Copper [Cu] as principal constituent

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H01L2924/17747

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/17747Copper [Cu] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip package assembly
- Patent number 12,266,631
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package assembly
- Patent number 11,637,083
- Issue date Apr 25, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrically insulating thermal interface on the discontinuity of a...
- Patent number 11,049,790
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 11,011,446
- Issue date May 18, 2021
- Nexperia B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,991,637
- Issue date Apr 27, 2021
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,978,379
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,811,343
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor packages, leadframes therefor, and methods o...
- Patent number 10,756,006
- Issue date Aug 25, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,699,990
- Issue date Jun 30, 2020
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with preferred heat dissipating eff...
- Patent number 10,679,965
- Issue date Jun 9, 2020
- ZOWIE TECHNOLOGY CORPORATION
- Chia-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped lead terminals for packaging a semiconductor device for elec...
- Patent number 10,658,284
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,622,276
- Issue date Apr 14, 2020
- Hyundai Motor Company
- Young Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,573,571
- Issue date Feb 25, 2020
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire support for a leadframe
- Patent number 10,529,654
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,485
- Issue date Nov 26, 2019
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 10,483,191
- Issue date Nov 19, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,431,527
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,229,868
- Issue date Mar 12, 2019
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor packages, leadframes therefor, and methods o...
- Patent number 10,199,311
- Issue date Feb 5, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...
- Publication number 20230290738
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20230260958
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20220320038
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20200365494
- Publication date Nov 19, 2020
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...
- Publication number 20200258818
- Publication date Aug 13, 2020
- STMicroelectronics (Tours) SAS
- Samuel MENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...
- Publication number 20200144145
- Publication date May 7, 2020
- Magnachip Semiconductor, Ltd.
- Myung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20200020616
- Publication date Jan 16, 2020
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS
- Publication number 20190385937
- Publication date Dec 19, 2019
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20190172776
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20190122967
- Publication date Apr 25, 2019
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20190043799
- Publication date Feb 7, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device with Plating on Lead Interconnection Poin...
- Publication number 20180350728
- Publication date Dec 6, 2018
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20180350714
- Publication date Dec 6, 2018
- Hyundai Motor Company
- Young Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180331019
- Publication date Nov 15, 2018
- Kabushiki Kaisha Toshiba
- Naohisa OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20180174950
- Publication date Jun 21, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP ASSEMBLIES USING STACKED LEADFRAMES
- Publication number 20180158764
- Publication date Jun 7, 2018
- Intel Corporation
- Cory A. Runyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TWO ENCAPSULANTS
- Publication number 20180096909
- Publication date Apr 5, 2018
- NXP B.V.
- Wanwisa Peerapaisansap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...
- Publication number 20180025965
- Publication date Jan 25, 2018
- Dialog Semiconductor (UK) Limited
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20180016133
- Publication date Jan 18, 2018
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...
- Publication number 20170358510
- Publication date Dec 14, 2017
- Magnachip Semiconductor, Ltd.
- Myung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Leads Package With Improved Contact Pins
- Publication number 20170294367
- Publication date Oct 12, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS WITH POCKET OF LOW PERMITTIVITY MATERIAL TO RE...
- Publication number 20170287822
- Publication date Oct 5, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Jongwon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...
- Publication number 20170278776
- Publication date Sep 28, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flip-chip package assembly

Hermetic package for high CTE mismatch

Electronic device with multi-layer contact and system

Hermetic package for high CTE mismatch

Electronic device with multi-layer contact and system

Flip-chip package assembly

Bottom package exposed die MEMS pressure sensor integrated circuit...

Electrically insulating thermal interface on the discontinuity of a...

Semiconductor device and method of making a semiconductor device

Wafer-level chip-scale package including power semiconductor and ma...

Semiconductor device with island and associated leads

Method of making a wire support leadframe for a semiconductor device

Leadless semiconductor packages, leadframes therefor, and methods o...

Integrated circuit device with plating on lead interconnection poin...

Semiconductor package structure with preferred heat dissipating eff...

Shaped lead terminals for packaging a semiconductor device for elec...

Power module

Wafer-level chip-scale package including power semiconductor and ma...

Wire support for a leadframe

Chip package and a wafer level package

Semiconductor device

Bottom package exposed die MEMS pressure sensor integrated circuit...

Method for producing electronic device with multi-layer contact

Semiconductor device with island and associated leads

Integrated circuit package for assembling various dice in a single...

Method of manufacturing a semiconductor device

Integrated circuit package for assembling various dice in a single...

Method of making a wire support leadframe for a semiconductor device

Die attachment for packaged semiconductor device

Leadless semiconductor packages, leadframes therefor, and methods o...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...

Flip-Chip Package Assembly

Flip-Chip Package Assembly

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL...

WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...

Electronic Device with Multi-Layer Contact and System

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS

Method Of Making A Wire Support Leadframe For A Semiconductor Device

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Method for Producing Electronic Device With Multi-Layer Contact

Integrated Circuit Device with Plating on Lead Interconnection Poin...

POWER MODULE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method Of Making A Wire Support Leadframe For A Semiconductor Device

3D CHIP ASSEMBLIES USING STACKED LEADFRAMES

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

Integrated Circuit Package For Assembling Various Dice In A Single...

SEMICONDUCTOR DEVICE HAVING TWO ENCAPSULANTS

WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...

Flat No-Leads Package With Improved Contact Pins

ELECTRONIC APPARATUS WITH POCKET OF LOW PERMITTIVITY MATERIAL TO RE...

STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...