Cooling arrangements using the Peltier effect

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/38Cooling arrangements using the Peltier effect

Industries

Patents Grantslast 30 patents

Information Patent Grant
Camera having a reduced dark current photodetector
- Patent number 12,148,855
- Issue date Nov 19, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermoelectric cooling packages
- Patent number 12,125,766
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with actively cooled sensor array
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- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Minseok Oh
- H01 - BASIC ELECTRIC ELEMENTS
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Heat removal from silicon photonics chip using a recessed side-by-s...
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- Mellanox Technologies, Ltd.
- Elad Mentovich
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Information Patent Grant
Methods and systems for dissipating thermal loads in wearable devices
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- Issue date Sep 17, 2024
- EMBR Labs IP LLC
- Matthew J. Smith
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Graphene-based nanosensor for identifying target analytes
- Patent number 12,059,251
- Issue date Aug 13, 2024
- The Trustees of Columbia University In the City of New York
- Qiao Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Accelerated cooling in storage devices
- Patent number 12,050,788
- Issue date Jul 30, 2024
- Western Digital Technologies, Inc.
- Cono J Sammarco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state imaging device
- Patent number 12,034,016
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- Samsung Electronics Co., Ltd.
- Masaki Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing a semiconductor...
- Patent number 12,029,123
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling device based on Peltier effect and manufacturing...
- Patent number 12,027,443
- Issue date Jul 2, 2024
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Jet impingement cooling for high power semiconductor devices
- Patent number 12,002,736
- Issue date Jun 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett Galloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced dark current photodetector
- Patent number 11,961,936
- Issue date Apr 16, 2024
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Header for semiconductor package and semiconductor package
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- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yasuyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subsea variable speed drive apparatus
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- Issue date Apr 2, 2024
- Ana Maria Guimarães Guerreiro
- H01 - BASIC ELECTRIC ELEMENTS
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Heating or cooling apparatus-integrated heat sink for a computing d...
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- Issue date Mar 5, 2024
- Dell Products L.P.
- Eric Michael Tunks
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure comprising a semiconductor die with a thermoelect...
- Patent number 11,915,994
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superlattice structures for thermoelectric devices
- Patent number 11,908,769
- Issue date Feb 20, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acclimated regulating system for electronics packages
- Patent number 11,901,259
- Issue date Feb 13, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,901,260
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested freezers for storage and transportation of covid vaccine
- Patent number 11,892,204
- Issue date Feb 6, 2024
- Sheetak, Inc.
- Uttam Ghoshal
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
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Adjustable heat exchanger
- Patent number 11,862,534
- Issue date Jan 2, 2024
- Zonghu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conduction unit, electronic module and heat dissipating device
- Patent number 11,856,856
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized targeted thermoelectric cooling thermal control of integr...
- Patent number 11,837,524
- Issue date Dec 5, 2023
- Raytheon Company
- Paul T. Hartin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,830,787
- Issue date Nov 28, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus comprising an interface unit comprising a conn...
- Patent number 11,829,054
- Issue date Nov 28, 2023
- Canon Kabushiki Kaisha
- Hideaki Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced dark current photodetector
- Patent number 11,817,522
- Issue date Nov 14, 2023
- Shimon Maimon
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Techniques for device cooling in an optical sub-assembly
- Patent number 11,789,221
- Issue date Oct 17, 2023
- Aeva, Inc.
- Zhizhong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,791,236
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jaebeom Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,784,108
- Issue date Oct 10, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOELECTRIC COOLING FOR PACKAGE LEVEL THERMAL MANAGEMENT
- Publication number 20240363484
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-PACKAGE EMBEDDED COOLING DEVICE
- Publication number 20240332127
- Publication date Oct 3, 2024
- Intel Corporation
- Eng Kwong Lee
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER
- Publication number 20240321677
- Publication date Sep 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jingjing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipation module
- Publication number 20240322106
- Publication date Sep 26, 2024
- CORETRONIC CORPORATION
- SHAO-PENG SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, PACKAGE, AND IMAGING SYSTEM
- Publication number 20240323556
- Publication date Sep 26, 2024
- Sony Semiconductor Solutions Corporation
- JUMPEI KAWANO
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SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES
- Publication number 20240312867
- Publication date Sep 19, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES
- Publication number 20240312866
- Publication date Sep 19, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
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JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
- Publication number 20240312873
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett GALLOWAY
- H01 - BASIC ELECTRIC ELEMENTS
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PELTIER MODULE, ASSEMBLY, AND APPARATUS FOR MASK INSPECTION
- Publication number 20240298082
- Publication date Sep 5, 2024
- Carl Zeiss SMT GMBH
- Lutz Brekerbohm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multistage Thermoelectric Cooler with Phononic Structure
- Publication number 20240276882
- Publication date Aug 15, 2024
- William N. Carr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE ADJUSTMENT DEVICE
- Publication number 20240274492
- Publication date Aug 15, 2024
- KELK LTD.
- Atsushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS CHIPS WITH THERMAL MANAGEMENT FOR A CAVITY-MOUNTED CHIP
- Publication number 20240264374
- Publication date Aug 8, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING ADDITION
- Publication number 20240249995
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING
- Publication number 20240249998
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING HIGH POWER DEVICES
- Publication number 20240243545
- Publication date Jul 18, 2024
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Susant K. PATRA
- H01 - BASIC ELECTRIC ELEMENTS
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POWER MODULE THERMAL MANAGEMENT
- Publication number 20240234238
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- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Chandra S. Namuduri
- H01 - BASIC ELECTRIC ELEMENTS
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CAMERA HAVING A REDUCED DARK CURRENT PHOTODETECTOR
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- Publication date Jul 4, 2024
- Shimon Maimon
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE ADAPTIVE INFORMATION HANDLING SYSTEM
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- Publication date May 30, 2024
- Dell Products L.P.
- Zhuo Ya SHI
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Information Patent Application
NESTED HEATING SYSTEM
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- Publication date May 23, 2024
- Sheetak, Inc.
- Uttam Ghoshal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES
- Publication number 20240162112
- Publication date May 16, 2024
- The Johns Hopkins University
- Rama Venkatasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153843
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PELTIER BASED ACTIVE COOLING FOR NOISELESS SYSTEMS WITH EFFICIENT P...
- Publication number 20240102703
- Publication date Mar 28, 2024
- Intel Corporation
- Sreejith Satheesakurup
- G06 - COMPUTING CALCULATING COUNTING
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PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER
- Publication number 20240096740
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
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THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...
- Publication number 20240063087
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Liang Kuo
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Imaging and Sensing of Thin Layer Using High-Frequency Ultrasonic T...
- Publication number 20240036005
- Publication date Feb 1, 2024
- Geegah LLC
- Amit Lal
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240030098
- Publication date Jan 25, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240011678
- Publication date Jan 11, 2024
- BYD Company Limited
- Yonghui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402441
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT DEVICE AND SYSTEM
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- Publication date Dec 7, 2023
- BLUEXTHERMAL, INC.
- Reza MONAZAMI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230389428
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Cooling arrangements using the Peltier effect

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Camera having a reduced dark current photodetector

Thermoelectric cooling packages

Image sensor with actively cooled sensor array

Heat removal from silicon photonics chip using a recessed side-by-s...

Methods and systems for dissipating thermal loads in wearable devices

Graphene-based nanosensor for identifying target analytes

Accelerated cooling in storage devices

Solid-state imaging device

Semiconductor structure and method of manufacturing a semiconductor...

Integrated cooling device based on Peltier effect and manufacturing...

Thermal management in integrated circuit packages

Jet impingement cooling for high power semiconductor devices

Reduced dark current photodetector

Header for semiconductor package and semiconductor package

Subsea variable speed drive apparatus

Heating or cooling apparatus-integrated heat sink for a computing d...

Package structure comprising a semiconductor die with a thermoelect...

Superlattice structures for thermoelectric devices

Acclimated regulating system for electronics packages

Thermoelectric semiconductor device and method of making same

Nested freezers for storage and transportation of covid vaccine

Adjustable heat exchanger

Thermal conduction unit, electronic module and heat dissipating device

Localized targeted thermoelectric cooling thermal control of integr...

Thermal management in integrated circuit packages

Electronic apparatus comprising an interface unit comprising a conn...

Reduced dark current photodetector

Techniques for device cooling in an optical sub-assembly

Semiconductor module

Thermal management in integrated circuit packages

Patents Applicationslast 30 patents

THERMOELECTRIC COOLING FOR PACKAGE LEVEL THERMAL MANAGEMENT

ON-PACKAGE EMBEDDED COOLING DEVICE

SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER

Heat dissipation module

SOLID-STATE IMAGING DEVICE, PACKAGE, AND IMAGING SYSTEM

SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES

SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES

JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES

PELTIER MODULE, ASSEMBLY, AND APPARATUS FOR MASK INSPECTION

Multistage Thermoelectric Cooler with Phononic Structure

TEMPERATURE ADJUSTMENT DEVICE

PHOTONICS CHIPS WITH THERMAL MANAGEMENT FOR A CAVITY-MOUNTED CHIP

THERMOELECTRIC COOLING ADDITION

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING

SYSTEMS AND METHODS FOR COOLING HIGH POWER DEVICES

POWER MODULE THERMAL MANAGEMENT

CAMERA HAVING A REDUCED DARK CURRENT PHOTODETECTOR

TEMPERATURE ADAPTIVE INFORMATION HANDLING SYSTEM

NESTED HEATING SYSTEM

SUPERLATTICE STRUCTURES FOR THERMOELECTRIC DEVICES

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PELTIER BASED ACTIVE COOLING FOR NOISELESS SYSTEMS WITH EFFICIENT P...

PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER

THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...

Imaging and Sensing of Thin Layer Using High-Frequency Ultrasonic T...

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THERMAL MANAGEMENT DEVICE AND SYSTEM

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE