controllable by variation of applied mechanical force

Industry

CPC
H01L29/84

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/84controllable by variation of applied mechanical force

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,125,813
- Issue date Oct 22, 2024
- Denso Corporation
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Transistor-based stress sensor and method for determining a gradien...
- Patent number 12,085,462
- Issue date Sep 10, 2024
- Infineon Technologies AG
- Mario Motz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with passive magneto-electric transducer
- Patent number 12,046,685
- Issue date Jul 23, 2024
- Melexis Bulgaria Ltd
- Appo Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for on-chip stress detection
- Patent number 11,978,680
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kenneth William Marr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond-like carbon coating for passive and active electronics
- Patent number 11,961,896
- Issue date Apr 16, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Erik Joseph Timpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,915,924
- Issue date Feb 27, 2024
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for cleaning receptor layer of surface stress sensor
- Patent number 11,796,408
- Issue date Oct 24, 2023
- National Institute for Materials Science
- Genki Yoshikawa
- B08 - CLEANING
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,699,672
- Issue date Jul 11, 2023
- Denso Corporation
- Mariko Fujieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing force sensor with improved dynamic range increase
- Patent number 11,656,134
- Issue date May 23, 2023
- Japan Display Inc.
- Hiroumi Kinjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow sensor, method for manufacturing flow sensor and flow sensor m...
- Patent number 11,629,988
- Issue date Apr 18, 2023
- Hitachi Astemo, Ltd.
- Tsutomu Kono
- G01 - MEASURING TESTING
Information Patent Grant
Localized strain fields in epitaxial layer over cREO
- Patent number 11,611,001
- Issue date Mar 21, 2023
- IQE PLC
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezo-junction device
- Patent number 11,594,574
- Issue date Feb 28, 2023
- International Business Machines Corporation
- Glenn J. Martyna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric sensor, pressure detecting device, manufacturing meth...
- Patent number 11,545,610
- Issue date Jan 3, 2023
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Hu Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angular rate sensor
- Patent number 11,512,958
- Issue date Nov 29, 2022
- Sumitomo Precision Products Co., Ltd.
- Ryohei Uchino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 11,422,043
- Issue date Aug 23, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshitaka Nakamura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Vibration gyroscope
- Patent number 11,397,084
- Issue date Jul 26, 2022
- Denso Corporation
- Motohiro Fujiyoshi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical device having two buried cavities and manu...
- Patent number 11,358,862
- Issue date Jun 14, 2022
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Detection apparatus, fabrication method thereof, array substrate, a...
- Patent number 11,322,624
- Issue date May 3, 2022
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Rui Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device
- Patent number 11,320,324
- Issue date May 3, 2022
- MINEBEA MITSUMI INC.
- Yasuhiro Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensing unit and pressure sensor, pressure sensing device
- Patent number 11,287,333
- Issue date Mar 29, 2022
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Qinghe Wang
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor device and pressure sensor module including same
- Patent number 11,280,692
- Issue date Mar 22, 2022
- Murata Manufacturing Co., Ltd.
- Ryohei Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FET based sensory systems
- Patent number 11,254,559
- Issue date Feb 22, 2022
- Kris Vossough
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a pressure sensitive field effect transist...
- Patent number 11,239,375
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Vladislav Komenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS based devices for harsh media
- Patent number 11,195,772
- Issue date Dec 7, 2021
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS sensor package systems and methods
- Patent number 11,192,777
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Bernhard Winkler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 11,174,152
- Issue date Nov 16, 2021
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 11,150,092
- Issue date Oct 19, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Imanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,127,702
- Issue date Sep 21, 2021
- Denso Corporation
- Mariko Fujieda
- G01 - MEASURING TESTING
Information Patent Grant
Chip module, signal processing method, and electronic equipment
- Patent number 11,099,014
- Issue date Aug 24, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomohiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIAMOND-LIKE CARBON COATING FOR PASSIVE AND ACTIVE ELECTRONICS
- Publication number 20240258400
- Publication date Aug 1, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Erik Joseph Timpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-CONFIGURABLE NANOELECTRONIC COMPONENT STRUCTURE, INTERMEDIAT...
- Publication number 20240145601
- Publication date May 2, 2024
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Sascha Hermann
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230299030
- Publication date Sep 21, 2023
- DENSO CORPORATION
- Kazuaki MAWATARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYNAPTIC DEVICE
- Publication number 20230155037
- Publication date May 18, 2023
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- JungWook LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND-LIKE CARBON COATING FOR PASSIVE AND ACTIVE ELECTRONICS
- Publication number 20230083860
- Publication date Mar 16, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Erik Joseph Timpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
- Publication number 20230016416
- Publication date Jan 19, 2023
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSISTOR-BASED STRESS SENSOR AND METHOD FOR DETERMINING A GRADIEN...
- Publication number 20220236123
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Mario Motz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOGRAPHIC SENSOR WITH THERMAL TRANSISTORS DRIVEN BY THERMO-COUPLES
- Publication number 20220170795
- Publication date Jun 2, 2022
- STMicroelectronics S.r.l.
- Giuseppe BRUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FET BASED SENSORY SYSTEMS
- Publication number 20220153572
- Publication date May 19, 2022
- Kris Vossough
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH PASSIVE MAGNETO-ELECTRIC TRANSDUCER
- Publication number 20210376166
- Publication date Dec 2, 2021
- Melexis Bulgaria Ltd.
- Appo VAN DER WIEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing A Semiconductor Transducer Device With Mult...
- Publication number 20210359143
- Publication date Nov 18, 2021
- Sciosense B.V.
- Alessandro Faes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210335740
- Publication date Oct 28, 2021
- DENSO CORPORATION
- Mariko FUJIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED STRAIN FIELDS IN EPITAXIAL LAYER OVER cREO
- Publication number 20210320214
- Publication date Oct 14, 2021
- Andrew CLARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING RECEPTOR LAYER OF SURFACE STRESS SENSOR
- Publication number 20210215556
- Publication date Jul 15, 2021
- NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Genki YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSING FORCE SENSOR
- Publication number 20210190607
- Publication date Jun 24, 2021
- Japan Display Inc.
- Hiroumi KINJO
- G01 - MEASURING TESTING
Information Patent Application
BENDING SENSING DEVICE
- Publication number 20210181042
- Publication date Jun 17, 2021
- National Chiao Tung University
- Ying-Hao Chu
- G01 - MEASURING TESTING
Information Patent Application
Flow Sensor, Method for Manufacturing Flow Sensor and Flow Sensor M...
- Publication number 20210108953
- Publication date Apr 15, 2021
- Hitachi Automotive Systems, Ltd.
- Tsutomu KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210035799
- Publication date Feb 4, 2021
- DENSO CORPORATION
- Megumi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING UNIT AND PRESSURE SENSOR, PRESSURE SENSING DEVICE
- Publication number 20210018377
- Publication date Jan 21, 2021
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qinghe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL ELECTROSTRICTIVE FIELD EFFECT TRANSISTOR (2D-EFET)
- Publication number 20200335637
- Publication date Oct 22, 2020
- The Penn State Research Foundation
- Saptarshi Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Angular Rate Sensor
- Publication number 20200300628
- Publication date Sep 24, 2020
- Sumitomo Precision Products Co., Ltd.
- Ryohei UCHINO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DETECTION APPARATUS, FABRICATION METHOD THEREOF, ARRAY SUBSTRATE, A...
- Publication number 20200266302
- Publication date Aug 20, 2020
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Rui Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE
- Publication number 20200240857
- Publication date Jul 30, 2020
- MINEBEA MITSUMI INC.
- Yasuhiro KUDO
- G01 - MEASURING TESTING
Information Patent Application
STRESS SENSOR SUITABLE FOR MEASURING MECHANICAL STRESS IN A LAYERED...
- Publication number 20200152804
- Publication date May 14, 2020
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PRESSURE SENSITIVE TRANSISTOR AND PRESSU...
- Publication number 20200105945
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Vladislav Komenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SINGLE MEMBRANE FLOW-PRESSURE SENSING DEVICE
- Publication number 20200049539
- Publication date Feb 13, 2020
- CAMBRIDGE ENTERPRISE LIMITED
- Andrea DE LUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip
- Publication number 20200048075
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CANTILEVER SWITCH
- Publication number 20190393358
- Publication date Dec 26, 2019
- STMicroelectronics, Inc.
- Qing LIU
- B82 - NANO-TECHNOLOGY
Information Patent Application
N-IMPLANT ELECTRICAL SHIELD FOR PIEZO-RESISTOR SENSOR
- Publication number 20190383683
- Publication date Dec 19, 2019
- MELEXIS TECHNOLOGIES NV
- Maliheh RAMEZANI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE FOR USE IN HARSH MEDIA
- Publication number 20190385922
- Publication date Dec 19, 2019
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- H01 - BASIC ELECTRIC ELEMENTS

controllable by variation of applied mechanical force

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing same

Chip package positioning and fixing structure

Transistor-based stress sensor and method for determining a gradien...

Semiconductor device with passive magneto-electric transducer

Method and apparatus for on-chip stress detection

Diamond-like carbon coating for passive and active electronics

Semiconductor device and method for manufacturing the same

Method for cleaning receptor layer of surface stress sensor

Semiconductor device and method for manufacturing same

Pressing force sensor with improved dynamic range increase

Flow sensor, method for manufacturing flow sensor and flow sensor m...

Localized strain fields in epitaxial layer over cREO

Piezo-junction device

Piezoelectric sensor, pressure detecting device, manufacturing meth...

Angular rate sensor

Pressure sensor

Vibration gyroscope

Micro-electro-mechanical device having two buried cavities and manu...

Detection apparatus, fabrication method thereof, array substrate, a...

Sensor device

Pressure sensing unit and pressure sensor, pressure sensing device

Pressure sensor device and pressure sensor module including same

FET based sensory systems

Method for manufacturing a pressure sensitive field effect transist...

CMOS based devices for harsh media

MEMS sensor package systems and methods

Over-under sensor packaging with sensor spaced apart from control chip

Sensor

Semiconductor device and method for manufacturing same

Chip module, signal processing method, and electronic equipment

Patents Applicationslast 30 patents

DIAMOND-LIKE CARBON COATING FOR PASSIVE AND ACTIVE ELECTRONICS

STRESS-CONFIGURABLE NANOELECTRONIC COMPONENT STRUCTURE, INTERMEDIAT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SYNAPTIC DEVICE

DIAMOND-LIKE CARBON COATING FOR PASSIVE AND ACTIVE ELECTRONICS

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

TRANSISTOR-BASED STRESS SENSOR AND METHOD FOR DETERMINING A GRADIEN...

THERMOGRAPHIC SENSOR WITH THERMAL TRANSISTORS DRIVEN BY THERMO-COUPLES

FET BASED SENSORY SYSTEMS

SEMICONDUCTOR DEVICE WITH PASSIVE MAGNETO-ELECTRIC TRANSDUCER

Method of Manufacturing A Semiconductor Transducer Device With Mult...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

LOCALIZED STRAIN FIELDS IN EPITAXIAL LAYER OVER cREO

METHOD FOR CLEANING RECEPTOR LAYER OF SURFACE STRESS SENSOR

PRESSING FORCE SENSOR

BENDING SENSING DEVICE

Flow Sensor, Method for Manufacturing Flow Sensor and Flow Sensor M...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PRESSURE SENSING UNIT AND PRESSURE SENSOR, PRESSURE SENSING DEVICE

TWO-DIMENSIONAL ELECTROSTRICTIVE FIELD EFFECT TRANSISTOR (2D-EFET)

Angular Rate Sensor

DETECTION APPARATUS, FABRICATION METHOD THEREOF, ARRAY SUBSTRATE, A...

SENSOR DEVICE

STRESS SENSOR SUITABLE FOR MEASURING MECHANICAL STRESS IN A LAYERED...

METHOD FOR MANUFACTURING A PRESSURE SENSITIVE TRANSISTOR AND PRESSU...

A SINGLE MEMBRANE FLOW-PRESSURE SENSING DEVICE

Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

INTEGRATED CANTILEVER SWITCH

N-IMPLANT ELECTRICAL SHIELD FOR PIEZO-RESISTOR SENSOR

SEMICONDUCTOR DEVICE FOR USE IN HARSH MEDIA