Connecting within a semiconductor or solid-state body

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H01L2224/4813

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4813Connecting within a semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,327,808
- Issue date Jun 10, 2025
- Hitachi Power Semiconductor Device, Ltd.
- Naoki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for a multi-phase motor driving circuit
- Patent number 12,327,993
- Issue date Jun 10, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Chung-Kuang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic power module using polymer p...
- Patent number 12,322,604
- Issue date Jun 3, 2025
- SAFRAN
- Baptiste Joël Christian Fedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package device and method of operating the same
- Patent number 12,293,987
- Issue date May 6, 2025
- Realtek Semiconductor Corporation
- Chih-Chiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting device for frequency-modulated emission
- Patent number 12,270,905
- Issue date Apr 8, 2025
- Lumileds, LLC
- Emanuel Nicolaas Hermanus Johannes Stassar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage-controlled switching device with resistive path
- Patent number 12,266,680
- Issue date Apr 1, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Christian Philipp Sandow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module containing exposed surfaces of transistor...
- Patent number 12,249,562
- Issue date Mar 11, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection for multi-die integrated circuits (ICs) including in...
- Patent number 12,244,137
- Issue date Mar 4, 2025
- Infineon Technologies AG
- Christian Cornelius Russ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical receiving circuit
- Patent number 12,243,862
- Issue date Mar 4, 2025
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,304
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-typed integrated passive device (IPD) components and devices...
- Patent number 12,230,614
- Issue date Feb 18, 2025
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride based depletion mode differential amplifiers and...
- Patent number 12,212,289
- Issue date Jan 28, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component package
- Patent number 12,205,873
- Issue date Jan 21, 2025
- TDK Corporation
- Yosuke Komasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage solid-state transducers and solid-state transducer arr...
- Patent number 12,205,928
- Issue date Jan 21, 2025
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 12,199,088
- Issue date Jan 14, 2025
- ANCORA SEMICONDUCTORS INC.
- Jen-Chih Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode with high efficiency
- Patent number 12,199,214
- Issue date Jan 14, 2025
- SEOUL VIOSYS CO., LTD.
- Keum Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRIVING DEVICE
- Publication number 20250192009
- Publication date Jun 12, 2025
- ACTRON TECHNOLOGY CORPORATION
- PEN-HUNG HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192007
- Publication date Jun 12, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20250167007
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167175
- Publication date May 22, 2025
- Minkyeong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20250157911
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Kazuki NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE WITH HIGH EFFICIENCY
- Publication number 20250151465
- Publication date May 8, 2025
- Seoul Viosys Co., Ltd.
- Keum Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...
- Publication number 20250149506
- Publication date May 8, 2025
- Kirill Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...
- Publication number 20250149395
- Publication date May 8, 2025
- Utkarsh Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-SIDED DIRECT COOLED POWER MODULE
- Publication number 20250149417
- Publication date May 8, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140734
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Lee Siang Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
- Publication number 20250140737
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140658
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Masanori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250133803
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...
- Publication number 20250132291
- Publication date Apr 24, 2025
- STATS ChipPAC Pte Ltd.
- DanFeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250125207
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125693
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Shigemi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE
- Publication number 20250118708
- Publication date Apr 10, 2025
- RICHWAVE TECHNOLOGY CORP.
- Kuang-Lieh Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE ARRANGEMENT
- Publication number 20250118634
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Chang Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND MULTICHIP PACKAGE
- Publication number 20250112197
- Publication date Apr 3, 2025
- MEDIATEK INC.
- Yu-Liang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE
- Publication number 20250112126
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250105804
- Publication date Mar 27, 2025
- RICHWAVE TECHNOLOGY CORP.
- Po-Yen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
- Publication number 20250096183
- Publication date Mar 20, 2025
- Renesas Electronics America Inc.
- Martin Ashley VAGUES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250098289
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Yusuke KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087575
- Publication date Mar 13, 2025
- Fuji Electric Co., Ltd.
- Mariko Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087636
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Inhee YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079291
- Publication date Mar 6, 2025
- Mitsubishi Electric Corporation
- Shinji SAKAI
- H01 - BASIC ELECTRIC ELEMENTS

Connecting within a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package for a multi-phase motor driving circuit

Method for manufacturing an electronic power module using polymer p...

Package for power semiconductor devices

Edge bend for isolation packages

Electronic package device and method of operating the same

Lighting device for frequency-modulated emission

Voltage-controlled switching device with resistive path

Semiconductor device and method for manufacturing the same

Semiconductor manufacturing apparatus and method of manufacturing s...

Electronic devices in semiconductor package cavities

Intelligent power module containing exposed surfaces of transistor...

ESD protection for multi-die integrated circuits (ICs) including in...

Optical receiving circuit

Semiconductor package

Multi-typed integrated passive device (IPD) components and devices...

Semiconductor module and power conversion apparatus

ESD protection device

Semiconductor device with improved performance in operation and imp...

Semiconductor device and method of manufacturing the same

Group III nitride based depletion mode differential amplifiers and...

Transient liquid phase bonding compositions and power electronics a...

Electronic component package

Electronic device with top side pin array and manufacturing method...

High voltage solid-state transducers and solid-state transducer arr...

Package structures

Light emitting diode with high efficiency

Semiconductor module

Semiconductor package using a polymer substrate

Semiconductor device including surface pressure absorbing member fo...

Patents Applicationslast 30 patents

DRIVING DEVICE

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

LIGHT EMITTING DIODE WITH HIGH EFFICIENCY

POWER MODULE AND POWER CONVERSION APPARATUS

POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...

POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...

SINGLE-SIDED DIRECT COOLED POWER MODULE

MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE

INTELLIGENT POWER MODULE ARRANGEMENT

WIREBOND MULTICHIP PACKAGE

WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE

AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE