Copper [Cu] as principal constituent

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H01L2224/05647

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05647Copper [Cu] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
- Patent number 12,368,128
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,119
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded nanoparticles for on-die thermal enhancement of hybrid bon...
- Patent number 12,368,131
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for measuring a magnetic core layer profile in an integrate...
- Patent number 12,363,920
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- W. C. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,362,329
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and method for manufacturing imaging device
- Patent number 12,356,753
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaya Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,354,976
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating same
- Patent number 12,347,765
- Issue date Jul 1, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 12,347,819
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including interconnect-level bonding pads and metho...
- Patent number 12,347,804
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,347,739
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display panel including electrically connected...
- Patent number 12,342,620
- Issue date Jun 24, 2025
- BOE Technology Group Co., Ltd.
- Xue Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure using two oxide layers with different stress leve...
- Patent number 12,334,461
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jorge A. Lubguban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device for improving internal quantum efficiency
- Patent number 12,334,485
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Jin Woo Choi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Piezoelectric materials for on-die thermal enhancement of hybrid bo...
- Patent number 12,334,469
- Issue date Jun 17, 2025
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die surface treatment apparatus and die bonding system including th...
- Patent number 12,327,810
- Issue date Jun 10, 2025
- Semes Co., Ltd.
- Min Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,327,784
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,322,605
- Issue date Jun 3, 2025
- Mitsubishi Electric Corporation
- Motoru Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated chip structure having slotted bond pad...
- Patent number 12,322,715
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
- Patent number 12,322,654
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuanhao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 12,322,718
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 12,315,833
- Issue date May 27, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor within metallization structure
- Patent number 12,315,791
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless bonding layers in semiconductor packages and methods of fo...
- Patent number 12,300,639
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 12,300,670
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239544
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239546
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250239549
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Pierre-Yves PICHON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURELESS SINTERING METHOD FOR THE CONNECTION OF ELECTRONIC COMP...
- Publication number 20250239566
- Publication date Jul 24, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Senthil Kumar BALASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...
- Publication number 20250239545
- Publication date Jul 24, 2025
- Honeywell International Inc.
- Bryan Roger Seppala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
- Publication number 20250239547
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES
- Publication number 20250233086
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...
- Publication number 20250233091
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250226339
- Publication date Jul 10, 2025
- AMAZING COOL TECHNOLOGY CORPORATION
- Hsien-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250226371
- Publication date Jul 10, 2025
- Japan Display Inc.
- Yoshinori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
- Publication number 20250226338
- Publication date Jul 10, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES
- Publication number 20250218988
- Publication date Jul 3, 2025
- Intel Corporation
- Yosuke KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARCHITECTURES WITH HYBRID BONDING
- Publication number 20250220925
- Publication date Jul 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250219000
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250218902
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250210401
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
- Publication number 20250210554
- Publication date Jun 26, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...
- Publication number 20250210564
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PITCH REALIGNMENT FROM BOND PAD METAL PITCH
- Publication number 20250210557
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Darryl Prudich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE DIE TERMINAL WITH BALL DROP SOLDER
- Publication number 20250201748
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jomari Austria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...
- Publication number 20250201768
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS

Copper [Cu] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices with through-substrate interconnects and as...

Device bonding apparatus and method of manufacturing a package usin...

Semiconductor package

Embedded nanoparticles for on-die thermal enhancement of hybrid bon...

Semiconductor device and method of manufacture

Basin-shaped underbump plates and methods of forming the same

Methods for measuring a magnetic core layer profile in an integrate...

Method of fabricating semiconductor package

Imaging device and method for manufacturing imaging device

Semiconductor device and electronic device

Semiconductor structure and method for fabricating same

Semiconductor package having stacked semiconductor chips

Bonded assembly including interconnect-level bonding pads and metho...

Package structure

Semiconductor device

Array substrate and display panel including electrically connected...

Bonding structure using two oxide layers with different stress leve...

Display device for improving internal quantum efficiency

Piezoelectric materials for on-die thermal enhancement of hybrid bo...

Die surface treatment apparatus and die bonding system including th...

Semiconductor package

Semiconductor device and method of manufacturing semiconductor device

Method of forming integrated chip structure having slotted bond pad...

Semiconductor structure, method for forming same, and wafer on wafe...

Bonded structure with interconnect structure

Conductive buffer layers for semiconductor die assemblies and assoc...

Metal-insulator-metal capacitor within metallization structure

Seamless bonding layers in semiconductor packages and methods of fo...

Semiconductor package

Hybrid bond pad structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF

PRESSURELESS SINTERING METHOD FOR THE CONNECTION OF ELECTRONIC COMP...

SEMICONDUCTOR PACKAGE

ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...

SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...

SEMICONDUCTOR PACKAGE

Semiconductor Packages and Methods of Forming Same

PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES

INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...

ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE

Semiconductor Device and Method of Making a Molded IPD-CoW

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

Power Semiconductor Devices Including Shape-Memory Metallization

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES

THREE-DIMENSIONAL MEMORY ARCHITECTURES WITH HYBRID BONDING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME

METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...

COMPONENT PITCH REALIGNMENT FROM BOND PAD METAL PITCH

LOW PROFILE DIE TERMINAL WITH BALL DROP SOLDER

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...