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H01L2224/06165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06165Covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element, apparatus, and chip
- Patent number 12,278,200
- Issue date Apr 15, 2025
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate comprising a binding region having a binding zone a...
- Patent number 12,218,154
- Issue date Feb 4, 2025
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xiaoyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor memory device
- Patent number 11,876,080
- Issue date Jan 16, 2024
- Kioxia Corporation
- Masahiro Yoshihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor memory device
- Patent number 11,410,974
- Issue date Aug 9, 2022
- Kioxia Corporation
- Masahiro Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 11,393,859
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel, and display device
- Patent number 11,355,523
- Issue date Jun 7, 2022
- HKC CORPORATION LIMITED
- Jianfeng Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device substrate, display panel and tiled display comprising arrang...
- Patent number 11,217,606
- Issue date Jan 4, 2022
- Au Optronics Corporation
- Chen-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly and chip
- Patent number 11,164,849
- Issue date Nov 2, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kai Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having singular wire bond on bonding pads
- Patent number 11,056,465
- Issue date Jul 6, 2021
- Intel Corporation
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,770,418
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,573,613
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,515,916
- Issue date Dec 24, 2019
- Samsung Electronics Co., Ltd.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution network of integrated circuit
- Patent number 10,490,502
- Issue date Nov 26, 2019
- Faraday Technology Corp.
- Yi-Yeh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,411,045
- Issue date Sep 10, 2019
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package substrate and chip stack in...
- Patent number 10,283,486
- Issue date May 7, 2019
- Samsung Electronics Co., Ltd.
- Jin-Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with redistribution pads
- Patent number 9,859,204
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Myeong Soon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having a stacked plurality of different sized se...
- Patent number 9,761,563
- Issue date Sep 12, 2017
- Samsung Electronics Co., Ltd.
- Hyung-Lae Eun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package including substrate with recess adjoining side...
- Patent number 9,633,935
- Issue date Apr 25, 2017
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,412,751
- Issue date Aug 9, 2016
- Realtek Semiconductor Corp.
- Ta-Hsun Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having a stacked plurality of different sized se...
- Patent number 9,397,034
- Issue date Jul 19, 2016
- Samsung Electronics Co., Ltd.
- Hyung-Iae Eun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stub minimization using duplicate sets of signal terminals
- Patent number 9,224,431
- Issue date Dec 29, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip package
- Patent number 9,209,124
- Issue date Dec 8, 2015
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369185
- Publication date Nov 16, 2023
- Rohm Co., Ltd.
- Yuto NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...
- Publication number 20220367530
- Publication date Nov 17, 2022
- Ordos Yuansheng Optoelectronics Co., Ltd.
- Yongbo JU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD
- Publication number 20220328453
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP
- Publication number 20220238470
- Publication date Jul 28, 2022
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY AND CHIP
- Publication number 20210265316
- Publication date Aug 26, 2021
- Changxin Memory Technologies, Inc.
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20210202428
- Publication date Jul 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20210167041
- Publication date Jun 3, 2021
- KIOXIA Corporation
- Masahiro YOSHIHARA
- G11 - INFORMATION STORAGE
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
- Publication number 20210043659
- Publication date Feb 11, 2021
- HKC CORPORATION LIMITED
- Jianfeng Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20200373341
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Sungeun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE SUBSTRATE, DISPLAY PANEL AND TILED DISPLAY
- Publication number 20190326327
- Publication date Oct 24, 2019
- AU OPTRONICS CORPORATION
- Chen-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORK OF INTEGRATED CIRCUIT
- Publication number 20190122986
- Publication date Apr 25, 2019
- Faraday Technology Corp.
- Yi-Yeh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180145053
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- JIN-YOUNG JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20180076235
- Publication date Mar 15, 2018
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140328523
- Publication date Nov 6, 2014
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF
- Publication number 20140264793
- Publication date Sep 18, 2014
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSITOR AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20140252416
- Publication date Sep 11, 2014
- KABUSHIKI KAISHA TOSHIBA
- Kazutaka Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS
- Publication number 20140185354
- Publication date Jul 3, 2014
- Invensas Corporation
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Application
MICRO CMOS POWER AMPLIFIER
- Publication number 20140097907
- Publication date Apr 10, 2014
- Sung Man YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140054786
- Publication date Feb 27, 2014
- Xintec Inc.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140054801
- Publication date Feb 27, 2014
- Realtek Semiconductor Corp.
- Ta-Hsun Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130320532
- Publication date Dec 5, 2013
- Xintec Inc.
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...
- Publication number 20130307141
- Publication date Nov 21, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS
- Publication number 20130286707
- Publication date Oct 31, 2013
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-CHIP PACKAGE HAVING A STACKED PLURALITY OF DIFFERENT SIZED SE...
- Publication number 20130147044
- Publication date Jun 13, 2013
- Hyung-lae EUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130093101
- Publication date Apr 18, 2013
- Kabushiki Kaisha Toshiba
- Masateru Saigusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120187575
- Publication date Jul 26, 2012
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor element, apparatus, and chip

Array substrate comprising a binding region having a binding zone a...

Bonded structures

Display device

Semiconductor package including a dummy pad

Array substrate and method for manufacturing the same, and display...

Semiconductor memory device

Electrical interconnect structure using metal bridges to interconne...

Bonded structures

Semiconductor memory device

Image sensor package

Array substrate, display panel, and display device

Device substrate, display panel and tiled display comprising arrang...

Chip assembly and chip

Semiconductor package having singular wire bond on bonding pads

Bonded structures

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Power distribution network of integrated circuit

Display device

Semiconductor package including package substrate and chip stack in...

Semiconductor devices with redistribution pads

Multi-chip package having a stacked plurality of different sized se...

Stacked chip package including substrate with recess adjoining side...

Semiconductor device including asymmetric electrode arrangement

Electronic device

Multi-chip package having a stacked plurality of different sized se...

Stub minimization using duplicate sets of signal terminals

Chip package

Patents Applicationslast 30 patents

BONDED STRUCTURES

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR DEVICE

BONDED STRUCTURES

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD

SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP

CHIP ASSEMBLY AND CHIP

BONDED STRUCTURES

SEMICONDUCTOR MEMORY DEVICE

ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE

IMAGE SENSOR PACKAGE

DEVICE SUBSTRATE, DISPLAY PANEL AND TILED DISPLAY

POWER DISTRIBUTION NETWORK OF INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF

FIELD EFFECT TRANSITOR AND SEMICONDUCTOR DEVICE USING THE SAME

STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS

MICRO CMOS POWER AMPLIFIER

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...

STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS

MULTI-CHIP PACKAGE HAVING A STACKED PLURALITY OF DIFFERENT SIZED SE...

SEMICONDUCTOR DEVICE

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME