Membership
Tour
Register
Log in
Copper [Cu] as principal constituent
Follow
Industry
CPC
H01L2224/05647
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/05647
Copper [Cu] as principal constituent
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Through-silicon transmission lines and other structures enabled by...
Patent number
11,973,057
Issue date
Apr 30, 2024
Analog Devices, Inc.
Ed Balboni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,973,016
Issue date
Apr 30, 2024
Infineon Technologies Austria AG
Elvir Kahrimanovic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layers and methods of fabricating the same in semico...
Patent number
11,967,573
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsiang-Ku Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a redistribution substrate and a me...
Patent number
11,961,793
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Sang-uk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor device structure with conductive p...
Patent number
11,955,446
Issue date
Apr 9, 2024
NANYA TECHNOLOGY CORPORATION
Yu-Han Hsueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip package structure and manufacturing method thereof
Patent number
11,955,443
Issue date
Apr 9, 2024
Amazing Cool Technology Corp
Shiann-Tsong Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having pixels with the same active layer and method...
Patent number
11,942,025
Issue date
Mar 26, 2024
Samsung Display Co., Ltd.
Jin Wan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,935,871
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertically mounted die groups
Patent number
11,929,348
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with capacitor and method for forming the same
Patent number
11,923,352
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Hsin-Li Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and manufacturing method thereof
Patent number
11,916,050
Issue date
Feb 27, 2024
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Chaode Mo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,916,029
Issue date
Feb 27, 2024
Sumitomo Electric Industries, Ltd.
Mitsuhiko Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
11,894,306
Issue date
Feb 6, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip having multiple functional units and semiconductor structure u...
Patent number
11,894,356
Issue date
Feb 6, 2024
Macronix International Co., Ltd.
Shih-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a resin that seals a rewiring
Patent number
11,894,325
Issue date
Feb 6, 2024
Rohm Co., Ltd.
Manato Kurata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
Patent number
11,894,330
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temperature hierarchy solder bonding
Patent number
11,887,956
Issue date
Jan 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip including a passivation nitride layer in co...
Patent number
11,887,948
Issue date
Jan 30, 2024
STMicroelectronics S.r.l.
Simone Dario Mariani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic power module
Patent number
11,887,910
Issue date
Jan 30, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Kremena Vladimirova
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device and electronic apparatus
Patent number
11,887,950
Issue date
Jan 30, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Takuya Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electric field control for bond pads in semiconductor device package
Patent number
11,881,461
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
Patent number
11,876,066
Issue date
Jan 16, 2024
TANAKA DENSHI KOGYO K.K.
Hiroyuki Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding alignment marks at bonding interface
Patent number
11,876,049
Issue date
Jan 16, 2024
Yangtze Memory Technologies Co., Ltd.
Meng Yan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a metallization structure
Patent number
11,876,041
Issue date
Jan 16, 2024
Infineon Technologies Austria AG
Oliver Blank
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES
Publication number
20240145515
Publication date
May 2, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Swarnal BORTHAKUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
Publication number
20240145317
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Joongwon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136327
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
AENEE JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240136347
Publication date
Apr 25, 2024
ROHM CO., LTD.
Isamu NISHIMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
Publication number
20240136309
Publication date
Apr 25, 2024
Mitsubishi Electric Corporation
Yasunari HINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
Publication number
20240136313
Publication date
Apr 25, 2024
National Yang Ming Chiao Tung University
Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Conductive IC Spacer with Integrated Electrical Isolation
Publication number
20240128210
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Amit Ashara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
Publication number
20240128211
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
Publication number
20240128156
Publication date
Apr 18, 2024
Avago Technologies International Sales Pte. Limited
Sam Karikalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120280
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Kyungdon Mun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
Publication number
20240120301
Publication date
Apr 11, 2024
STMicroelectronics S.r.l
Simone Dario MARIANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120319
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Hyunsoo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Layer-By-Layer Formation Of Through-Substrate Via
Publication number
20240120257
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120299
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
JIHOON KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240120315
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
Publication number
20240120298
Publication date
Apr 11, 2024
Dietrich Bonart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS
Publication number
20240113076
Publication date
Apr 4, 2024
International Business Machines Corporation
Frank Robert Libsch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
Publication number
20240113056
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsing-Kuo Hsia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240113089
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tian Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240113090
Publication date
Apr 4, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Won Myoung KI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
Publication number
20240113005
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240105652
Publication date
Mar 28, 2024
SK HYNIX INC.
Dae Won KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...
Publication number
20240105390
Publication date
Mar 28, 2024
Wolfspeed, Inc.
Kok Meng KAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
Publication number
20240107780
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
Publication number
20240105527
Publication date
Mar 28, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
Publication number
20240105667
Publication date
Mar 28, 2024
TANAKA DENSHI KOGYO K.K.
Shuichi MITOMA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
Publication number
20240105670
Publication date
Mar 28, 2024
CYNTEC CO., LTD.
Chi-Hung Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
Publication number
20240105545
Publication date
Mar 28, 2024
Apple Inc.
Jiongxin Lu
H01 - BASIC ELECTRIC ELEMENTS