Connecting within a semiconductor or solid-state body

Industry

CPC
H01L2224/4013

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4013Connecting within a semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with electrodes and heat sink and manufacturing method...
- Patent number 12,014,974
- Issue date Jun 18, 2024
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plate-shaped conductor
- Patent number 12,002,782
- Issue date Jun 4, 2024
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module with busbar having a leg with a foot for...
- Patent number 11,894,302
- Issue date Feb 6, 2024
- Danfoss Silicon Power GmbH
- Michael Tønnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module using same
- Patent number 11,694,948
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Masashi Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a lead frame including die paddles and...
- Patent number 11,688,671
- Issue date Jun 27, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL, LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,652,072
- Issue date May 16, 2023
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising substrate, semiconductor chip...
- Patent number 11,631,628
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a resin case and a wiring member th...
- Patent number 11,562,977
- Issue date Jan 24, 2023
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,545,421
- Issue date Jan 3, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,532,590
- Issue date Dec 20, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of heat sinks for a semiconductor package
- Patent number 11,515,237
- Issue date Nov 29, 2022
- Agency for Science, Technology and Research
- Gongyue Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,502,027
- Issue date Nov 15, 2022
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recess portion in the surface of an interconnection layer mounted t...
- Patent number 11,476,225
- Issue date Oct 18, 2022
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode power electronic device packaging method and packaging stru...
- Patent number 11,476,242
- Issue date Oct 18, 2022
- ULTRABAND TECHNOLOGIES INC.
- Tai-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor chip connected with...
- Patent number 11,456,238
- Issue date Sep 27, 2022
- Denso Corporation
- Kosuke Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 11,432,419
- Issue date Aug 30, 2022
- Hitachi Astemo, Ltd.
- Tokihito Suwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,410,959
- Issue date Aug 9, 2022
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,398,448
- Issue date Jul 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,398,450
- Issue date Jul 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement
- Patent number 11,362,080
- Issue date Jun 14, 2022
- Infineon Technologies AG
- Christian Robert Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 11,355,424
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429154
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT
- Publication number 20240387513
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240387442
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Kensuke TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MOLDING CAVITY
- Publication number 20240371659
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321693
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Tomohiro YASUNISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290759
- Publication date Aug 29, 2024
- Power Master Semiconductor Co., Ltd.
- Taekkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240244750
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234361
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Immersion-Cooled Power Module
- Publication number 20240222225
- Publication date Jul 4, 2024
- Hyundai Motor Company
- Suk Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LOW-WARPAGE CARRIER
- Publication number 20240222234
- Publication date Jul 4, 2024
- INFINEON TECHNOLOGIES AG
- Abdul Rahman MOHAMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213208
- Publication date Jun 27, 2024
- Power Master Semiconductor Co., Ltd.
- Taekkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240178194
- Publication date May 30, 2024
- DENSO CORPORATION
- Shingo IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170454
- Publication date May 23, 2024
- Fuji Electric Co., Ltd.
- Taisuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240170441
- Publication date May 23, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Providing an Even Current Distribution and St...
- Publication number 20240170377
- Publication date May 23, 2024
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240162205
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Marcus BÖHM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145349
- Publication date May 2, 2024
- DENSO CORPORATION
- TAKAHIRO HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136320
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240120309
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Oliver Kreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240112991
- Publication date Apr 4, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE
- Publication number 20240106342
- Publication date Mar 28, 2024
- ZF Friedrichshafen AG
- Zhiwu Hu
- H01 - BASIC ELECTRIC ELEMENTS

Connecting within a semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package including multiple semiconductor devices

Semiconductor module

Power module with electrodes and heat sink and manufacturing method...

Semiconductor device with plate-shaped conductor

Semiconductor packages using package in package systems and related...

Semiconductor package with low parasitic connection to passive device

Semiconductor module

Semiconductor module

Semiconductor power module with busbar having a leg with a foot for...

Semiconductor package and related methods

Semiconductor device

Power semiconductor module with laser-welded leadframe

Semiconductor device and semiconductor module using same

Semiconductor package having a lead frame including die paddles and...

Semiconductor device and method of manufacturing the same

Semiconductor chip package comprising substrate, semiconductor chip...

Semiconductor device comprising a resin case and a wiring member th...

Package including multiple semiconductor devices

Semiconductor device and method for manufacturing semiconductor device

Plurality of heat sinks for a semiconductor package

Package including multiple semiconductor devices

Recess portion in the surface of an interconnection layer mounted t...

Cascode power electronic device packaging method and packaging stru...

Semiconductor device including a semiconductor chip connected with...

Power semiconductor device and power conversion device

Semiconductor module

Semiconductor module

Semiconductor module

Semiconductor arrangement

Multi-chip package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

PACKAGE WITH MOLDING CAVITY

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

POWER MODULE WITH OVERLAPPING TERMINALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR DEVICE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

Liquid Immersion-Cooled Power Module

PACKAGE WITH LOW-WARPAGE CARRIER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

Semiconductor Package Providing an Even Current Distribution and St...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE