Connection portion

Industry

CPC
H01L2924/153

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/153Connection portion

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Solder pads with concave edges for ball grid arrays
- Patent number 12,328,826
- Issue date Jun 10, 2025
- MOTOROLA SOLUTIONS, INC.
- Edwin L Bradley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with heat dissipation structure and warpage control
- Patent number 12,322,673
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly lid and methods for forming the same
- Patent number 12,322,666
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (WBGA) package and method for manufacturing...
- Patent number 12,315,789
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a substrate-to-substrate interconnection s...
- Patent number 12,315,845
- Issue date May 27, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including lid with additional stress mitigating fe...
- Patent number 12,315,768
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating and accessing passive components in wafer-level packages
- Patent number 12,308,335
- Issue date May 20, 2025
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including ball grid arrays and associated systems
- Patent number 12,300,597
- Issue date May 13, 2025
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pitch ball grid array
- Patent number 12,288,741
- Issue date Apr 29, 2025
- Juniper Networks, Inc.
- Granthana Kattehalli Rangaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Failover methods and systems in three-dimensional memory device
- Patent number 12,287,712
- Issue date Apr 29, 2025
- RAMBUS INC.
- Joohee Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with hollow interconnectors
- Patent number 12,272,672
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING WIRE-BOND PADS AND FLIP-CHIP BUM...
- Publication number 20250183137
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAME ENGINE ON A CHIP
- Publication number 20250182372
- Publication date Jun 5, 2025
- TMRW FOUNDATION IP S.ÀR.L.
- Cevat YERLI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED VERTICAL POWER MODULE
- Publication number 20250183144
- Publication date Jun 5, 2025
- Analog Devices, Inc.
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20250174561
- Publication date May 29, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED VOLTAGE REGULATOR
- Publication number 20250174597
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
- Publication number 20250174531
- Publication date May 29, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PANEL LEVEL FABRICATION OF STACKED ELECTRONIC DEVICE PACKAGES WITH...
- Publication number 20250167083
- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20250167007
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167178
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...
- Publication number 20250159987
- Publication date May 15, 2025
- Hangzhou Geo-chip Technology Co., Ltd.
- Ruili WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
- Publication number 20250157520
- Publication date May 15, 2025
- Apple Inc.
- Sukalpa Biswas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157874
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20250157956
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS
- Publication number 20250157909
- Publication date May 15, 2025
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...
- Publication number 20250158007
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
- Publication number 20250157521
- Publication date May 15, 2025
- Apple Inc.
- Sukalpa Biswas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20250150113
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149426
- Publication date May 8, 2025
- Unimicron Technology Corp.
- An-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20250151392
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149486
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Connection portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder pads with concave edges for ball grid arrays

Semiconductor device and manufacturing method thereof

Chip package and manufacturing method thereof

Device and method for UBM/RDL routing

Semiconductor device

3DIC with heat dissipation structure and warpage control

Semiconductor device and method of forming microelectromechanical s...

Antenna in package having antenna on package substrate

Package assembly lid and methods for forming the same

Methods and apparatus for package with interposers

Semiconductor structure and manufacturing method thereof

Semiconductor device package

Window ball grid array (WBGA) package and method for manufacturing...

Electronic device having a substrate-to-substrate interconnection s...

Package assembly including lid with additional stress mitigating fe...

Integrating and accessing passive components in wafer-level packages

Apparatuses including ball grid arrays and associated systems

Chip package with lid

Fully molded structure with multi-height components comprising back...

Integrated circuit package and method of forming same

Method for forming chip packages and a chip package

Semiconductor packages and methods of forming same

Multi-pitch ball grid array

Failover methods and systems in three-dimensional memory device

Semiconductor device and manufacturing method thereof

High density interconnection using fanout interposer chiplet

Methods and heat distribution devices for thermal management of chi...

Semiconductor device package and method for manufacturing the same

Semiconductor device with hollow interconnectors

3D semiconductor memory device and structure with memory and metal...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURES INCLUDING WIRE-BOND PADS AND FLIP-CHIP BUM...

Fan-Out Package Having a Main Die and a Dummy Die

GAME ENGINE ON A CHIP

STACKED VERTICAL POWER MODULE

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

EMBEDDED INTEGRATED VOLTAGE REGULATOR

ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME

Stacked Semiconductor Device Assembly in Computer System

PANEL LEVEL FABRICATION OF STACKED ELECTRONIC DEVICE PACKAGES WITH...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

SEMICONDUCTOR PACKAGE

Structure and Method for Fabricating a Computing System with an Int...

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...

Memory System Having Combined High Density, Low Bandwidth and Low D...

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF PACKAGE DEVICE

INTEGRATED CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS

METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...

Memory System Having Combined High Density, Low Bandwidth and Low D...

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME