Cooling arrangements using the Peltier effect

Industry

CPC
H01L23/38

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/38Cooling arrangements using the Peltier effect

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reduced dark current photodetector
- Patent number 11,961,936
- Issue date Apr 16, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Header for semiconductor package and semiconductor package
- Patent number 11,955,403
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yasuyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subsea variable speed drive apparatus
- Patent number 11,950,389
- Issue date Apr 2, 2024
- Ana Maria Guimarães Guerreiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating or cooling apparatus-integrated heat sink for a computing d...
- Patent number 11,925,003
- Issue date Mar 5, 2024
- Dell Products L.P.
- Eric Michael Tunks
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure comprising a semiconductor die with a thermoelect...
- Patent number 11,915,994
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superlattice structures for thermoelectric devices
- Patent number 11,908,769
- Issue date Feb 20, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acclimated regulating system for electronics packages
- Patent number 11,901,259
- Issue date Feb 13, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,901,260
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested freezers for storage and transportation of covid vaccine
- Patent number 11,892,204
- Issue date Feb 6, 2024
- Sheetak, Inc.
- Uttam Ghoshal
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Adjustable heat exchanger
- Patent number 11,862,534
- Issue date Jan 2, 2024
- Zonghu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conduction unit, electronic module and heat dissipating device
- Patent number 11,856,856
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized targeted thermoelectric cooling thermal control of integr...
- Patent number 11,837,524
- Issue date Dec 5, 2023
- Raytheon Company
- Paul T. Hartin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,830,787
- Issue date Nov 28, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus comprising an interface unit comprising a conn...
- Patent number 11,829,054
- Issue date Nov 28, 2023
- Canon Kabushiki Kaisha
- Hideaki Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced dark current photodetector
- Patent number 11,817,522
- Issue date Nov 14, 2023
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Techniques for device cooling in an optical sub-assembly
- Patent number 11,789,221
- Issue date Oct 17, 2023
- Aeva, Inc.
- Zhizhong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,791,236
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jaebeom Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,784,108
- Issue date Oct 10, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management device and system
- Patent number 11,768,016
- Issue date Sep 26, 2023
- BLUEXTHERMAL, INC.
- Reza Monazami
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management system for electronic components with thermoelec...
- Patent number 11,765,862
- Issue date Sep 19, 2023
- BAIDU USA LLC
- Huawei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically-adjustable supplemental cooling systems and methods fo...
- Patent number 11,755,081
- Issue date Sep 12, 2023
- Dell Products L.P.
- Mark A. Casparian
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Package architecture including thermoelectric cooler structures
- Patent number 11,756,856
- Issue date Sep 12, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Windowing device and windowing system
- Patent number 11,747,666
- Issue date Sep 5, 2023
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Yongbo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for controlling the temperature of a test sample
- Patent number 11,740,195
- Issue date Aug 29, 2023
- Grabner Instruments Messtechnik GmbH
- Josef Lutz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device for the thermal treatment of test samples
- Patent number 11,732,973
- Issue date Aug 22, 2023
- Roche Molecular Systems, Inc.
- Philipp Zeller
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Annular silicon-embedded thermoelectric cooling devices for localiz...
- Patent number 11,694,942
- Issue date Jul 4, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient and robust system design and control method using thermoe...
- Patent number 11,683,916
- Issue date Jun 20, 2023
- BAIDU USA LLC
- Shuai Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermoelectric coolers combined with phase-change material in integ...
- Patent number 11,676,883
- Issue date Jun 13, 2023
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state thermoelectric cooler in silicon backend layers for fas...
- Patent number 11,664,293
- Issue date May 30, 2023
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integrated thermoelectric cooler
- Patent number 11,658,095
- Issue date May 23, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PELTIER BASED ACTIVE COOLING FOR NOISELESS SYSTEMS WITH EFFICIENT P...
- Publication number 20240102703
- Publication date Mar 28, 2024
- Intel Corporation
- Sreejith Satheesakurup
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER
- Publication number 20240096740
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...
- Publication number 20240063087
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Liang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imaging and Sensing of Thin Layer Using High-Frequency Ultrasonic T...
- Publication number 20240036005
- Publication date Feb 1, 2024
- Geegah LLC
- Amit Lal
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240030098
- Publication date Jan 25, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240011678
- Publication date Jan 11, 2024
- BYD Company Limited
- Yonghui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402441
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT DEVICE AND SYSTEM
- Publication number 20230392833
- Publication date Dec 7, 2023
- BLUEXTHERMAL, INC.
- Reza MONAZAMI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230389428
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOMIMETIC LEAF WETNESS SENSOR AND METHOD OF MANUFACTURE OF THE SAME
- Publication number 20230384254
- Publication date Nov 30, 2023
- The Regents of the University of California
- Marco Rolandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION ELECTRON MICROSCOPE HIGH-RESOLUTION IN SITU FLUID FREE...
- Publication number 20230326712
- Publication date Oct 12, 2023
- XIAMEN UNIVERSITY
- Honggang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED DARK CURRENT PHOTODETECTOR
- Publication number 20230327044
- Publication date Oct 12, 2023
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Application
TRANSISTOR-SCALE THERMOELECTRIC DEVICES FOR REFRIGERATION OF INTEGR...
- Publication number 20230317553
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED RANDOM-ACCESS MEMORY DEVICES WITH REFRIGERATION
- Publication number 20230275067
- Publication date Aug 31, 2023
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR INTEGRATING AN ELECTRONIC INTEGRATED CIRCUIT AND A PH...
- Publication number 20230268249
- Publication date Aug 24, 2023
- Nokia Solutions and Networks Oy
- Alexandre Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES
- Publication number 20230245950
- Publication date Aug 3, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING
- Publication number 20230207421
- Publication date Jun 29, 2023
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING FOR DIE PACKAGES
- Publication number 20230197559
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING IN MICROELECTRONICS
- Publication number 20230197560
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING AND HEATING SYSTEM FOR NON-IDLING VEHICLE
- Publication number 20230113329
- Publication date Apr 13, 2023
- PACCAR Inc
- DAVID MIELKE
- B60 - VEHICLES IN GENERAL
Information Patent Application
ADJUSTABLE HEAT EXCHANGER
- Publication number 20230086458
- Publication date Mar 23, 2023
- Xiamen youbaishi Electronic Technology Co., Ltd
- Zonghu ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THERMOELECTRIC COOLING OF OPTICAL PORT
- Publication number 20230079277
- Publication date Mar 16, 2023
- Dell Products L.P.
- Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY
- Publication number 20230074679
- Publication date Mar 9, 2023
- Microsoft Technology Licensing, LLC
- Minseok OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER REGENERATION IN A MEMORY DEVICE
- Publication number 20230065314
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-DIE TEMPERATURE CONTROL FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASS...
- Publication number 20230060671
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230051881
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE
- Publication number 20230022940
- Publication date Jan 26, 2023
- Sony Semiconductor Solutions Corporation
- Kenichi TAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
QUBIT LEAKAGE ERROR REDUCTIONS
- Publication number 20230024983
- Publication date Jan 26, 2023
- IQM Finland Oy
- Olli Ahonen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230005813
- Publication date Jan 5, 2023
- Sony Semiconductor Solutions Corporation
- YOICHIRO FUJINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME
- Publication number 20220415750
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS

Cooling arrangements using the Peltier effect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reduced dark current photodetector

Header for semiconductor package and semiconductor package

Subsea variable speed drive apparatus

Heating or cooling apparatus-integrated heat sink for a computing d...

Package structure comprising a semiconductor die with a thermoelect...

Superlattice structures for thermoelectric devices

Acclimated regulating system for electronics packages

Thermoelectric semiconductor device and method of making same

Nested freezers for storage and transportation of covid vaccine

Adjustable heat exchanger

Thermal conduction unit, electronic module and heat dissipating device

Localized targeted thermoelectric cooling thermal control of integr...

Thermal management in integrated circuit packages

Electronic apparatus comprising an interface unit comprising a conn...

Reduced dark current photodetector

Techniques for device cooling in an optical sub-assembly

Semiconductor module

Thermal management in integrated circuit packages

Thermal management device and system

Thermal management system for electronic components with thermoelec...

Mechanically-adjustable supplemental cooling systems and methods fo...

Package architecture including thermoelectric cooler structures

Windowing device and windowing system

Device for controlling the temperature of a test sample

Device for the thermal treatment of test samples

Annular silicon-embedded thermoelectric cooling devices for localiz...

Efficient and robust system design and control method using thermoe...

Thermoelectric coolers combined with phase-change material in integ...

Solid state thermoelectric cooler in silicon backend layers for fas...

Bump integrated thermoelectric cooler

Patents Applicationslast 30 patents

PELTIER BASED ACTIVE COOLING FOR NOISELESS SYSTEMS WITH EFFICIENT P...

PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER

THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...

Imaging and Sensing of Thin Layer Using High-Frequency Ultrasonic T...

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THERMAL MANAGEMENT DEVICE AND SYSTEM

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

BIOMIMETIC LEAF WETNESS SENSOR AND METHOD OF MANUFACTURE OF THE SAME

TRANSMISSION ELECTRON MICROSCOPE HIGH-RESOLUTION IN SITU FLUID FREE...

REDUCED DARK CURRENT PHOTODETECTOR

TRANSISTOR-SCALE THERMOELECTRIC DEVICES FOR REFRIGERATION OF INTEGR...

STACKED RANDOM-ACCESS MEMORY DEVICES WITH REFRIGERATION

APPARATUS FOR INTEGRATING AN ELECTRONIC INTEGRATED CIRCUIT AND A PH...

HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES

TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING

THERMOELECTRIC COOLING FOR DIE PACKAGES

THERMOELECTRIC COOLING IN MICROELECTRONICS

THERMOELECTRIC COOLING AND HEATING SYSTEM FOR NON-IDLING VEHICLE

ADJUSTABLE HEAT EXCHANGER

SYSTEMS AND METHODS FOR THERMOELECTRIC COOLING OF OPTICAL PORT

IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY

POWER REGENERATION IN A MEMORY DEVICE

ON-DIE TEMPERATURE CONTROL FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASS...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SENSOR DEVICE

QUBIT LEAKAGE ERROR REDUCTIONS

SEMICONDUCTOR APPARATUS

THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME