covering only the peripheral area of the surface to be connected

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H01L2224/29035

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29035covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control element utilized in device die packages
- Patent number 11,955,406
- Issue date Apr 9, 2024
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,424,553
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 9,691,805
- Issue date Jun 27, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridisation of two microelectronic components using a U...
- Patent number 9,318,453
- Issue date Apr 19, 2016
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 9,275,922
- Issue date Mar 1, 2016
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,136,241
- Issue date Sep 15, 2015
- Yu-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process and bonded structures
- Patent number 8,866,289
- Issue date Oct 21, 2014
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 8,773,583
- Issue date Jul 8, 2014
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process and bonded structures
- Patent number 8,729,685
- Issue date May 20, 2014
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mounting structure of semiconductor package component and manufactu...
- Patent number 8,664,773
- Issue date Mar 4, 2014
- Panasonic Corporation
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for fabricating the same
- Patent number 8,487,437
- Issue date Jul 16, 2013
- Optopac Co., Ltd.
- Peter Elenius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process and bonded structures
- Patent number 8,485,416
- Issue date Jul 16, 2013
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked semiconductor package
- Patent number 8,399,975
- Issue date Mar 19, 2013
- SK Hynix Inc.
- Jong Hyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,207,018
- Issue date Jun 26, 2012
- Infineon Technologies AG
- Horst Theuss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 8,012,801
- Issue date Sep 6, 2011
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,956,448
- Issue date Jun 7, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,879,711
- Issue date Feb 1, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20250081647
- Publication date Mar 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW PACKAGE
- Publication number 20250046746
- Publication date Feb 6, 2025
- Mitsubishi Electric Corporation
- Koji MISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240170360
- Publication date May 23, 2024
- MEDIATEK INC.
- Chun-Yin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20240047491
- Publication date Feb 8, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-WEN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20190371755
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20180122762
- Publication date May 3, 2018
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...
- Publication number 20140284749
- Publication date Sep 25, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...
- Publication number 20120299202
- Publication date Nov 29, 2012
- PANASONIC CORPORATION
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20120292787
- Publication date Nov 22, 2012
- Hynix Semiconductor Inc.
- Jong Hyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120261809
- Publication date Oct 18, 2012
- Yu-Lin YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE
- Publication number 20120199960
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- GLENN ENRICK CALDERON COSUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BONDING PROCESS AND BONDED STRUCTURES
- Publication number 20120112335
- Publication date May 10, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOVEL BONDING PROCESS AND BONDED STRUCTURES
- Publication number 20120097733
- Publication date Apr 26, 2012
- Silex Microsystems AB
- Thorbjörn EBEFORS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOVEL BONDING PROCESS AND BONDED STRUCTURES
- Publication number 20120076715
- Publication date Mar 29, 2012
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20120052627
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Yukio KATAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...
- Publication number 20110279717
- Publication date Nov 17, 2011
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110193231
- Publication date Aug 11, 2011
- OPTOPAC CO., LTD.
- Peter ELENIUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110027942
- Publication date Feb 3, 2011
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20100327463
- Publication date Dec 30, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Temperature control element utilized in device die packages

Seal ring structures and methods of forming same

Seal ring structures and methods of forming same

Electronic element and electronic device comprising the same

Semiconductor devices with underfill control features, and associat...

Seal ring structures and methods of forming same

Semiconductor package

Seal ring structures and methods of forming same

Semiconductor devices with underfill control features, and associat...

Semiconductor device, method for manufacturing the same, and electr...

Method for processing a wafer and wafer structure

Interposer package-on-package structure

Flip-chip hybridisation of two microelectronic components using a U...

Hermetically sealed wafer packages

Bonding pad for thermocompression bonding, process for producing a...

Semiconductor device, method for manufacturing the same, and electr...

Chip package and manufacturing method thereof

Hermetically sealed wafer packages

Bonding process and bonded structures

Semiconductor device, method for manufacturing the same, and electr...

Bonding process and bonded structures

Mounting structure of semiconductor package component and manufactu...

Electronic device package and method for fabricating the same

Bonding process and bonded structures

Stacked semiconductor package

Semiconductor package

Flip chip mounting process and flip chip assembly

Stacked structures and methods of fabricating stacked structures

Stacked structures and methods of fabricating stacked structures

Patents Applicationslast 30 patents

IMAGE SENSOR PACKAGES AND RELATED METHODS

HOLLOW PACKAGE

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

SENSOR PACKAGE STRUCTURE

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

HERMETICALLY SEALED WAFER PACKAGES

MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...

STACKED SEMICONDUCTOR PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE

NOVEL BONDING PROCESS AND BONDED STRUCTURES

NOVEL BONDING PROCESS AND BONDED STRUCTURES

NOVEL BONDING PROCESS AND BONDED STRUCTURES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...

ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES