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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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Patents Grantslast 30 patents

Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 12,068,280
- Issue date Aug 20, 2024
- Kabushiki Kaisha Toshiba
- Hideaki Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct to chip application of boiling enhancement coating
- Patent number 12,051,637
- Issue date Jul 30, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed FET back-bias network
- Patent number 12,051,701
- Issue date Jul 30, 2024
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with sintered switch
- Patent number 12,027,975
- Issue date Jul 2, 2024
- Marel Power Solutions
- Jean-Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and package structure having multi-dies the...
- Patent number 12,020,998
- Issue date Jun 25, 2024
- Mediatek Inc.
- Chuan-Shian Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounts for tracking devices
- Patent number 12,014,236
- Issue date Jun 18, 2024
- Elevation Lab, Inc.
- Casey Hopkins
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,984,386
- Issue date May 14, 2024
- Fuji Electric Co., Ltd.
- Hisato Inokuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooled inverter
- Patent number 11,967,899
- Issue date Apr 23, 2024
- Marel Power Solutions
- Jean-Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, multiplexer, and module
- Patent number 11,942,438
- Issue date Mar 26, 2024
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having stress isolation and method the...
- Patent number 11,823,968
- Issue date Nov 21, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and module including the same
- Patent number 11,791,797
- Issue date Oct 17, 2023
- Murata Manufacturing Co., Ltd.
- Koichiro Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,764,131
- Issue date Sep 19, 2023
- ABLIC Inc.
- Koji Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,688,661
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Suin Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having semiconductor chip formed on wiring par...
- Patent number 11,637,049
- Issue date Apr 25, 2023
- Fuji Electric Co., Ltd.
- Tomoyuki Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including image sensor chip, transparent subs...
- Patent number 11,581,348
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill injection for electronic devices
- Patent number 11,574,848
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked terminals
- Patent number 11,570,921
- Issue date Jan 31, 2023
- Tesla, Inc.
- Wenjun Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics submodule for mounting on a cooling device
- Patent number 11,533,822
- Issue date Dec 20, 2022
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method of a semiconductor device and manufacturing method of a...
- Patent number 11,499,886
- Issue date Nov 15, 2022
- Mitsubishi Electric Corporation
- Hajime Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blade assembly and fan display having the same
- Patent number 11,448,392
- Issue date Sep 20, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Qiang Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moderated deformation of a vapor chamber to match a shape of a heat...
- Patent number 11,437,297
- Issue date Sep 6, 2022
- Intel Corporation
- Guoliang Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component housing package, electronic apparatus, and ele...
- Patent number 11,394,362
- Issue date Jul 19, 2022
- Kyocera Corporation
- Takuo Kisaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed FET back-bias network
- Patent number 11,374,022
- Issue date Jun 28, 2022
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,348,894
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal resonator device
- Patent number 11,342,899
- Issue date May 24, 2022
- Daishinku Corporation
- Takuya Kojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carrier substrate for stress sensitive device and method of manufac...
- Patent number 11,234,082
- Issue date Jan 25, 2022
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING A POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240420968
- Publication date Dec 19, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Schmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME
- Publication number 20240413057
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT POWER CONVERTER WITH TRANSISTORS THERMALLY AND ELECTRICALLY...
- Publication number 20240348164
- Publication date Oct 17, 2024
- Marel Power Solutions, Inc.
- Jean-Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240290695
- Publication date Aug 29, 2024
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTS FOR TRACKING DEVICES
- Publication number 20240242056
- Publication date Jul 18, 2024
- Elevation Lab, Inc.
- Casey HOPKINS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240186221
- Publication date Jun 6, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING SYSTEM ON CHIP AND THE MANUFACTURING METHOD THEREOF
- Publication number 20240162098
- Publication date May 16, 2024
- National Tsing Hua University
- Tung-Lin Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20230308077
- Publication date Sep 28, 2023
- Murata Manufacturing Co., Ltd.
- Koichiro KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230282645
- Publication date Sep 7, 2023
- Vanguard International Semiconductor Corporation
- Walter Wohlmuth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING IMAGE SENSOR CHIP
- Publication number 20230197747
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- WOONBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20230178442
- Publication date Jun 8, 2023
- HUAWEI TECHNOLOGIES CO., LTD.
- Zhimin DOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED TERMINALS
- Publication number 20230171909
- Publication date Jun 1, 2023
- Tesla, Inc.
- Wenjun Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230120152
- Publication date Apr 20, 2023
- Fuji Electric Co., Ltd.
- Yuma MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230067313
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package and Manufacturing Method of the Same
- Publication number 20220384285
- Publication date Dec 1, 2022
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Distributed FET Back-Bias Network
- Publication number 20220367522
- Publication date Nov 17, 2022
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
- Publication number 20220246597
- Publication date Aug 4, 2022
- Showa Denko Materials Co., Ltd.
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL INJECTION FOR ELECTRONIC DEVICES
- Publication number 20220238403
- Publication date Jul 28, 2022
- International Business Machines Corporation
- AKIHIRO HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220238418
- Publication date Jul 28, 2022
- ABLIC Inc.
- Koji TSUKAGOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DI...
- Publication number 20220192042
- Publication date Jun 16, 2022
- Intel Corporation
- Mohammad Enamul Kabir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093562
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Hideaki KITAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077010
- Publication date Mar 10, 2022
- Kabushiki Kaisha Toshiba
- Takumi TAJIKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220068748
- Publication date Mar 3, 2022
- Fuji Electric Co., Ltd.
- Tomoyuki WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THE...
- Publication number 20220068738
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED POWER MODULE
- Publication number 20210367526
- Publication date Nov 25, 2021
- Marel Power Solutions, Inc.
- Jean-Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210358835
- Publication date Nov 18, 2021
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND PACKAGE STRUCTURE HAVING MULTI-DIES THE...
- Publication number 20210320040
- Publication date Oct 14, 2021
- MEDIATEK INC.
- Chuan-Shian FU
- H01 - BASIC ELECTRIC ELEMENTS

Containers Seals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and devices for fabricating and assembling printable semico...

Semiconductor device

Direct to chip application of boiling enhancement coating

Distributed FET back-bias network

Packaged module with sintered switch

Semiconductor structure and package structure having multi-dies the...

Mounts for tracking devices

Semiconductor device

Fluid cooled inverter

Electronic component, multiplexer, and module

Semiconductor device package having stress isolation and method the...

Electronic device and module including the same

Semiconductor device and manufacturing method thereof

Eutectic bonding with AlGe

Semiconductor device and method of manufacturing the same

Semiconductor device having semiconductor chip formed on wiring par...

Semiconductor package including image sensor chip, transparent subs...

Underfill injection for electronic devices

Semiconductor device with stacked terminals

Power electronics submodule for mounting on a cooling device

Test method of a semiconductor device and manufacturing method of a...

Blade assembly and fan display having the same

Moderated deformation of a vapor chamber to match a shape of a heat...

Seal for microelectronic assembly

Electronic component housing package, electronic apparatus, and ele...

Distributed FET back-bias network

High-frequency module

Crystal resonator device

Seal for microelectronic assembly

Carrier substrate for stress sensitive device and method of manufac...

Patents Applicationslast 30 patents

METHODS FOR FORMING A POWER SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME

COMPACT POWER CONVERTER WITH TRANSISTORS THERMALLY AND ELECTRICALLY...

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

MOUNTS FOR TRACKING DEVICES

SEMICONDUCTOR DEVICE

SENSING SYSTEM ON CHIP AND THE MANUFACTURING METHOD THEREOF

SEAL FOR MICROELECTRONIC ASSEMBLY

ELECTRONIC DEVICE AND MODULE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING IMAGE SENSOR CHIP

PACKAGE STRUCTURE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE WITH STACKED TERMINALS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEAL FOR MICROELECTRONIC ASSEMBLY

Package and Manufacturing Method of the Same

Distributed FET Back-Bias Network

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...

UNDERFILL INJECTION FOR ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THE...

PACKAGED POWER MODULE

SEMICONDUCTOR DEVICE

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

SEMICONDUCTOR STRUCTURE AND PACKAGE STRUCTURE HAVING MULTI-DIES THE...