Connecting within a semiconductor or solid-state body

Industry

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H01L2224/4813

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4813Connecting within a semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,148,737
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuto Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state lighting devices with accessible electrodes and methods...
- Patent number 12,142,708
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,589
- Issue date Nov 5, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 12,119,437
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Soonwon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,113,104
- Issue date Oct 8, 2024
- Sumitomo Electric Industries, Ltd.
- Koshi Hamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with graphite plate
- Patent number 12,107,029
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,631
- Issue date Sep 24, 2024
- Fuji Electric Co., Ltd.
- Taichi Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,808
- Issue date Sep 17, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,862
- Issue date Sep 17, 2024
- Kabushiki Kaisha Toshiba
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,739
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Toshiya Tadakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power converter, and method of manufacturing...
- Patent number 12,074,132
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi level radio frequency (RF) integrated circuit components incl...
- Patent number 12,074,123
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having integrated antenna and locking st...
- Patent number 12,062,833
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,051,636
- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with heat spreader
- Patent number 12,009,280
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,009,310
- Issue date Jun 11, 2024
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,002,785
- Issue date Jun 4, 2024
- Rohm Co., Ltd.
- Tomohira Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device
- Patent number 11,996,299
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modularized power amplifier devices and architectures
- Patent number 11,967,937
- Issue date Apr 23, 2024
- Viasat, Inc.
- Shih Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE
- Publication number 20240387334
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240387352
- Publication date Nov 21, 2024
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...
- Publication number 20240379510
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS
- Publication number 20240379573
- Publication date Nov 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- MICHAEL ENDRES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENTS
- Publication number 20240363497
- Publication date Oct 31, 2024
- INFINEON TECHNOLOGIES AG
- Andressa COLVERO SCHITTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20240355753
- Publication date Oct 24, 2024
- PIERBURG GMBH
- MIKA NUOTIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...
- Publication number 20240355717
- Publication date Oct 24, 2024
- Navitas Semiconductor Limited
- Alfred Hesener
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240355724
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Tatsuya KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE
- Publication number 20240356501
- Publication date Oct 24, 2024
- ViaSat, Inc.
- Shih Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347403
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Takeshi HIGASHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH HEAT SPREADER
- Publication number 20240332119
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING
- Publication number 20240332252
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240332137
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240332138
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332242
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Toma TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CHIP AND SIGNAL PROPAGATING DEVICE
- Publication number 20240332345
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY
- Publication number 20240332141
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240321850
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yusuke IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312877
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240304567
- Publication date Sep 12, 2024
- Mitsubishi Electric Corporation
- Aya MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304510
- Publication date Sep 12, 2024
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240304588
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Akio YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER APPARATUS
- Publication number 20240304530
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240304525
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Tatsuya KARASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, ELECTRIC MOTOR CONTROLLER AND VEHICLE
- Publication number 20240297113
- Publication date Sep 5, 2024
- BYD SEMICONDUCTOR COMPANY LIMITED
- Yuqi ZHOU
- H01 - BASIC ELECTRIC ELEMENTS

Connecting within a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Solid state lighting devices with accessible electrodes and methods...

Semiconductor device

Light emitting device package

Semiconductor device

Power module with graphite plate

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device, power converter, and method of manufacturing...

Device packages with uniform components and methods of forming the...

Multi level radio frequency (RF) integrated circuit components incl...

Semiconductor device including source pad region and drain pad regi...

Packaged electronic device having integrated antenna and locking st...

Multichip packaged semiconductor device

Power module

Semiconductor device and inspection device

Chip package, method of forming a chip package and method of formin...

Impedance controlled electrical interconnection employing meta-mate...

IC package with heat spreader

Semiconductor device

Semiconductor device

Methods for manufacturing a semiconductor device

Packaged die and RDL with bonding structures therebetween

Semiconductor device

Stud bump for wirebonding high voltage isolation barrier connection

Modularized power amplifier devices and architectures

Integrated high voltage capacitor

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...

SEMICONDUCTOR ASSEMBLY COMPRISING AT LEAST TWO SEMICONDUCTOR ELEMENTS

POWER MODULE WITH BALANCED CURRENT FLOW

SEMICONDUCTOR MODULE ARRANGEMENTS

POWER SEMICONDUCTOR PACKAGE

INTEGRATED BIDIRECTIONAL FOUR QUADRANT SWITCHES WITH DRIVERS AND IN...

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE

SEMICONDUCTOR DEVICE

IC PACKAGE WITH HEAT SPREADER

POWER MODULE WITH OVERLAPPING TERMINALS

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

ELECTRONIC DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

INSULATING CHIP AND SIGNAL PROPAGATING DEVICE

SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY

ISOLATOR

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

POWER CONVERTER APPARATUS

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR POWER MODULE, ELECTRIC MOTOR CONTROLLER AND VEHICLE