containing superconducting materials

Industry

CPC
H01L23/53285

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53285containing superconducting materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for fabrication of superconducting integrated c...
- Patent number 11,957,065
- Issue date Apr 9, 2024
- 1372934 B.C. LTD
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapered connectors for superconductor circuits
- Patent number 11,830,811
- Issue date Nov 28, 2023
- PSIQUANTUM CORP.
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methodology for forming a resistive element in a superconducting st...
- Patent number 11,783,090
- Issue date Oct 10, 2023
- Northrop Grumman Systems Corporation
- Cory Edward Sherman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Airbridge for making connections on superconducting chip, and metho...
- Patent number 11,605,586
- Issue date Mar 14, 2023
- IQM Finland Oy
- Kok Wai Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,569,205
- Issue date Jan 31, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum bit device
- Patent number 11,362,257
- Issue date Jun 14, 2022
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Mutsuo Hidaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical, mechanical, computing, and/or other devices formed of e...
- Patent number 11,289,639
- Issue date Mar 29, 2022
- Ambature, Inc.
- Douglas J. Gilbert
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming superconducting layers and traces
- Patent number 11,114,602
- Issue date Sep 7, 2021
- MICROSOFT TECHNOLOGY LICENSING, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Quantum dot array devices with shared gates
- Patent number 11,101,352
- Issue date Aug 24, 2021
- Intel Corporation
- Hubert C. George
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Tapered connectors for superconductor circuits
- Patent number 11,101,215
- Issue date Aug 24, 2021
- PSIQUANTUM CORP.
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon-via fabrication in planar quantum devices
- Patent number 11,088,310
- Issue date Aug 10, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabrication of superconducting integrated c...
- Patent number 11,038,095
- Issue date Jun 15, 2021
- D-Wave Systems Inc.
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting device with multiple thermal sinks
- Patent number 11,004,763
- Issue date May 11, 2021
- Northrop Grumman Systems Corporation
- Aaron Ashley Hathaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preclean and dielectric deposition methodology for superconductor i...
- Patent number 10,985,059
- Issue date Apr 20, 2021
- Northrop Grumman Systems Corporation
- Brian Paul Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 10,978,425
- Issue date Apr 13, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methodology for forming a resistive element in a superconducting st...
- Patent number 10,936,756
- Issue date Mar 2, 2021
- Northrop Grumman Systems Corporation
- Cory Edward Sherman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 10,937,735
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,833,016
- Issue date Nov 10, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside coupling with superconducting partial TSV for transmon qubits
- Patent number 10,804,454
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Jared Barney Hertzberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Deposition methodology for superconductor interconnects
- Patent number 10,763,419
- Issue date Sep 1, 2020
- Northrop Grumman Systems Corporation
- Christopher F. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling technology for cryogenic link
- Patent number 10,757,835
- Issue date Aug 25, 2020
- RAMBUS INC.
- Frederick A. Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit devices and method of manufacturing the same
- Patent number 10,734,280
- Issue date Aug 4, 2020
- Samsung Electronics Co., Ltd.
- Jeong-hyuk Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-noise microwave amplifier utilizing superconductor-insulator-su...
- Patent number 10,680,567
- Issue date Jun 9, 2020
- INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION NATIONAL INSTITUTES OE NATURA...
- Yoshinori Uzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming superconducting apparatus including superconducti...
- Patent number 10,651,362
- Issue date May 12, 2020
- Microsoft Technology Licensing, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermally isolated ground planes with a superconducting electrical...
- Patent number 10,629,535
- Issue date Apr 21, 2020
- Northrop Grumman Systems Corporation
- Patrick Alan Loney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside coupling with superconducting partial TSV for transmon qubits
- Patent number 10,529,908
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Jared Barney Hertzberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including superconducting metal through-silico...
- Patent number 10,504,842
- Issue date Dec 10, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming superconducting wiring layers with low magnetic n...
- Patent number 10,454,015
- Issue date Oct 22, 2019
- D-Wave Systems Inc.
- Trevor Michael Lanting
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20240138268
- Publication date Apr 25, 2024
- D-Wave Systems Inc.
- Colin C. Enderud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QU...
- Publication number 20240113015
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Vivekananda P. Adiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tapered Connectors for Superconductor Circuits
- Publication number 20240096799
- Publication date Mar 21, 2024
- PsiQuantum Corp.
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTIVE INTERCONNECT STRUCTURE
- Publication number 20240038589
- Publication date Feb 1, 2024
- IMEC vzw
- Anna Yurievna HERR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER AND METHOD FOR FILLING SILICON VIA THEREOF
- Publication number 20230307293
- Publication date Sep 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Produce Buried Nb Lines Surrounded by Ti
- Publication number 20230187355
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Santino Carnevale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20230178519
- Publication date Jun 8, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR NITRIDIZATION OF NIOBIUM TRACES
- Publication number 20230134994
- Publication date May 4, 2023
- Raytheon Company
- Christopher Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
- Publication number 20230022450
- Publication date Jan 26, 2023
- Ambature Inc.
- Douglas J. Gilbert
- G01 - MEASURING TESTING
Information Patent Application
HIGH TEMPERATURE SUPERCONDUCTOR-BASED INTERCONNECT SYSTEMS WITH A L...
- Publication number 20220375869
- Publication date Nov 24, 2022
- Microsoft Technology Licensing, LLC
- Dawson YEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING THROUGH SUBSTRATE VIAS
- Publication number 20220359415
- Publication date Nov 10, 2022
- IQM Finland Oy
- Máté Jenei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tapered Connectors for Superconductor Circuits
- Publication number 20210384126
- Publication date Dec 9, 2021
- PsiQuantum Corp
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20210384406
- Publication date Dec 9, 2021
- D-WAVE SYSTEMS INC.
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS
- Publication number 20210375713
- Publication date Dec 2, 2021
- Northrop Grumman Systems Corporation
- AARON ASHLEY HATHAWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT ARRAY DEVICES WITH SHARED GATES
- Publication number 20210343845
- Publication date Nov 4, 2021
- Intel Corporation
- Hubert C. George
- B82 - NANO-TECHNOLOGY
Information Patent Application
AIRBRIDGE FOR MAKING CONNECTIONS ON SUPERCONDUCTING CHIP, AND METHO...
- Publication number 20210265261
- Publication date Aug 26, 2021
- IQM Finland Oy
- Kok Wai Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methodology for Forming a Resistive Element in a Superconducting St...
- Publication number 20210232710
- Publication date Jul 29, 2021
- Northrop Grumman Systems Corporation
- CORY EDWARD SHERMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20210233896
- Publication date Jul 29, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM BIT DEVICE
- Publication number 20210167271
- Publication date Jun 3, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Mutsuo HIDAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20210118808
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES
- Publication number 20200343434
- Publication date Oct 29, 2020
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...
- Publication number 20200251419
- Publication date Aug 6, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING APPARATUS INCLUDING SUPERCONDUCTING LAYERS AND TRACES
- Publication number 20200243743
- Publication date Jul 30, 2020
- Microsoft Technology Licensing, LLC
- Richard P. Rouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS
- Publication number 20200203245
- Publication date Jun 25, 2020
- Northrop Grumman Systems Corporation
- AARON ASHLEY HATHAWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20200144476
- Publication date May 7, 2020
- D-WAVE SYSTEMS INC.
- Shuiyuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECLEAN AND DIELECTRIC DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR I...
- Publication number 20200144114
- Publication date May 7, 2020
- Northrop Grumman Systems Corporation
- BRIAN PAUL WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20200098695
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE COUPLING WITH SUPERCONDUCTING PARTIAL TSV FOR TRANSMON QUBITS
- Publication number 20200052181
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Jared Barney Hertzberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
- Publication number 20190326501
- Publication date Oct 24, 2019
- Ambature Inc.
- Douglas J. Gilbert
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20190229094
- Publication date Jul 25, 2019
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING

containing superconducting materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reducing loss in stacked quantum devices

Systems and methods for fabrication of superconducting integrated c...

Tapered connectors for superconductor circuits

Methodology for forming a resistive element in a superconducting st...

Hybrid under-bump metallization component

Airbridge for making connections on superconducting chip, and metho...

Reducing loss in stacked quantum devices

Quantum bit device

Electrical, mechanical, computing, and/or other devices formed of e...

Method of forming superconducting layers and traces

Quantum dot array devices with shared gates

Tapered connectors for superconductor circuits

Through-silicon-via fabrication in planar quantum devices

Systems and methods for fabrication of superconducting integrated c...

Superconducting device with multiple thermal sinks

Preclean and dielectric deposition methodology for superconductor i...

Reducing loss in stacked quantum devices

Methodology for forming a resistive element in a superconducting st...

Hybrid under-bump metallization component

Semiconductor device including superconducting metal through-silico...

Backside coupling with superconducting partial TSV for transmon qubits

Deposition methodology for superconductor interconnects

Cooling technology for cryogenic link

Integrated circuit devices and method of manufacturing the same

Low-noise microwave amplifier utilizing superconductor-insulator-su...

Method of forming superconducting apparatus including superconducti...

Thermally isolated ground planes with a superconducting electrical...

Backside coupling with superconducting partial TSV for transmon qubits

Semiconductor device including superconducting metal through-silico...

Method of forming superconducting wiring layers with low magnetic n...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QU...

Tapered Connectors for Superconductor Circuits

SUPERCONDUCTIVE INTERCONNECT STRUCTURE

SILICON WAFER AND METHOD FOR FILLING SILICON VIA THEREOF

Method to Produce Buried Nb Lines Surrounded by Ti

REDUCING LOSS IN STACKED QUANTUM DEVICES

SYSTEMS AND METHODS FOR NITRIDIZATION OF NIOBIUM TRACES

ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...

HIGH TEMPERATURE SUPERCONDUCTOR-BASED INTERCONNECT SYSTEMS WITH A L...

SUPERCONDUCTING THROUGH SUBSTRATE VIAS

Tapered Connectors for Superconductor Circuits

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS

QUANTUM DOT ARRAY DEVICES WITH SHARED GATES

AIRBRIDGE FOR MAKING CONNECTIONS ON SUPERCONDUCTING CHIP, AND METHO...

Methodology for Forming a Resistive Element in a Superconducting St...

REDUCING LOSS IN STACKED QUANTUM DEVICES

QUANTUM BIT DEVICE

HYBRID UNDER-BUMP METALLIZATION COMPONENT

THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES

SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICO...

SUPERCONDUCTING APPARATUS INCLUDING SUPERCONDUCTING LAYERS AND TRACES

SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

PRECLEAN AND DIELECTRIC DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR I...

HYBRID UNDER-BUMP METALLIZATION COMPONENT

BACKSIDE COUPLING WITH SUPERCONDUCTING PARTIAL TSV FOR TRANSMON QUBITS

ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...

REDUCING LOSS IN STACKED QUANTUM DEVICES