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Controlled addition of electrolyte components
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C25D21/14
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CHEMISTRY METALLURGY
C25
Electrolytic processing
C25D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR
C25D21/00
Processes for servicing or operating cells for electrolytic coating
Current Industry
C25D21/14
Controlled addition of electrolyte components
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Patents Grants
last 30 patents
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Patent Grant
Method for depositing a chromium or chromium alloy layer and platin...
Patent number
12,006,585
Issue date
Jun 11, 2024
Atotech Deutschland GmbH
Michael Muigg
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Hybrid electro-processing of a metal workpiece
Patent number
11,965,265
Issue date
Apr 23, 2024
The United States of America as represented by the Secretary of the Navy
David Sapiro
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating apparatus and film thickness measuring method for substrate
Patent number
11,906,299
Issue date
Feb 20, 2024
Ebara Corporation
Masaya Seki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
Patent number
11,859,300
Issue date
Jan 2, 2024
Lam Research Corporation
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
Patent number
11,781,233
Issue date
Oct 10, 2023
Ebara Corporation
Junitsu Yamakawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
Patent number
11,767,606
Issue date
Sep 26, 2023
Ebara Corporation
Junitsu Yamakawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Removing bubbles from plating cells
Patent number
11,746,435
Issue date
Sep 5, 2023
Lam Research Corporation
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and device for the galvanic application of a surface coating
Patent number
11,732,373
Issue date
Aug 22, 2023
TOPOCROM SYSTEMS AG
Karl Müll
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating systems and methods with increased metal ion concent...
Patent number
11,686,005
Issue date
Jun 27, 2023
Applied Materials, Inc.
Kwan Wook Roh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electrochemical-deposition apparatuses and associated methods of el...
Patent number
11,680,330
Issue date
Jun 20, 2023
FABRIC8LABS, INC.
Kareemullah Shaik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method of controlling chemical concentration in electrolyte
Patent number
11,668,019
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yung-Chang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film formation device and film formation method for metallic coating
Patent number
11,643,745
Issue date
May 9, 2023
Toyota Jidosha Kabushiki Kaisha
Akira Kato
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating method and plating apparatus
Patent number
11,566,339
Issue date
Jan 31, 2023
Ebara Corporation
Yusuke Tamari
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Filling plating system and filling plating method
Patent number
11,560,640
Issue date
Jan 24, 2023
C. Uyemura & Co., Ltd.
Takuya Okamachi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
Patent number
11,401,623
Issue date
Aug 2, 2022
Lam Research Corporation
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Powder supply apparatus and plating system
Patent number
11,359,304
Issue date
Jun 14, 2022
Ebara Corporation
Shao Hua Chang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for electrodepositing zinc and zinc alloy coatings from an a...
Patent number
11,339,492
Issue date
May 24, 2022
Dr.-Ing. Max Schlotter GmbH & Co. KG
Volker Wohlfarth
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Plating method and plating apparatus
Patent number
11,286,577
Issue date
Mar 29, 2022
Ebara Corporation
Ryuya Koizumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
Patent number
11,230,780
Issue date
Jan 25, 2022
Ebara Corporation
Junitsu Yamakawa
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Removing bubbles from plating cell
Patent number
11,214,887
Issue date
Jan 4, 2022
Lam Research Corporation
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Systems and methods for copper (I) suppression in electrochemical d...
Patent number
11,211,252
Issue date
Dec 28, 2021
Applied Materials, Inc.
Eric J. Bergman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plating apparatus and plating method
Patent number
11,186,919
Issue date
Nov 30, 2021
Murata Manufacturing Co., Ltd.
Takao Hosokawa
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroforming system and method
Patent number
11,142,840
Issue date
Oct 12, 2021
Unison Industries, LLC
Dattu GV Jonnalagadda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and device for the galvanic application of a surface coating
Patent number
11,136,685
Issue date
Oct 5, 2021
TOPOCROM SYSTEMS AG
Karl Müll
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for measuring concentrations of metal ion in electrodepositi...
Patent number
11,124,890
Issue date
Sep 21, 2021
Hong Kong Applied Science and Technology Research Institute Company Limited
Yaofeng Sun
G01 - MEASURING TESTING
Information
Patent Grant
Nanolaminate coatings
Patent number
11,118,280
Issue date
Sep 14, 2021
Modumetal, Inc.
Patrick Lomasney
F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information
Patent Grant
Process for optimizing cobalt electrofill using sacrificial oxidants
Patent number
11,078,591
Issue date
Aug 3, 2021
Lam Research Corporation
Lee J. Brogan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
System for treating solution for use in electroplating application...
Patent number
11,053,604
Issue date
Jul 6, 2021
International Business Machines Corporation
Charles L. Arvin
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for electrically contacting a component by galvanic connecti...
Patent number
11,037,862
Issue date
Jun 15, 2021
Siemens Aktiengesellschaft
Hubert Baueregger
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating method and plating apparatus
Patent number
10,941,504
Issue date
Mar 9, 2021
Ebara Corporation
Yusuke Tamari
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
Method for Coating a Component in a Dipping Bath
Publication number
20240183055
Publication date
Jun 6, 2024
Bayerische Motoren Werke Aktiengesellschaft
Elmar STEGMAYER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
Publication number
20240141540
Publication date
May 2, 2024
LAM RESEARCH CORPORATION
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method for Improving Copper Alloy Electroplating Filling Process
Publication number
20240060205
Publication date
Feb 22, 2024
Shanghai Huali Integrated Circuit Corporation
Yu Bao
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING DEVICE
Publication number
20240003040
Publication date
Jan 4, 2024
MITOMO SEMICON ENGINEERING CO., LTD.
YUJI UCHIUMI
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PREPARATION METHOD, PRODUCT AND APPLICATION OF COMPOSITE MEMBRANE W...
Publication number
20230407515
Publication date
Dec 21, 2023
China Jiliang University
Guoying WEI
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
Publication number
20230272546
Publication date
Aug 31, 2023
Applied Materials, Inc.
Kwan Wook Roh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHODS OF ELECTROPLATING A TARGET ELECTRODE
Publication number
20230272545
Publication date
Aug 31, 2023
FABRIC8LABS, INC.
Kareemullah Shaik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
Publication number
20230265578
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yung-Chang HUANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS
Publication number
20230235474
Publication date
Jul 27, 2023
Applied Materials, Inc.
Joel L. Cannone
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS
Publication number
20230167572
Publication date
Jun 1, 2023
EBARA CORPORATION
Shao Hua Chang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...
Publication number
20230167575
Publication date
Jun 1, 2023
Applied Materials, Inc.
Kwan Wook Roh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE
Publication number
20230152077
Publication date
May 18, 2023
EBARA CORPORATION
Masaya Seki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
LEVELING COMPOUND CONTROL
Publication number
20230144437
Publication date
May 11, 2023
LAM RESEARCH CORPORATION
Matthew A. Rigsby
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROCHEMICAL-DEPOSITION APPARATUSES AND ASSOCIATED METHODS OF EL...
Publication number
20230029051
Publication date
Jan 26, 2023
FABRIC8LABS, INC.
Kareemullah Shaik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
Publication number
20230002926
Publication date
Jan 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yung-Chang HUANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
Publication number
20220333267
Publication date
Oct 20, 2022
LAM RESEARCH CORPORATION
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD FOR SUPPRESSING INCREASE IN ZINC CONCENTRATION OF PLATING SO...
Publication number
20220298668
Publication date
Sep 22, 2022
YUKEN INDUSTRY CO., LTD.
Toshihiro SUGIURA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ANODIZATION APPARATUS AND ANODIZATION METHOD
Publication number
20220251722
Publication date
Aug 11, 2022
KIOXIA Corporation
Mie MATSUO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD FOR DISSOLVING TIN (II) OXIDE
Publication number
20220243349
Publication date
Aug 4, 2022
JX NIPPON MINING & METALS CORPORATION
Koichi Takemoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CONTACT DEVICE AND METHOD FOR PRODUCING THE CONTACT DEVICE
Publication number
20220243355
Publication date
Aug 4, 2022
Tyco Electronics (Shanghai) Co., Ltd.
Daiqiong (Diana) Zhang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
Publication number
20220243356
Publication date
Aug 4, 2022
EBARA CORPORATION
Shao Hua CHANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING METHOD AND PLATING APPARATUS
Publication number
20220170175
Publication date
Jun 2, 2022
EBARA CORPORATION
Ryuya Koizumi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD FOR PREPARING METAL CATALYST
Publication number
20220119970
Publication date
Apr 21, 2022
Pusan National University Industry-University Cooperation Foundation
Hyun Deog YOO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
REMOVING BUBBLES FROM PLATING CELLS
Publication number
20220119977
Publication date
Apr 21, 2022
LAM RESEARCH CORPORATION
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
GAS-SOLID SEPARATION STRUCTURE, FEEDING DEVICE AND ELECTROCHEMICAL...
Publication number
20220097010
Publication date
Mar 31, 2022
BOE TECHNOLOGY GROUP CO., LTD.
Shaodong SUN
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR METALLIC COATING
Publication number
20220081797
Publication date
Mar 17, 2022
Toyota Jidosha Kabushiki Kaisha
Akira Kato
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
A METHOD FOR DEPOSITING A CHROMIUM OR CHROMIUM ALLOY LAYER AND PLAT...
Publication number
20220074063
Publication date
Mar 10, 2022
Michael MUIGG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
Publication number
20220074065
Publication date
Mar 10, 2022
EBARA CORPORATION
Junitsu Yamakawa
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
Publication number
20220074064
Publication date
Mar 10, 2022
EBARA CORPORATION
Junitsu Yamakawa
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ZINC ELECTROLYTE DEVOID OF BORIC ACID AND AMMONIUM FOR THE ELECTROD...
Publication number
20220064814
Publication date
Mar 3, 2022
Dr.-lng. Max Schlötter GmbH & Co. KG
Ralph Krauss
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR