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H01L2924/153

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/153Connection portion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including a package lid having an inner foot and m...
- Patent number 12,362,245
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die dipping structure
- Patent number 12,362,317
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chun Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clock-gating in die-to-die (D2D) interconnects
- Patent number 12,362,306
- Issue date Jul 15, 2025
- Intel Corporation
- Narasimha Lanka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
- Patent number 12,362,322
- Issue date Jul 15, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using EMC wafer support system and fabricating...
- Patent number 12,362,343
- Issue date Jul 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming packages of stacked chips
- Patent number 12,362,327
- Issue date Jul 15, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded native interconnects and active base die
- Patent number 12,362,182
- Issue date Jul 15, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D package configuration
- Patent number 12,354,942
- Issue date Jul 8, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer circuit
- Patent number 12,352,814
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic fill material for stacked die assembly
- Patent number 12,347,807
- Issue date Jul 1, 2025
- Intel Corporation
- Mohammad Enamul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (WBGA) package and method for manufacturing...
- Patent number 12,341,090
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 12,341,096
- Issue date Jun 24, 2025
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,122
- Issue date Jun 24, 2025
- Kabushiki Kaisha Toshiba
- Yoko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder pads with concave edges for ball grid arrays
- Patent number 12,328,826
- Issue date Jun 10, 2025
- MOTOROLA SOLUTIONS, INC.
- Edwin L Bradley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with heat dissipation structure and warpage control
- Patent number 12,322,673
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20250233082
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20250224556
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
- Publication number 20250226298
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Chip-on-Wafer Underfill...
- Publication number 20250219006
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- Marites Roque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...
- Publication number 20250218905
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250218890
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMIN...
- Publication number 20250218912
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES
- Publication number 20250218898
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH
- Publication number 20250210496
- Publication date Jun 26, 2025
- Christopher Schaef
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210555
- Publication date Jun 26, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE
- Publication number 20250210497
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Stephen Dussinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPACKAGING STRUCTURE
- Publication number 20250210498
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Shih-Hsien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210542
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Wooyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE INCLUDING STACKED SUBSTRATES DISPOSED IN A SHELL
- Publication number 20250201687
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL LINES FOR SEMICONDUCTOR DEVICES
- Publication number 20250201693
- Publication date Jun 19, 2025
- Altera Corporation
- Arturo PACHON MUNOZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20250201729
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...
- Publication number 20250201766
- Publication date Jun 19, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...
- Publication number 20250201767
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201650
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201726
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
- Publication number 20250192010
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS

Connection portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package comprising semiconductor chip with stepped po...

Methods of packaging semiconductor devices and packaged semiconduct...

Package assembly including a package lid having an inner foot and m...

Package structure

Semiconductor die dipping structure

Clock-gating in die-to-die (D2D) interconnects

Method of making a fan-out semiconductor assembly with an intermedi...

Semiconductor device using EMC wafer support system and fabricating...

Method for fabricating a chip package

3D semiconductor memory device and structure

Method of forming packages of stacked chips

Direct-bonded native interconnects and active base die

3D package configuration

Interposer circuit

Semiconductor components having conductive vias with aligned back s...

Semiconductor packages

Inorganic fill material for stacked die assembly

Window ball grid array (WBGA) package and method for manufacturing...

Bare-die smart bridge connected with copper pillars for system-in-p...

Semiconductor device

Package with tilted interface between device die and encapsulating...

Semiconductor device with discrete blocks

Lthc as charging barrier in info package formation

Solder pads with concave edges for ball grid arrays

Semiconductor device and manufacturing method thereof

Chip package and manufacturing method thereof

Device and method for UBM/RDL routing

Semiconductor device

3DIC with heat dissipation structure and warpage control

Antenna in package having antenna on package substrate

Patents Applicationslast 30 patents

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...

Semiconductor Device and Method of Making a Chip-on-Wafer Underfill...

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...

INTEGRATED CIRCUIT PACKAGES AND METHODS

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

Semiconductor Packages And Methods Of Forming The Same

POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMIN...

RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MONITORING OF ELECTRONIC PACKAGES

SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE

REPACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SUBSTRATE STRUCTURE INCLUDING STACKED SUBSTRATES DISPOSED IN A SHELL

SIGNAL LINES FOR SEMICONDUCTOR DEVICES

Selective EMI Shielding Using Preformed Mask with Fang Design

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER