Copper (Cu) as principal constituent

Industry

CPC
H01L2224/48747

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48747Copper (Cu) as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing semiconductor module...
- Patent number 10,930,616
- Issue date Feb 23, 2021
- Mitsubishi Electric Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation for wire bonding on organic solderability preservati...
- Patent number 10,833,043
- Issue date Nov 10, 2020
- Vitesco Technologies USA, LLC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adding cap to copper passivation flow for electroless plating
- Patent number 10,026,706
- Issue date Jul 17, 2018
- Texas Instruments Incorporated
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,805,937
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for production
- Patent number 9,754,912
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,748,186
- Issue date Aug 29, 2017
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for a component package
- Patent number 9,748,216
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,698,096
- Issue date Jul 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroshige Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit boards
- Patent number 9,648,720
- Issue date May 9, 2017
- Semblant Global Limited
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging a semiconductor device having wires with polymerized insu...
- Patent number 9,378,984
- Issue date Jun 28, 2016
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method for production
- Patent number 9,368,447
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon shield for package stress sensitive devices
- Patent number 9,355,968
- Issue date May 31, 2016
- Maxim Integrated Products, Inc.
- Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,172
- Issue date May 10, 2016
- Panasonic Corporation
- Shigefumi Dohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for interleaved boost converter with co-packaged...
- Patent number 9,324,809
- Issue date Apr 26, 2016
- Avogy, Inc.
- Hemal N. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,245,845
- Issue date Jan 26, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuhiro Kaibara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
- Publication number 20200035639
- Publication date Jan 30, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...
- Publication number 20190198475
- Publication date Jun 27, 2019
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
- Publication number 20180308816
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180233464
- Publication date Aug 16, 2018
- Kabushiki Kaisha Toshiba
- Nobumitsu TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING BOND PADS FROM CORROSION
- Publication number 20170352639
- Publication date Dec 7, 2017
- KNOWLES ELECTRONICS, LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES
- Publication number 20150364431
- Publication date Dec 17, 2015
- Maxim Integrated Products, Inc.
- Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INTEGRATING A START-UP COMPONENT, A CONTROLLER, A...
- Publication number 20150162844
- Publication date Jun 11, 2015
- Zentel Electronics Corp.
- Jun Hsiung HUANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLEMENTING WIRE BONDS
- Publication number 20140264952
- Publication date Sep 18, 2014
- Power Integrations, Inc.
- Jayson M. DENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES
- Publication number 20140239485
- Publication date Aug 28, 2014
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140217567
- Publication date Aug 7, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Koichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20140167292
- Publication date Jun 19, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro MASUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices and Methods for Providing an Electrical Connection
- Publication number 20140151905
- Publication date Jun 5, 2014
- INFINEON TECHNOLOGIES AG
- Michael Sternad
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140124911
- Publication date May 8, 2014
- PANASONIC CORPORATION
- TEPPEI IWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING
- Publication number 20140091465
- Publication date Apr 3, 2014
- TEXAS INSTRUMENTS INCORPORATED
- KAZUNORI HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for a Component Package
- Publication number 20140091471
- Publication date Apr 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES
- Publication number 20140070226
- Publication date Mar 13, 2014
- AVOGY, INC.
- Brian Joel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Copper (Cu) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor module, method for manufacturing semiconductor module...

Laser ablation for wire bonding on organic solderability preservati...

Semiconductor integrated circuit device

Package-on-package (PoP) structure including stud bulbs

Plastic-packaged semiconductor device having wires with polymerized...

Semiconductor device

Package-on-package (PoP) structure including stud bulbs

Contact pads with sidewall spacers and method of making contact pad...

Adding cap to copper passivation flow for electroless plating

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device

Electronic device and method for production

Semiconductor device and method for manufacturing the semiconductor...

Apparatus and method for a component package

Semiconductor device

Method for manufacturing printed circuit boards

Package on-Package (PoP) structure including stud bulbs and method

Semiconductor integrated circuit device

Packaging a semiconductor device having wires with polymerized insu...

Module comprising a semiconductor chip

Electronic device and method for production

Silicon shield for package stress sensitive devices

Semiconductor device

Bonding structure of bonding wire

Localized alloying for improved bond reliability

Method and system for interleaved boost converter with co-packaged...

Device including a semiconductor chip and wires

Submount, encapsulated semiconductor element, and methods of manufa...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...

LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...

Package-On-Package (PoP) Structure Including Stud Bulbs

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

SEMICONDUCTOR MODULE

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD FOR PROTECTING BOND PADS FROM CORROSION

SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES

PACKAGE STRUCTURE INTEGRATING A START-UP COMPONENT, A CONTROLLER, A...

Stackable Package by Using Internal Stacking Modules

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

STACK TYPE SEMICONDUCTOR PACKAGE

SUPPLEMENTING WIRE BONDS

WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

Device Including a Semiconductor Chip and Wires

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Bonded System with Coated Copper Conductor

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Devices and Methods for Providing an Electrical Connection

SEMICONDUCTOR DEVICE

Module Comprising a Semiconductor Chip

LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING

Apparatus and Method for a Component Package

BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE