a series-connected junction FET (JFET) and M...
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- Issue date Nov 22, 2016
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Electric power semiconductor device
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Information Patent Grant
Molding material and method for packaging semiconductor chips
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Package-in-packages and methods of formation thereof
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Information Patent Grant
Device including two power semiconductor chips and manufacturing th...
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- Issue date Mar 10, 2015
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable area joints for power semiconductors
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- Issue date Sep 2, 2014
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- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
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Multiple substrate electrical circuit device
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Information Patent Grant
Multiple substrate electrical circuit device
- Patent number 7,825,005
- Issue date Nov 2, 2010
- Raytheon Company
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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Connecting bonding areas at different heights

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Plurality of heat sinks for a semiconductor package

Electronic module

Method for die and clip attachment

Double-sided chip stack assembly

Electronic component

Multi-clip structure for die bonding

Semiconductor device

Integrated circuit chip packaging including a heat sink topped cavity

Electronic device

Integrated circuit chip packaging

Semiconductor module with temperature detecting element

Integrated circuit package with conductive clips

Semiconductor module

Semiconductor component and method of manufacture

Semiconductor component and method of manufacture

Semiconductor component and method of manufacture

Electronic module and method for producing an electronic module

Semiconductor module package and method of manufacturing the same

Switching element with a series-connected junction FET (JFET) and M...

Electric power semiconductor device

Device including two power semiconductor chips and manufacturing th...

Switching element with a series-connected junction FET (JFET) and M...

Molding material and method for packaging semiconductor chips

Package-in-packages and methods of formation thereof

Device including two power semiconductor chips and manufacturing th...

Reliable area joints for power semiconductors

Multiple substrate electrical circuit device

Multiple substrate electrical circuit device

Patents Applicationslast 30 patents

SANDWICH PACKAGE FOR MICROELECTRONICS

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

INTEGRATED SCALING AND STRETCHING PLATFORM FOR SERVER PROCESSOR AND...

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

Multi-Clip Structure for Die Bonding

INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS

Method for Die and Clip Attachment

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

INTEGRATED CIRCUIT CHIP PACKAGING

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Molding Material and Method for Packaging Semiconductor Chips

SEMICONDUCTOR DEVICE

Package-In-Packages and Methods of Formation Thereof

Reliable Area Joints for Power Semiconductors

Device Including Two Power Semiconductor Chips and Manufacturing Th...

Multiple Substrate Electrical Circuit Device