Connectors having different shapes

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H01L2224/49051

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49051Connectors having different shapes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising wire bonds configured as a heat spreader
- Patent number 11,545,411
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 10,930,524
- Issue date Feb 23, 2021
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,847,489
- Issue date Nov 24, 2020
- Mitsubishi Electric Corporation
- Hiroyuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second chips and connections th...
- Patent number 10,204,899
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masaki Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,199,347
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,905,497
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Takeshi Susaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flipped die stacks with multiple rows of leadframe interconnects
- Patent number 9,859,257
- Issue date Jan 2, 2018
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low on resistance
- Patent number 9,824,996
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,793,265
- Issue date Oct 17, 2017
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Module and method for manufacturing the module
- Patent number 9,613,938
- Issue date Apr 4, 2017
- Mitsumi Electric Co., Ltd.
- Soichiro Suzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including interconnection members
- Patent number 9,478,515
- Issue date Oct 25, 2016
- SK hynix Inc.
- Jung Tae Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,461,163
- Issue date Oct 4, 2016
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device including a DC-DC converter
- Patent number 9,412,701
- Issue date Aug 9, 2016
- Renesas Electronics Corporation
- Yukihiro Satou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid semiconductor package
- Patent number 9,373,577
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Alexander Komposch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package system with cavity substrate and manufacturin...
- Patent number 9,293,350
- Issue date Mar 22, 2016
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,287,249
- Issue date Mar 15, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Kinoshita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming an IPD beneath a semicon...
- Patent number 9,257,356
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,171,761
- Issue date Oct 27, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,165,901
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for preventing a progression of a crack in a s...
- Patent number 9,153,519
- Issue date Oct 6, 2015
- Fuji Electric Co., Ltd.
- Fumio Nagaune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including DC-DC converter
- Patent number 9,153,686
- Issue date Oct 6, 2015
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,136,174
- Issue date Sep 15, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,129,946
- Issue date Sep 8, 2015
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312950
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Takaya HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411354
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Chihong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...
- Publication number 20220392866
- Publication date Dec 8, 2022
- SK HYNIX INC.
- Jeong Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
- Publication number 20220037224
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20210280552
- Publication date Sep 9, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200144216
- Publication date May 7, 2020
- Mitsubishi Electric Corporation
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20170373055
- Publication date Dec 28, 2017
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170213806
- Publication date Jul 27, 2017
- Fuji Electric Co., Ltd.
- Tomohiro NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...
- Publication number 20170133344
- Publication date May 11, 2017
- Kabushiki Kaisha Toshiba
- Satoru TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS
- Publication number 20160307867
- Publication date Oct 20, 2016
- SK HYNIX INC.
- Jung Tae JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20150270240
- Publication date Sep 24, 2015
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150062437
- Publication date Mar 5, 2015
- PANASONIC CORPORATION
- Tomohiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140363926
- Publication date Dec 11, 2014
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Semiconductor Package
- Publication number 20140346637
- Publication date Nov 27, 2014
- Alexander Komposch
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20140332878
- Publication date Nov 13, 2014
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140332866
- Publication date Nov 13, 2014
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20140312510
- Publication date Oct 23, 2014
- Yukihiro Satou
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273353
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140179063
- Publication date Jun 26, 2014
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20140054692
- Publication date Feb 27, 2014
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140042609
- Publication date Feb 13, 2014
- FUJI ELECTRIC CO., LTD.
- Fumio Nagaune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20140003002
- Publication date Jan 2, 2014
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130203217
- Publication date Aug 8, 2013
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130171776
- Publication date Jul 4, 2013
- RENESAS ELECTRONICS CORPORATION
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130071971
- Publication date Mar 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130020715
- Publication date Jan 24, 2013
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
- Publication number 20130017652
- Publication date Jan 17, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS

Connectors having different shapes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip package including lead frame and manufacturing m...

Semiconductor die stack having bent wires and vertical wires and a...

Semiconductor package structure with heat sink and method preparing...

Package comprising wire bonds configured as a heat spreader

Semiconductor package structure with heat sink and method preparing...

Semiconductor component and method of manufacture

Semiconductor device

Embedded wire bond wires

Semiconductor device with first and second chips and connections th...

Semiconductor device

Resin sealing type semiconductor device and method of manufacturing...

Flipped die stacks with multiple rows of leadframe interconnects

Semiconductor device having low on resistance

Semiconductor device including Schottky barrier diode and power MOS...

Module and method for manufacturing the module

Semiconductor packages including interconnection members

Semiconductor device including Schottky barrier diode and power MOS...

Semiconductor device including a DC-DC converter

Module comprising a semiconductor chip

Hybrid semiconductor package

Semiconductor package system with cavity substrate and manufacturin...

Semiconductor device

Semiconductor device and method of forming an IPD beneath a semicon...

Resin sealing type semiconductor device and method of manufacturing...

Semiconductor device

Semiconductor device for preventing a progression of a crack in a s...

Semiconductor device including DC-DC converter

Resin sealing type semiconductor device and method of manufacturing...

Semiconductor device

Mixed wire semiconductor lead frame package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...

PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER

SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGES INCLUDING INTERCONNECTION MEMBERS

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Hybrid Semiconductor Package

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE

Semiconductor Device

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

Module Comprising a Semiconductor Chip

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device

Semiconductor Device

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK