Connecting to a semiconductor or solid-state bodies

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H01L2924/16235

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16235Connecting to a semiconductor or solid-state bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package aligning interposer and substrate
- Patent number 12,051,680
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave filter apparatus
- Patent number 11,831,300
- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Koichiro Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with partitioned logic and ass...
- Patent number 11,562,986
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 11,508,776
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging for semiconductor devices
- Patent number 11,336,257
- Issue date May 17, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Liang Liang Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating method, coating apparatus and method for manufacturing comp...
- Patent number 11,305,311
- Issue date Apr 19, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsumi Itou
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,222,868
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,176,450
- Issue date Nov 16, 2021
- Xcelsis Corporation
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal performance structure for semiconductor packages and method...
- Patent number 11,158,614
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 11,117,796
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,066,297
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensor device
- Patent number 11,069,734
- Issue date Jul 20, 2021
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Ion sensor based on differential measurement, and production method
- Patent number 11,029,278
- Issue date Jun 8, 2021
- Consejo Superior de Investigaciones Cientificas (CSIC)
- Antoni Baldi Coll
- G01 - MEASURING TESTING
Information Patent Grant
Acoustic wave device, radio-frequency front end circuit, and commun...
- Patent number 11,005,444
- Issue date May 11, 2021
- Murata Manufacturing Co., Ltd.
- Ippei Hatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20240376294
- Publication date Nov 14, 2024
- SUMITOMO CHEMICAL CO., LTD.
- Thomas Fletcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321672
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240266377
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243110
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...
- Publication number 20240222335
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Bo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
- Publication number 20240213112
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240186213
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Jin REE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240178256
- Publication date May 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240178206
- Publication date May 30, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CIRCUIT IMPLEMENTING MACHINE TRAINED NETWORK
- Publication number 20240152743
- Publication date May 9, 2024
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120252
- Publication date Apr 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20240118141
- Publication date Apr 11, 2024
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...
- Publication number 20240105544
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Shih Kien LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240079346
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079366
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Connecting to a semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package aligning interposer and substrate

Bonding structure and method thereof

Image sensor device

Wearable device with combined sensing capabilities

Thermal transfer structures for semiconductor die assemblies

Elastic wave filter apparatus

Three dimensional circuit implementing machine trained network

Methods of manufacturing stacked semiconductor die assemblies with...

Methods for establishing thermal joints between heat spreaders or l...

MEMS packages and methods of manufacture thereof

Interconnect structure with redundant electrical connectors and ass...

Stacked semiconductor die assemblies with partitioned logic and ass...

Image sensor semiconductor packages and related methods

Method for mounting an electrical component in which a hood is used...

Wafer level packaging for semiconductor devices

Coating method, coating apparatus and method for manufacturing comp...

System and method to enhance reliability in connection with arrange...

Method for fabricating an electronic device comprising forming an i...

Interconnect structure with redundant electrical connectors and ass...

Thermal transfer structures for semiconductor die assemblies

Three dimensional circuit implementing machine trained network

Thermal performance structure for semiconductor packages and method...

MEMS devices including MEMS dies and connectors thereto

System and method to enhance solder joint reliability

MEMS packages and methods of manufacture thereof

Image sensor device

Shielded package assemblies with integrated capacitor

Ion sensor based on differential measurement, and production method

Acoustic wave device, radio-frequency front end circuit, and commun...

Solid-state image pickup device and electronic apparatus to increas...

Patents Applicationslast 30 patents

EMBEDDED SEMICONDUCTOR DEVICE

Semiconductor Device Package with Thermal Module

ELECTRONIC DEVICE WITH A REINFORCING LAYER

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

THERMALLY CONDUCTIVE COMPOSITION

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

CHIP PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURE AND METHOD THEREOF

IMAGE SENSOR DEVICE

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

SEMICONDUCTOR PACKAGE

ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...

EMBEDDED LIQUID COOLING

SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

IMAGE SENSOR DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

THREE DIMENSIONAL CIRCUIT IMPLEMENTING MACHINE TRAINED NETWORK

Integrated Circuit Packages and Methods of Forming the Same

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...