covering only portions of the surface to be connected

Industry

CPC
H01L2224/06154

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06154covering only portions of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having improved bonding between display panel and en...
- Patent number 11,678,502
- Issue date Jun 13, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,374
- Issue date Apr 11, 2023
- Renesas Electronics Corporation
- Tatsuaki Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Qubit-detector die assemblies
- Patent number 11,075,293
- Issue date Jul 27, 2021
- Intel Corporation
- Jeanette M. Roberts
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bump structure and fabricating method thereof
- Patent number 10,985,121
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory including pads arranged in parallel
- Patent number 10,665,558
- Issue date May 26, 2020
- Samsung Electronics Co., Ltd.
- Sihong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, production method thereof, and electronic compo...
- Patent number 10,453,780
- Issue date Oct 22, 2019
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 10,163,828
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, production method thereof, and electronic compo...
- Patent number 9,252,087
- Issue date Feb 2, 2016
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having main dummy pattern located in path of stress
- Patent number 8,796,847
- Issue date Aug 5, 2014
- Samsung Electronics Co., Ltd.
- Jong-Joo Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package auto-routing
- Patent number 8,656,333
- Issue date Feb 18, 2014
- Deca Technologies, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, method of manufacturing the same, and camera...
- Patent number 7,576,402
- Issue date Aug 18, 2009
- Sanyo Electric Co., LTD
- Takashi Noma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
DRIVE CHIP AND DISPLAY PANEL
- Publication number 20240038700
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210249627
- Publication date Aug 12, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hyun A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20190115312
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...
- Publication number 20140374912
- Publication date Dec 25, 2014
- John C. Knights
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPO...
- Publication number 20140138706
- Publication date May 22, 2014
- Mitsubishi Electric Corporation
- Rei YONEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Reduced On-Resistance and Top Metal Spre...
- Publication number 20120175688
- Publication date Jul 12, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Rupert Burbidge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FLIP CHIP PACKAGE INCLUDING THE SAME
- Publication number 20120049351
- Publication date Mar 1, 2012
- JONG-JOO LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT
- Publication number 20080088008
- Publication date Apr 17, 2008
- Samsung Electronics Co., Ltd.
- Hyun-A KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of manufacturing the same, and camera...
- Publication number 20070166955
- Publication date Jul 19, 2007
- Sanyo Electric Co., Ltd.
- Takashi Noma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

covering only portions of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive bump of a semiconductor device and fabricating method th...

Display device having improved bonding between display panel and en...

Semiconductor device

Qubit-detector die assemblies

Bump structure and fabricating method thereof

Semiconductor memory including pads arranged in parallel

Electronic circuit, production method thereof, and electronic compo...

Semiconductor device and fabricating method thereof

Electronic circuit, production method thereof, and electronic compo...

Package substrate having main dummy pattern located in path of stress

Integrated circuit package auto-routing

Semiconductor device, method of manufacturing the same, and camera...

Patents Applicationslast 30 patents

DRIVE CHIP AND DISPLAY PANEL

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...

ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPO...

Semiconductor Package with Reduced On-Resistance and Top Metal Spre...

PACKAGE SUBSTRATE AND FLIP CHIP PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT

Semiconductor device, method of manufacturing the same, and camera...